Data Sheet Rev. 1.24 / April 2015 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors Multi-Market Sensing Platforms Precise and Deliberate ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors Brief Description Benefits The ZSSC3135 is a member of the ZSSC313x family of CMOS integrated circuits designed for automotive/industrial sensor applications. All family members are well suited for highly accurate amplification and sensor-specific correction of resistive bridge sensor signals. An internal 16-bit RISC microcontroller running a correction algorithm compensates sensor offset, sensitivity, temperature drift, and non-linearity of the connected sensor element. The required calibration coefficients are stored by the one-pass calibration procedure in an on-chip EEPROM. The ZSSC3135 is specially designed for piezoresistive bridge sensor elements. The amplification stage with an analog gain of 105 in combination with optional temperature compensation via an external temperature sensor meets or exceeds the requirements of piezoresistive sensor applications. Available Support Adjustable to nearly all resistive bridge sensor types: analog gain of up to 105, maximum overall gain of 420 Sample rate up to 200 Hz ADC resolution 13/14 bit Safety functionality sensor connection External temperature sensor Digital compensation of sensor offset, sensitivity, temperature drift, and non-linearity Output options: ratiometric analog voltage output (5 - 95% maximum, 12.4 bit resolution) or ZACwire™ (digital One-Wire Interface (OWI)) Sensor biasing by voltage High voltage protection up to 33 V Supply current: max. 5.5mA Reverse polarity and short circuit protection Wide operation temperature range: -40 to +150°C Traceability by user-defined EEPROM entries * Note: I2C™ is a trademark of NXP. ** FSO = Full Scale Output. Features Family approach offers the best fitting IC selection to build cost-optimized applications No external trimming components required Low number of external components needed PC-controlled configuration and one-pass/ TM end-of-line calibration via I²C™* or ZACwire interface: simple, cost-efficient, quick, and precise High accuracy: 0.25% FSO** @ -25 to +85°C; 0.5% FSO @ -40 to +125°C Optimized for automotive/industrial environments due to robust protection circuitries, excellent electromagnetic compatibility and AEC-Q100 qualification Evaluation Kits Application Notes Mass Calibration System Physical Characteristics Supply voltage: 4.5 to 5.5 V Operation temperature: -40°C to +125°C (-40°C to +150°C extended temperature range depending on product version) Available in RoHS-compliant JEDEC-SSOP14 package or delivery as die ZSSC3135 Minimum Application Requirements VCC Sensor Module ZSSC3135 OUT GND For more information, contact ZMDI via [email protected]. © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24—April 10, 2015. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors ZSSC3135 Application Example Out / OWI GND C2 100nF 8 VSSE VDDE 7 +4.5V to +5.5V C3 47nF 10 VBN 11 VBR_B 12 VBP R1 C4 C5 ZSSC3135 9 AOUT Sensor Bridge VDD 6 n.c. 5 SCL 4 SCL SDA 3 SDA VSUPP Serial Interface 13 VBR_T VSSA 2 14 IRTEMP VDDA 1 C1 100nF Temperature Sensor Ordering Information (See data sheet section 8 for complete delivery options.) Product Sales Code Description Package ZSSC3135BE1 ZSSC3135 die – tested; temperature range -40 to +150°C Unsawn wafer: add “B” to sales code Die on frame: add “C” to sales code ZSSC3135BA1 ZSSC3135 die – tested; temperature range -40 to +125°C Unsawn wafer: add “B” to sales code Die on frame: add “C” to sales code ZSSC3135BE2 ZSSC3135 SSOP14 – temperature range -40 to +150°C Tube: add “T” to sales code Tape & Reel: add “R” ZSSC3135BA2 ZSSC3135 SSOP14 – temperature range -40 to +125°C Tube: add “T” to sales code Tape & Reel: add “R” ZSSC313xKITV1.1 ZSSC313x Evaluation Kit, revision 1.1 including Evaluation Board, ZSSC3135 IC samples, USB cable (software can be downloaded from the product page www.zmdi.com/zssc3135) Kit ZSSC313x Mass Calibration System V1.1 Modular Mass Calibration System (MSC) for ZSSC313x including MCS boards, cable, connectors (software can be downloaded from the product page www.zmdi.com/zssc3135) Kit Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24—April 10, 2015. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors Contents 1 Electrical Characteristics ............................................................................................................................... 6 1.1. Absolute Maximum Ratings .................................................................................................................... 6 1.2. Operating Conditions .............................................................................................................................. 6 1.3. Electrical Parameters ............................................................................................................................. 7 1.3.1. Supply Current and System Operation Conditions .......................................................................... 7 1.3.2. Analog Front-End (AFE) Characteristics ......................................................................................... 7 2) 1.3.3. Temperature Measurement ........................................................................................................... 7 1.3.4. A/D Conversion ................................................................................................................................ 8 1.3.5. Sensor Check................................................................................................................................... 8 1.3.6. DAC and Analog Output .................................................................................................................. 