XCL210 Series
ETR28009-000a4
50mA/200mA Inductor Built-in Step-Down “micro DC/DC” Converters
Preliminary
☆GreenOperationCompatible
■GENERAL DESCRIPTION
The XCL210 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one
tiny package (2.0mm×2.5mm, h=1.0mm). An internal coil simplifies the circuit and enables minimization of noise and other
operational trouble due to the circuit wiring. A wide operating voltage range of 2.0V to 6.0V enables support for applications that
require an internally fixed output voltage from 1.0V to 4.0V in increments of 0.1V.
During stand-by, all circuits are shutdown to reduce currentconsumption to as low as 0.1μA or less.
With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF when
input voltage becomes UVLO ditect Voltage or lower.
The XCL210 integrate CL discharge function which enables the electric charge at the output capacitor CL to be discharged via
the internal discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage
quickly returns to the VSS level as a result of this function.
■FEATURES
■APPLICATIONS
●
Wearable Devices
●
Smart meters
●
Bluetooth units
●
Energy Harvest devices
●
Back up power supply circuits
●
Portable game consoles
●
Devices with 1 Lithium cell
Input Voltage
Output Voltage
Control Methods
Output Current
:
:
:
:
Supply Current
Function
:
:
:
Capacitor
:
:
2.0V～6.0V
1.0V～4.0V (±2.0%, 0.1V step increments)
PFM control
200mA(XCL210A/XCL210C)
50mA(XCL210B/XCL210D)
0.5μA
93% (VIN=3.6V,VOUT=3.0V/100μA)
UVLO
Short Circuit Protection
CL Discharge
Low ESR Ceramic Capacitor
:
-40℃～+85℃
:
CL-2025-02
:
EU RoHS Compliant, Pb Free
High Efficiency
Operating
Ambient
Temperature
Packages
Environmentally
Friendly
■TYPICAL APPLICATION CIRCUIT
■ TYPICAL PERFORMANCE
CHARACTERISTICS
XCL210B301GR-G(VOUT=3.0V)
7
CL
50mA 22μF
1 Lx
VIN 6
2 GND
NC 5
3 VOUT
CE 4
VIN
CIN
10μF
8
1/19
XCL210 series
Preliminary
■BLOCK DIAGRAM
L1
L2
Inductor
VOUT
Short
Protection
CFB
R1
PFM
Comparator
Current
Sense
CL
Discharge
R2
Vref
PFM
Controller
CE
Synch
Buffer
Drive
Lx
CE Controller Logic
VDD
UVLO
VIN Start Up
Controller
VIN
GND
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
XCL210A and B type do not have CL Discharge function.
■PRODUCT CLASSIFICATION
●Ordering information
XCL210①②③④⑤⑥-⑦
DESIGNATOR
(*1)
ITEM
SYMBOL
①
Product Type
A
B
C
D
②③
Output Voltage
10～40
④
Fixed number
1
⑤⑥-⑦(*1)
Package (Order Unit)
GR-G
DESCRIPTION
IOUT=200mA , Without CL Auto Discharge
IOUT=50mA Without CL Auto Discharge
IOUT=200mA , With CL Auto Discharge
IOUT=50mA, With CL Auto Discharge
Output Voltage
e.g. VOUT=1.8V ⇒ ②=1、③=8
Fixed number
CL-2025-02（3,000pcs/Reel）
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.。
■PIN CONFIGURATION
L1
7
VIN
6
1
Lx
NC
5
2
GN D
CE
4
3
VOUT
8
L2
(BOTTOM VIEW)
2/19
* The dissipation pad for the CL-2025-02 package should be solder-plated in
recommended mount pattern and metal masking so as to enhance mounting
strength and heat release.
The mount pattern should be connected to GND pin (No.2).