8 1.3.7. System Response ............................................................................................................................ 9 1.4. Interface Characteristics and EEPROM ............................................................................................... 10 TM 1) 1.4.1. I²C Interface ............................................................................................................................. 10 1) 1.4.2. ZACwire™ One-Wire Interface (OWI) ........................................................................................ 10 1.4.3. EEPROM ........................................................................................................................................ 10 2 Circuit Description ....................................................................................................................................... 11 2.1. Signal Flow ........................................................................................................................................... 11 2.2. Application Modes ................................................................................................................................ 12 2.3. Analog Front-End (AFE) ....................................................................................................................... 12 2.3.1. Programmable Gain Amplifier (PGA) ............................................................................................. 12 2.3.2. Offset Compensation ..................................................................................................................... 13 2.3.3. Measurement Cycle ....................................................................................................................... 13 2.3.4. Analog-to-Digital Converter ............................................................................................................ 14 2.4. Temperature Measurement .................................................................................................................. 15 2.5. System Control and Conditioning Calculation ...................................................................................... 15 2.5.1. General Working Modes ................................................................................................................ 15 2.5.2. Startup Phase ............................................................................................................................... 15 2.5.3. Conditioning Calculation ................................................................................................................ 16 2.6. Analog or Digital Output ....................................................................................................................... 16 2.7. Serial Digital Interface .......................................................................................................................... 17 2.8. Failsafe Features .................................................................................................................................. 17 2.9. High Voltage, Reverse Polarity, and Short Circuit Protection .............................................................. 17 3 Application Circuit Examples ....................................................................................................................... 18 4 Pin Configuration and Package ................................................................................................................... 20 5 ESD Protection ............................................................................................................................................ 21 6 Quality and Reliability .................................................................................................................................. 21 7 Customization .............................................................................................................................................. 21 8 Ordering Information ................................................................................................................................... 21 9 Related Documents ..................................................................................................................................... 22 10 Glossary ...................................................................................................................................................... 22 11 Document Revision History ......................................................................................................................... 24 Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 4 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors List of Figures Figure 2.1 Figure 2.2 Figure 3.1 Figure 3.2 Figure 3.3 Figure 4.1 Block Diagram of the ZSSC3135 ................................................................................................... 11 Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement ........ 13 Application with On-Chip Diode Temperature Sensor ................................................................... 18 Application with External Diode Temperature Sensor ................................................................... 19 Application with External Thermistor ............................................................................................. 19 ZSSC3135 SSOP14 Pin Diagram ................................................................................................. 20 List of Tables Table 1.1 Table 1.2 Table 1.3 Table 1.4 Table 2.1 Table 2.2 Table 3.1 Table 4.1 Data Sheet April 10, 2015 Absolute Maximum Ratings ............................................................................................................. 6 Operating Conditions ....................................................................................................................... 6 Electrical Parameters ....................................................................................................................... 7 Interface Characteristics and EEPROM ........................................................................................ 10 Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges ......................... 12 ADC Resolution versus Output Resolution and Sample Rate ....................................................... 15 External Components for Application Circuit Examples ................................................................ 18 Pin Configuration and Definition .................................................................................................... 20 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 5 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 1 Electrical Characteristics 1.1. Absolute Maximum Ratings Note: The absolute maximum ratings are stress ratings only. The device might not function or be operable above the operating conditions given in section 1.2. Stresses exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses above the recommended operating conditions might affect device reliability. ZMDI does not recommend designing to the “Absolute Maximum Ratings.” Parameters apply in operation temperature range and without time limitations. Table 1.1 Absolute Maximum Ratings No. Parameter Symbol 1) 1.1.1 Supply voltage 1.1.2 Potential at AOUT pin 1) VOUT 1.1.3 Analog supply voltage 1) VDDAAMR 1.1.4 Voltage at all analog and digital IO pins VA_IO VD_IO 1.1.5 Storage temperature TSTG 1) 1.2. VDDEAMR Conditions Min Max Unit To VSSE, refer to section 3 for application circuits -33 33 VDC Referenced to VSSE -33 33 VDC Referenced to VSSA, VDDE - VDDA < 0.35V -0.3 6.5 VDC Referenced to VSSA -0.3 VDDA + 0.3 VDC -55 150 C Refer to the ZSSC313x High Voltage Protection Description for specification and detailed conditions. Operating Conditions All voltages are referenced to VSSA. Table 1.2 Operating Conditions No. Parameter 1.2.1 Ambient temperature 1.2.2 Supply voltage 1.2.3 Bridge resistance 3) 4) Symbol 1) 2) Conditions Min Typ Max Unit TAMB_TQE Extended Temperature Range (TQE) -40 150 C TAMB_TQA Advanced-Performance Temperature Range (TQA) -40 125 C TAMB_TQI Best-Performance Temperature Range (TQI) -25 85 C 5.5 VDC 25 k VDDE 4.5 RBR 2 5.0 1) Maximum operation temperature range depends on product version (refer to section 8). 2) See the temperature profile description in the ZSSC313x Technical Note—Die & Package Dimensions. 3) No measurement in mass production; parameter is guaranteed by design and/or quality observation. 4) Symmetric behavior and identical electrical properties (especially the low pass characteristic) of both sensor inputs of the ZSSC3135 are required. Unsymmetrical conditions of the sensor and/or external components connected to the sensor input pins of the ZSSC3135 can generate a failure in signal operation. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 1.3. Electrical Parameters All parameter values are valid under the operating conditions specified in section 1.2 (special definitions excluded). All voltages referenced to VSSA. Note: See important notes at the end of Table 1.3. Table 1.3 Electrical Parameters No. 1.3.1. Parameter Conditions Min Typ Max Unit 5.5 mA 4 MHz Supply Current and System Operation Conditions 1.3.1.1 Supply current 1.3.1.2 Oscillator frequency 1.3.2. Symbol IS 1) fOSC Without bridge and load current, fOSC 3 MHz Adjustment guaranteed for full temperature range (TAMB_TQE) 2 3 8 275 mV/V Analog Front-End (AFE) Characteristics 1.3.2.1 Input span VIN_SP Analog gain: 105 to 2.8 1.3.2.2 Parasitic differential input 1) offset current IIN_OFF Temperature range TAMB_TQE -10 10 nA Temperature range TAMB_TQI -2 2 nA 1.3.2.3 Common mode input range VIN_CM Depends on gain adjustment; see section 2.3.1 0.29 0.65 VDDA Raw values, without conditioning 700 2700 ppm FS /K 1300 ppm FS / (mV/V) 20 μA 2) 1.3.3. Temperature Measurement 1.3.3.1 Internal temperature diode sensitivity STTSI 1.3.3.2 External temperature diode channel gain ATSED 300 1.3.3.3 External temperature diode bias current ITSED 6 1.3.3.4 External temperature diode 1) input range VTSED 0 1.5 V 1.3.3.5 External temperature resistor channel gain ATSER 1200 3500 ppm FS / (mV/V) 1.3.3.6 External temperature 1) resistor input range VTSER 0 600 mV/V Data Sheet April 10, 2015 10 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 7 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors No. Parameter 1.3.4. A/D Conversion 1.3.4.1 A/D resolution 1.3.4.2 DNL 1.3.4.3 1) Symbol Conditions Min rADC 1) Typ 13 Max Unit 14 Bit DNLADC rADC=13bit, fOSC=3MHz, best fit, complete AFE, range according to 1.3.4.5 0.95 LSB INL TQA INLADC rADC=13bit, fOSC=3MHz, best fit, complete AFE, range according to 1.3.4.5 4 LSB 1.3.4.4 INL TQE INLADC_TQE rADC=13bit, fOSC=3MHz, best fit, complete AFE, range according to 1.3.4.5, temperature range TAMB_TQE 5 LSB 1.3.4.5 ADC input range 0.9 VDDA 1.3.5. VADC_IN 0.1 Sensor Check 1.3.5.1 Sensor connection loss RSCC_min Detection threshold 1.3.5.2 Sensor input short RSSC_short Short detection guaranteed 1.3.5.3 Sensor input no short RSSC_pass Corresponds with minimum sensor output resistance rDAC Analog output, 10-90% 1.3.6. 100 k 0 50 1000 DAC and Analog Output 1.3.6.1 D/A resolution 1.3.6.2 Output current sink and source for VDDE=5V IOUT_SRC/SINK 1.3.6.3 Short circuit current IOUT_max 1.3.6.4 Output signal range VOUT_RANGE 1) 1.3.6.5 Output slew rate 1.3.6.6 Output resistance in diagnostic mode 1.3.6.7 Load capacitance Data Sheet April 10, 2015 1) SROUT ROUT_DM CLOAD 12 Bit VOUT: 5-95%, RLOAD ≥ 2kΩ 2.5 mA VOUT: 10-90%, RLOAD ≥1kΩ 5 mA -25 25 mA With RLOAD ≥ 2k 0.05 0.95 VDDE With RLOAD ≥ 1k 0.1 0.90 VDDE CLOAD < 50nF 0.1 To VDDE or VSSE 3) V/µs Diagnostic range: <4 to 96>%, RLOAD ≥ 2k <8 to 92>%, RLOAD ≥ 1k 82 C3 + CLOAD (refer to section 3) 150 nF © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors No. Parameter Symbol Max Unit -1.5 1.5 LSB Best fit, rDAC=12bit -5 5 LSB Best fit, rDAC=12bit, temperature range TAMB_TQE -8 8 LSB IOUT_LEAK In case of power or ground loss -25 25 µA tSTARTUP 1-step ADC, fOSC=3MHz rADC=14bit) 35 ms tRESPONSE 1-step ADC, fOSC=4MHz, rADC=13bit 17.4 ms 1-step ADC 200 Hz Shorted inputs 10 mV 3 mV 1000 ppm 1.3.6.8 DNL DNLOUT 1.3.6.9 INL TQA INLOUT 1.3.6.10 INL TQE INLOUT_TQE 1.3.6.11 Output leakage current at 150°C 1.3.7. Conditions Min Typ System Response 1) 4) 1.3.7.1 Startup time st (To 1 output, ROM check disabled) 1.3.7.2 Response time (100% input step; refer to Table 2.2) 1.3.7.3 Bandwidth (In comparison to an equivalent analog SSC. Refer to Table 2.2) 1.3.7.4 Analog output noise 1) peak-to-peak VNOISE_PP Analog output noise 1) RMS VNOISE_RMS 1.3.7.6 Ratiometricity error RE 1.3.7.7 Overall failure Deviation from ideal line including INL, gain, offset and temperature errors. No sensor-caused effects. Failure for digital readout shown in parenthesis. 1) 1) 1.3.7.5 BW 8.7 bandwidth 10kHz Shorted inputs bandwidth 10kHz Maximum error for VDDE=5V to 4.5/5.5V fOSC≤3MHz, rADC=13bit, temperature range TAMB_TQI 0.25 (0.1) % FS FOVERALL_TQA fOSC≤3MHz, rADC=13bit, temperature range TAMB_TQA 0.5 (0.25) % FS FOVERALL_TQE fOSC≤3MHz, rADC=13bit, temperature range TAMB_TQE 1.0 (0.5) % FS FOVERALL_TQI 1) No measurement in mass production; parameter is guaranteed by design and/or quality observation. 2) Refer to section 2.4 for important details. 3) Minimum output voltage to VDDE or maximum output voltage to VSSE. 4) Depends on resolution and configuration. Start routine begins approximately 0.8ms after power on. Data Sheet April 10, 2015 13.1 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 9 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 1.4. Interface Characteristics and EEPROM Table 1.4 Interface Characteristics and EEPROM No. 1.4.1. Parameter TM I²C 1.4.1.1 Symbol Interface I²C™ voltage level HIGH 1.4.1.2 I²C™ voltage level LOW Slave output level LOW 1.4.1.4 SDA load capacitance 2) 1.4.1.5 2) SCL clock frequency 1.4.2. Internal pull-up resistor 2) 2) 1.4.1.3 1.4.1.6 2) 1.4.2.2 OWI voltage level LOW 2) Slave output level LOW 2) Start window Typ Max Unit 0.8 VDDA VI²C,LOW VI²C,LOW_OUT Open drain, IOL<2mA fOSC≥2MHz fI²C 2) OWI voltage level HIGH 1.4.2.4 Min CSDA 1.4.2.1 1.4.3. VI²C,HIGH RI²C,PULLUPI ZACwire™ One-Wire Interface (OWI) 1.4.2.3 Conditions 1) 2) 25 0.2 VDDA 0.15 VDDA 400 pF 400 kHz 100 k 1) VOWI,HIGH 0.75 VDDA VOWI,LOW VOWI,LOW_OUT Open drain, IOL<2mA tOWI,STARTWIN At fOSC=3MHz 96 175 0.2 VDDA 0.15 VDDA 455 ms 150 C EEPROM 1.4.3.1 Ambient temperature for 2) EEPROM programming 1.4.3.2 Write cycles 2) 1.4.3.3 Read cycles 2) 3) 1.4.3.4 Data retention 1.4.3.5 Programming time TAMB_EEP nEEP_WRI -40 Write <= 85°C 100 000 Write up to 150°C ≤175°C 8 * 10 tEEP_RETENTION 1300h at 175°C ( = 3000h at 150°C + 27000h at 125°C + 100000h at 55°C ) 15 nEEP_READ 2) 4) 2) 100 tEEP_WRI Per written word 12 8 a ms 1) Refer to the ZSSC313x Functional Description for timing details. 2) No measurement in mass production, parameter is guaranteed by design and/or quality observation. 3) Valid for the dice. Note that the package and the temperature version cause additional restrictions. 4) Over lifetime and valid for the dice. Use the calculation sheet ZMDI Temperature Profile Calculation Sheet for temperature stress calculation. Note that the package and the temperature version cause additional restrictions. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 10 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 2 2.1. Circuit Description Signal Flow The ZSSC3135’s signal path is partly analog and partly digital. The analog section is differential – this means the differential bridge sensor signal is internally handled via two signal lines that are rejected symmetrically around an internal common mode potential (analog ground = VDDA/2). As a result of the differential design, it is possible to amplify positive and negative input signals that are within the common mode range of the signal input. Figure 2.1 Block Diagram of the ZSSC3135 TSEXT PGA MUX EEPROM TS ADC Analog Domain CMC ZACwire™ RAM DAC I2C™ * Digital Data I/O BAMP Analog Output ROM ZSSC3135 Digital Domain * Note: I2C™ is a trademark of NXP. PGA Programmable Gain Amplifier TS On-Chip Temperature Sensor (pn-junction) TSEXT External Temperature Sensor (pn-junction) MUX Multiplexer ADC Analog-to-Digital Converter CMC Calibration Microcontroller ROM Read-Only Memory for Correction Formula and Algorithm RAM Volatile Memory for Calibration Parameters and Configuration EEPROM Non-volatile Memory for Calibration Parameters and Configuration DAC Digital-to-Analog Converter BAMP Output Buffer Amplifier The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The multiplexer (MUX) transmits the signals from either the bridge sensor or the internal or external temperature sensor to the analog-to-digital converter (ADC) in a specific sequence. The ADC converts these signals into digital values. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 11 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors The digital signal conditioning is processed by the calibration microcontroller (CMC). It is based on a correction formula that uses sensor-specific coefficients determined during calibration. The formula is located in ROM, and the sensor-specific coefficients are stored in EEPROM. Depending on the programmed output configuration, the conditioned sensor signal is output as an analog signal or alternatively can be readout via a digital serial interface (I²C™ or ZACwire™). The configuration data and the correction parameters must also be programmed into the EEPROM via the digital interfaces. 2.2. Application Modes For each application, a configuration set must be established by programming the on-chip EEPROM for the following modes: Sensor channel Input range: The gain adjustment of the analog front-end (AFE) with respect to the maximum sensor signal span and the zero point of the A/D conversion must be selected. Resolution/response time: The A/D converter must be configured for resolution. These settings influence the sampling rate and the signal integration time, and thus, the noise immunity. Temperature Temperature measurement: Select the internal or external temperature sensor. 2.3. Analog Front-End (AFE) The analog front-end (AFE) consists of the three-stage programmable gain amplifier (PGA), the multiplexer (MUX), and the analog-to-digital converter (ADC). 2.3.1. Programmable Gain Amplifier (PGA) Table 2.1 shows the adjustable gains, the sensor signal spans, and the valid common mode range. Table 2.1 1) Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges PGA Gain aIN Maximum Span 1) VIN_SP [mV/V] Input Common Mode Range VIN_CM [% VDDA] 105 7.1 29 to 65 70 10.7 29 to 65 52.5 14.3 29 to 65 35 21.4 29 to 65 26.3 28.5 29 to 65 14 53.75 29 to 65 9.3 80 29 to 65 7 107 29 to 65 2.8 267 32 to 57 Recommended maximum internal signal range is 75% of the supply voltage. Span is calculated by the following formula: Span = 0.75 (VBR_T – VBR_B) / Gain. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 12 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 2.3.2. Offset Compensation The ZSSC3135 processes a sensor-offset correction during the digital signal conditioning by the calibration microcontroller (CMC). 2.3.3. Measurement Cycle The measurement cycle is controlled by the CMC. Depending on EEPROM settings, the multiplexer (MUX) selects the following input signals in a defined sequence: Pre-amplified bridge sensor signal Temperature sensor signal Internal offset of the input channel (VOFF) The cycle diagram in Figure 2.2 shows the basic structure of the measurement cycle. After power-on, the startup routine is processed, which performs all required measurements to expedite acquiring an initial valid conditioned sensor output. After the startup routine, the normal measurement cycle runs. Figure 2.2 Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement CTAZ CT Measurement Cycle with Bridge Signal Output BRAZ CFGAPP:BRCNT = 0 Startup BR (1 bridge sensor signal measurement per special measurement) CTAZ BR CT BR CMV BR SSCP BR SSCN BR BRAZ 12 Measurements per Cycle Measurement Cycle Measurement Cycle Phases Main Signals Measurement BR Safety Functions Measurement * Bridge Sensor Measurement BRAZ Bridge Sensor Auto-Zero Measurement Data Sheet April 10, 2015 Calibration Temperature Measurement SSCP Sensor Short Check CTAZ Calibration Temperature SSCN Sensor Short Check CT Auto-Zero Measurement Positive-Biased Measurement Negative-Biased Measurement Analog Output Updated CMV Sensor Common Mode Voltage Measurement Bridge Sensor Signal * Not available for all ZSSC313x products. See Table 1.1 in the ZSSC313x Functional Description. © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 13 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 2.3.4. Analog-to-Digital Converter The A/D converter is implemented using full-differential switched-capacitor technique. Programmable ADC resolutions are rADC=<13, 14>bit. The A/D conversion is integrating, inherently monotone, and insensitive to short and long term instability of the clock frequency. The conversion time tADC depends on the desired resolution and can be roughly calculated by equation (1): t ADC 2rADC fOSC 2 (1) Where rADC Resolution of A/D conversion fOSC Frequency of internal oscillator (refer to 1.3.1) Refer to the ZSSC313x Bandwidth Calculation Sheet for a detailed calculation of sampling time and bandwidth. The result of the A/D conversion is a relative counter result Z corresponding to the following equation: Z 2rADC ( VADC_DIFF VADC_REF RS) (2) Where rADC Resolution of A/D conversion VADC_DIFF Differential ADC input voltage VADC_REF ADC reference voltage as selected by the BRREF bits in the EEPROM configuration word CFGAPP (VVBR_T-VVBR_B if BRREF= 0) or (VVDDA-VVSSA if BRREF=1) * RS Digital ADC Range Shift (RS = 1/16, 1/8, 1/4, or 1/2; controlled by the ADCRS bits in the EEPROM configuration word CFGAFE) * With the RS value, a sensor input signal can be shifted in the optimal input range of the ADC. The condition required for ensuring the specified accuracy, stability, and non-linearity parameters of the analog front-end is that the differential ADC input voltage VADC_DIFF does not exceed the range of 10% to 90% of the ADC reference voltage VADC_REF. This requirement must be met for the whole temperature range and for all sensor tolerances. * Refer to the ZSSC313x Functional Description for more information on EEPROM contents. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 14 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors Table 2.2 ADC Resolution versus Output Resolution and Sample Rate ADC Adjustment 1) 2) 2.4. Output Resolution 1) Sample Rate 2) Averaged Bandwidth 2) rADC [bit] Digital [bit] Analog [bit] fOSC=3MHz [Hz] fOSC=4MHz [Hz] fOSC=3MHz [Hz] fOSC=4MHz [Hz] 13 13 12 345 460 130 172 14 14 12 178 237 67 89 Output resolution does not exceed ADC resolution. PGA gain should be such that the differential ADC input signal uses at least 50% of the ADC input range to ensure maximum achievable output resolution. Refer to the ZSSC313x Bandwidth Calculation Sheet for a detailed calculation of sampling time and bandwidth. Temperature Measurement The ZSSC3135 supports different methods for acquiring temperature data needed for conditioning of the sensor signal. Temperature data can be acquired using an internal pn-junction temperature sensor, an external pn-junction temperature sensor connected to the sensor top potential (VBR_T), or an external resistive half bridge temperature sensor. Refer to the ZSSC313x Functional Description for a detailed explanation of temperature sensor adaptation and adjustment. 2.5. System Control and Conditioning Calculation The system control supports the following tasks/features: 2.5.1. Managing the startup sequence Controlling the measurement cycle regarding to the EEPROM-stored configuration data Sensor signal conditioning (calculation of the 16-bit correction for each measurement signal using the EEPROM-stored conditioning coefficients and the ROM-based formulas) Processing communication requests received via the digital interfaces Performing failsafe tasks and message detected errors by setting diagnostic states General Working Modes ZSSC3135 supports three different working modes: 2.5.2. Normal Operation Mode (NOM) – for continuous processing of signal conditioning Command Mode (CM) – for calibration and access to all internal registers Diagnostic Mode (DM) – for failure messages Startup Phase * After power-on, the startup phase is processed, which includes * Internal supply voltage settling including reset of the circuitry by the power-on reset block (POR). Refer to the ZSSC313x High Voltage Protection Description for power-on/off thresholds. Duration (beginning with VVDDA-VVSSA=0V): 500µs to 2ms; AOUT: high impedance. All timing values are roughly estimated for an oscillator frequency fOSC=3MHz and are proportional to that frequency. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 15 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors System start and configuration, EEPROM readout, and signature check. Duration: ~200µs; AOUT: lower diagnostic range (LDR). Processing the measurement cycle start routine. Duration: 5x A/D conversion time; AOUT behavior depends on configured one-wire communication mode (refer to section 2.6): OWIANA or OWIDIS AOUT: lower diagnostic range (LDR) OWIWIN or OWIENA AOUT: tri-state If an error is detected during the startup phase, the Diagnostic Mode (DM) is activated and the analog output at the AOUT pin remains in the lower diagnostic range. After the startup phase, the continuous running measurement and sensor signal conditioning cycle is started, and analog or digital output of the conditioned sensor signal is activated. If the one-wire communication mode OWIWIN is selected, the OWI startup window expires before analog output is available. 2.5.3. Conditioning Calculation The digitalized value for the bridge signal is processed with a conditioning formula to remove offset and rd temperature dependency and to compensate nonlinearity up to 3 order. The result is a non-negative 15-bit value for the measured bridge sensor signal in the range [0; 1). This value is available for readout via I²C™ or OWI communication. For the analog output, the value is clipped to the programmed output limits. Note: 2.6. The extent of signal deviation that can be compensated by the conditioning calculation depends on the specific sensor signal characteristics. For a rough estimation, assume the following: offset compensation and gain correction are not limited. Note that resolution of the digitally gained signal is determined by the ADC resolution in respect to the dynamic input range used. The temperature correction includes first and second order terms and should be adequate for practically all relevant cases. The non-linearity correction of the sensor signal is possible for second-order up to approximately 30% FS regarding ideal fit and for third-order up to about 20% FS. Overall, the conditioning formula applied is able to reduce the non-linearity of the sensor signal by a factor of 10. Analog or Digital Output The AOUT pin is used for analog output and for one-wire communication (OWI). The latter can be used for digital readout of the conditioned sensor signal and for end-of-line sensor module calibration. The ZSSC3135 supports different modes for the analog output in interaction with OWI communication as selected by EEPROM configuration or by command: OWIENA: Analog output is deactivated; OWI readout of the signal data is enabled. OWIWIN: Analog output starts after the startup phase and after the OWI startup window if OWI communication is not initiated; OWI communication for configuration or for end-of-line calibration can be started during the OWI startup window (maximum ~500ms) by sending the START_CM command. OWIANA: Analog output starts after the startup phase; OWI communication for configuration or for endof-line calibration can be started during the OWI startup window (maximum ~500ms) by sending the START_CM command; for command transmission, the analog output driven at the AOUT pin must be overwritten by the external communication master (AOUT drive capability is current-limited). OWIDIS: Analog output starts after the startup phase; OWI readout of the signal data is disabled. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 16 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors The analog output signal is driven by an offset compensated, rail-to-rail output buffer that is current-limited to prevent damage to the ZSSC3135 in the event of a short circuit between the analog output and power supply or ground. Output resolution of at least 12-bit in the range of 10% to 90% FS is ensured by a 12.4-bit resistor string DAC. 2.7. Serial Digital Interface TM TM The ZSSC3135 includes a serial digital I²C interface and a ZACwire interface for one-wire communication (OWI). The digital interfaces allow configuration and calibration of the sensor module. OWI communication can be used to perform an end-of-line calibration via the analog output pin AOUT of a completely assembled sensor module. The interfaces also provide the readout of the conditioned sensor signal data during normal operation. Refer to the ZSSC313x Functional Description for a detailed description of the serial interfaces and the communication protocols. 2.8. Failsafe Features The ZSSC3135 detects various failures. When a failure is detected, Diagnostic Mode (DM) is activated. DM is indicated by setting the output pin AOUT to the Lower Diagnostic Range (LDR). When using digital serial communication protocols (I²C™ or OWI) to read conditioning results data, the error status is indicated by a specific error code. A watchdog timer controls the proper operation of the microcontroller. The operation of the internal oscillator is monitored by an oscillator-failure detection circuit. EEPROM and RAM content are checked when accessed. Control registers are parity protected. The sensor connection is checked with regard to broken wires or short circuits (sensor connection check, sensor short check). The connection of an external temperature sensor can be monitored by the temperature sensor check. Refer to the ZSSC313x Functional Description for a detailed description of failsafe features and methods of error indication. 2.9. High Voltage, Reverse Polarity, and Short Circuit Protection The ZSSC3135 is designed for 5V power supply operation. The ZSSC3135 and the connected sensor are protected from overvoltage and reverse polarity damage by an internal supply voltage limiter. The analog output AOUT can be connected (short circuit, overvoltage, and reverse polarity) with all potentials in the protection range under all potential conditions at the pins VDDE and VSSE. To guarantee this operation, all external components (see application circuit in section 3) are required. The protection is not time-limited. Refer to the ZSSC313x High Voltage Protection Description for a detailed description of protection cases and conditions. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 17 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 3 Application Circuit Examples The application circuits contain external components that are needed for overvoltage, reverse polarity, and short circuit protection. Note: Also refer to ZSSC313x Technical Note—EMC Design Guidelines and other ZSSC313x application notes available on the ZSSC3135 product web page (www.zmdi.com/zssc3135) for additional application examples and board layout recommendations. Table 3.1 External Components for Application Circuit Examples Symbol Component Min C1 Capacitor 100 C2 Capacitor 100 Capacitor 4 Capacitor 0 C3 1) C4, C5 1) R1 Typ 2) Max Unit 470 nF Remarks nF 47 Resistor 160 nF Value includes the load capacitor C3 and the capacitance of the connection cable. 10 nF Recommended to increase EMI immunity. Value includes the filter capacitor C4 and C5 and the sensor connection line capacitance. kΩ See Figure 3.3 for location. 10 1) Increasing capacitors C3, C4, and C5 increases EMI immunity. 2) Dimensioning is only for example and must be adapted to the requirements of the application. Figure 3.1 Application with On-Chip Diode Temperature Sensor Out / OWI GND C2 100nF 8 VSSE VDDE 7 +4.5V to +5.5V C3 47nF 10 VBN 11 VBR_B 12 VBP C4 Data Sheet April 10, 2015 C5 VDD 6 ZSSC3135 9 AOUT Sensor Bridge VSUPP n.c. 5 SCL 4 SCL SDA 3 SDA Serial Interface 13 VBR_T VSSA 2 14 IRTEMP VDDA 1 C1 100nF © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 18 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors Figure 3.2 Application with External Diode Temperature Sensor Out / OWI GND C2 100nF 8 VSSE VDDE 7 +4.5V to +5.5V C3 47nF 10 VBN 11 VBR_B 12 VBP C4 C5 VDD 6 ZSSC3135 9 AOUT Sensor Bridge VSUPP n.c. 5 SCL 4 SCL SDA 3 SDA Serial Interface 13 VBR_T VSSA 2 14 IRTEMP VDDA 1 C1 100nF Temperature Sensor Figure 3.3 Application with External Thermistor Out / OWI GND C2 100nF 8 VSSE VDDE 7 +4.5V to +5.5V C3 47nF 10 VBN 11 VBR_B 12 VBP R1 C4 PT1000 C5 VDD 6 ZSSC3135 9 AOUT Sensor Bridge VSUPP n.c. 5 SCL 4 SCL SDA 3 SDA Serial Interface 13 VBR_T VSSA 2 14 IRTEMP VDDA 1 C1 100nF Temperature Sensor Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 19 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 4 Pin Configuration and Package Table 4.1 Pin Configuration and Definition Pin No Pin Name Description Remarks 1 VDDA Positive Analog Supply Voltage Internal analog supply 2 VSSA Negative Analog Supply Voltage Internal analog ground 3 SDA I²C™ Serial Data Digital I/O; internal pull-up to VDDA 4 SCL I²C™ Clock Digital input; internal pull-up to VDDA 5 N.C. Not connected 6 VDD Positive Digital Supply Voltage Internal digital supply 7 VDDE Positive External Supply Voltage High voltage analog supply 8 VSSE Negative External Supply Voltage Ground 9 AOUT Analog Output TM and ZACwire Serial Data High voltage analog I/O 10 VBN Negative Input from Sensor Bridge Analog input 11 VBR_B Negative Sensor Bridge Supply Voltage Analog I/O Depending on application circuit, short to VSSA 12 VBP Positive Input from Sensor Bridge Analog input 13 VBR_T Positive Sensor Bridge Supply Voltage Analog I/O Depending on application circuit, short to VDDA 14 IRTEMP External Temperature Sensor Analog I/O The standard package of the ZSSC3135 is an RoHS-compliant SSOP14 “green” package (5.3mm body width) with a lead pitch of 0.65 mm. ZSSC3135 SSOP14 Pin Diagram VSSE VDDE AOUT VDD ZSSC 3135BPPPP LLLLLLLL YYWW Figure 4.1 VBN VBR_B VBP Data Sheet April 10, 2015 14 IRTEMP SCL SDA VSSA 1 VBR_T N.C. VDDA B PPPP LLLLLLLL YYWW Revision Product and Package Code Lot Number Date Code (Year, Work Week) © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 20 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 5 ESD Protection All pins have an ESD protection of >2000V according to the Human Body Model (HBM). The pins VDDE, VSSE and AOUT have an additional ESD protection of >4000V (HBM). ESD protection is tested with devices in SSOP14 packages during product qualification. The ESD test follows the Human Body Model with 1.5kOhm/100pF based on MIL 883, Method 3015.7. 6 Quality and Reliability The ZSSC3135 is qualified according to the AEC-Q100 standard, operating temperature grade 0. A fit rate <5fit (T=55°C, S=60%) is guaranteed. A typical fit rate of the semiconductor technology used is 2.5fit. 7 Customization For high-volume applications that require an upgraded or downgraded functionality compared to the ZSSC3135, ZMDI can customize the circuit design by adding or removing certain functional blocks. Please contact ZMDI for further information. 8 Ordering Information Product Sales Code Description Package ZSSC3135BA2T ZSSC3135 SSOP14 – temperature range -40 to +125°C Tube ZSSC3135BA2R ZSSC3135 SSOP14 – temperature range -40 to +125°C Reel ZSSC3135BA1B ZSSC3135 die – temperature range -40 to +125°C Tested dice on unsawn wafer ZSSC3135BA1C ZSSC3135 die – temperature range -40 to +125°C Tested dice on frame ZSSC3135BE2T ZSSC3135 SSOP14 – temperature range -40 to +150°C Tube ZSSC3135BE2R ZSSC3135 SSOP14 – temperature range -40 to +150°C Reel ZSSC3135BE1B ZSSC3135 die – temperature range -40 to +150°C Tested dice on unsawn wafer ZSSC3135BE1C ZSSC3135 die – temperature range -40 to +150°C Tested dice on frame ZSSC313xKITV1.1 ZSSC313x Evaluation Kit, revision 1.1, including Evaluation Board, Kit ZSSC3135 IC samples, USB cable (software can be downloaded from the product page www.zmdi.com/zssc3135) ZSSC313x Mass Calibration System V1.1 Modular Mass Calibration System (MSC) for ZSSC313x including Kit MCS boards, cable, connectors (software can be downloaded from the product page www.zmdi.com/zssc3135) Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 21 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 9 Related Documents Note: X_xy refers to the current revision of the document. Document File Name ZSSC3135 Feature Sheet ZSSC3135_FeatureSheet_Rev_X_xy.pdf ZSSC313x Functional Description ZSSC313x_FunctionalDescription_Rev_X_xy.pdf ZSSC313x Evaluation Kit Description ZSSC313x_Evaluation_Kit_Description_Rev_X_xy.pdf ZSSC313x Technical Note—EMC Design Guidelines* ZSSC313x_TN_EMC_Design_Guidelines_Rev_X_xy.pdf ZSSC313x Technical Note—High Voltage Protection* ZSSC313x_Tech_Note_HighVoltageProt_Rev_X_xy.pdf ZSSC313x Technical Note Die & Package Dimensions** ZSSC313x_Tech_Note_Die-Dim_Rev_X_xy.pdf ZMDI Wafer Dicing Guidelines ZMDI_Wafer_Dicing_Guidelines_Rev_X_xy.pdf ZSSC313x Temperature Profile Calculation Spread Sheet ZSSC313x_Temperature_Profile_Calculation_Rev_X_xy.xls ZSSC313x Bandwidth Calculation Spread Sheet** ZSSC313x_BandwidthCalculation_Rev_X_xy.xls Visit the ZSSC3135 product page (www.zmdi.com/zssc3135) on ZMDI’s website www.zmdi.com or contact your nearest sales office for the latest version of these documents. * Documents marked with an asterisk (*) require a login account for access on the web. For detailed instructions, visit www.zmdi.com/login-account-setup-procedure. ** Documents marked with a double asterisk (**) are available only on request (see page Error! Bookmark not defined. for contact information). 10 Glossary Term Description ADC Analog-to-Digital Converter AEC Automotive Electronics Council AFE Analog Front-end AOUT Analog Output BAMP Buffer Amplifier BR Bridge Sensor Signal CM Command Mode CMC Calibration Microcontroller CMOS Complementary Metal Oxide Semiconductor DAC Digital-to-Analog Converter DM Diagnostic Mode EEPROM Electrically Erasable Programmable Read-Only Memory Data Sheet © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. April 10, 2015 22 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors Term Description ESD Electrostatic Device LDR Lower Diagnostic Range MUX Multiplexer NOM Normal Operation Mode OWI One-Wire Communication PGA Programmable Gain Amplifier POR Power-on Reset RAM Random-Access Memory RISC Reduced Instruction Set Computer ROM Read-Only Memory SCC Sensor Connection Check SSC Sensor Signal Conditioner or Sensor Short Check depending on context. T Temperature Sensor Signal TS Temperature Sensor Data Sheet © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. April 10, 2015 23 of 24 ZSSC3135 Sensor Signal Conditioner for Piezoresistive Bridge Sensors 11 Document Revision History Revision Date Description 1.00 October 18, 2011 First released revision. 1.10 January 20, 2012 Full revision. 1.20 September 25, 2012 Minor edits. Update for ZMDI contact information. 1.21 February 15, 2013 Updates to specifications in section 1.3.7. Addition of RS factor (ADC Range Shift) to equation (2). Minor edits. Update for ZMD America contact information. 1.22 October 21, 2013 Update for available part codes. Update for contact information and imagery for cover and header. Update for related documents. Minor edits for clarity. 1.23 April 21, 2014 Update to description for kits: software is no longer included in kits. It is downloaded from the product page www.zmdi.com/zssc3135. Update for kit revision. Update for cover imagery, contact information, and related documents. 1.24 April 10, 2015 Update for contact information. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Data Sheet April 10, 2015 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 24 of 24