XCL210
Preliminary
Series
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
LX
Switching
2
GND
Ground
3
VOUT
Output Voltage
4
CE
Chip Enable
5
NC
Ground
6
VIN
Power Input
7
L1
Inductor Electrodes
8
L2
Inductor Electrodes
■CE PIN FUNCTION
PIN NAME
CE
SIGNAL
STATUS
H
Operation (ALLSeries)
L
Standby (ALL Series)
* Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25˚C
PARAMETER
VIN Pin Voltage
SYMBOL
RATINGS
VIN
-0.3 ~ +7.0
UNITS
V
(*1)
V
LX Pin Voltage
VLX
-0.3 ~ VIN+0.3 or +7.0
VOUT Pin Voltage
VOUT
-0.3 ~ VIN+0.3 or +7.0 (*1)
V
CE Pin Voltage
VCE
-0.3 ~ +7.0
V
LX Pin Current
ILX
1000
mA
Power Dissipation
Pd
1000
mW
Operating Ambient Temperature
Topr
-40 ~ +85
˚C
Storage Temperature
Tstg
-55 ~ +125
˚C
* All voltages are described based on the GND.
(*1)
The maximum value is the lower of either VIN + 0.3 or +7.0.
3/19
XCL210 series
Preliminary
■ELECTRICAL CHARACTERISTICS
●XCL210Axx1GR-G, without CL discharge function
PARAMETER
SYMBOL
Input Voltage
VIN
Output Voltage
UVLO Release
Voltage
VOUT(E) (*2)
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.0
-
6.0
V
①
V
②
Resistor connected with LX pin. Voltage which LX pin
E1
changes “L” to “H” level while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E)
Voltage which LX pin changes “L” to “H” level while
1.65
1.80
1.95
V
②
0.11
0.15
0.24
V
②
μA
③
VIN is increasing.
UVLO Hysteresis
Voltage
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VHYS(E)
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
Supply Current
Iq
Standby Current
ISTB
LX SW “H” Leak
Current
LX SW “L” Leak
Current
PFM Switching
Current
Maximum
Duty Ratio
(*3)
Efficiency (*4)
VIN=VCE=VOUT(T)+0.5V (*1), VIN=2.0V, if VOUT(T)≦1.5V
(*1)
E2
, VOUT=VOUT(T)+0.5V (*1), LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1
1.0
μA
③
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1
1.0
μA
③
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1
1.0
μA
③
260
330
400
mA
①
100
-
-
%
②
-
93
-
%
①
IPFM
MAXDTY
EFFI
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(Ｔ)×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
VIN=VCE=5.0V, VOUT(T)=4.0V (*1), IOUT=30mA.
(*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=3.3V
, IOUT=30mA.
-
93
-
%
①
Efficiency (*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
87
-
%
①
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
-
0.4
0.65
Ω
④
RLXN
VIN=VCE=5.0V.
-
0.4 (*6)
-
Ω
-
-40℃≦Topr≦85℃.
-
±100
-
ppm/℃
②
Efficiency
LX SW “Pch”
ON Resistance (*5)
LX SW “Nch”
ON Resistance
Output Voltage
Temperature
Characteristics
∆VOUT/
(VOUT・∆Topr)
(*1)
VOUT=0V. Resistor connected with LX pin.
CE “High” Voltage
VCEH
Voltage which LX pin changes “L” to “H” level while
1.2
-
6.0
V
⑤
GND
-
0.3
V
⑤
VCE=0.2→1.5V.
VOUT=0V. Resistor connected with LX pin.
CE “Low” Voltage
VCEL
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
CE “High” Current
ICEH
VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
CE “Low” Current
ICEL
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
0.4
0.5
0.6
V
②
Short Protection
Threshold Voltage
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V→0V(*1).
Inductance Value
L
(Coil) Rated Current
IDC_L
Test Frequency=1MHz
-
8.0
-
μH
∆T=+40℃
-
600
-
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1)
VOUT(T)=Nominal Output Voltage
(*2)
VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3)
(*4)
Not applicable to the products with VOUT(T) < 2.2V since it is out of operational volatge range.
EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5)
LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6)
Designed value
4/19
XCL210
Preliminary
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCL210Bxx1GR-G, without CL discharge function
PARAMETER
SYMBOL
Input Voltage
VIN
Output Voltage
VOUT(E) (*2)
UVLO Release
Voltage
Ta=25˚C
Ta=25˚C
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.0
-
6.0
V
①
V
②
Resistor connected with LX pin.Voltage which LX pin
E1
changes “L” to “H” level while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E)
Voltage which LX pin changes “L” to “H” level while
1.65
1.80
1.95
V
②
0.11
0.15
0.24
V
②
μA
③
VIN is increasing.
UVLO Hysteresis
Voltage
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VHYS(E)
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
Supply Current
Iq
Standby Current
ISTB
LX SW “H” Leak
Current
LX SW “L” Leak
Current
PFM Switching
Current
Maximum
Duty Ratio
(*3)
Efficiency (*4)
VIN=VCE=VOUT(T)+0.5V (*1),VIN=2.0V, if VOUT(T)≦1.5V (*1),
E2
VOUT=VOUT(T)+0.5V (*1), LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1
1.0
μA
③
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1
1.0
μA
③
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1
1.0
μA
③
115
180
250
mA
100
-
-
%
②
-
95
-
%
①
IPFM
MAXDTY
EFFI
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(Ｔ)×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
VIN=VCE=5.0V,VOUT(T)=4.0V (*1), IOUT=30mA.
(*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=3.3V
, IOUT=30mA.
-
95
-
%
①
Efficiency (*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
89
-
%
①
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
-
0.4
0.65
Ω
④
RLXN
VIN=VCE=5.0V.
-
0.4 (*6)
-
Ω
-
-40℃≦Topr≦85℃.
-
±100
-
ppm/℃
②
1.2
-
6.0
V
⑤
GND
-
0.3
V
⑤
Efficiency
LX SW “Pch”
ON Resistance (*5)
LX SW “Nch”
ON Resistance
Output Voltage
Temperature
Characteristics
∆VOUT/
(VOUT・∆Topr)
(*1)
①
VOUT=0V. Resistor connected with LX pin.
CE “High” Voltage
VCEH
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
VOUT=0V. Resistor connected with LX pin.
CE “Low” Voltage
VCEL
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
CE “High” Current
ICEH
VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
CE “Low” Current
ICEL
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
0.4
0.5
0.6
V
②
Short Protection
Threshold Voltage
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
VOUT=VOUT(T)+0.1V→0V(*1).
Inductance Value
L
(Coil) Rated Current
IDC_L
Test Frequency=1MHz
-
8.0
-
μH
∆T=+40℃
-
600
-
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1)
VOUT(T)=Nominal Output Voltage
(*2)
VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3)
Not applicable to the products with VOUT(T) < 2.2V since it is out of operational volatge range.
(*4)
EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5)
LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6)
Designed value
5/19
XCL210 series
Preliminary
■ELECTRICAL CHARACTERISTICS (Continued)
●XCL210Cxx1GR-G, with CL Discharge Function
PARAMETER
SYMBOL
Input Voltage
VIN
Output Voltage
UVLO Release
Voltage
VOUT(E) (*2)
Ta=25˚C
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.0
-
6.0
V
①
V
②
Resistor connected with LX pin. Voltage which LX pin
E1
changes “L” to “H” level while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E)
Voltage which LX pin changes “L” to “H” level while
1.65
1.80
1.95
V
②
0.11
0.15
0.24
V
②
μA
③
VIN is increasing.
UVLO Hysteresis
Voltage
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VHYS(E)
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
Supply Current
Iq
Standby Current
ISTB
LX SW “H” Leak
Current
LX SW “L” Leak
Current
PFM Switching
Current
Maximum
Duty Ratio
(*3)
VIN=VCE=VOUT(T)+0.5V (*1),VIN=2.0V, if VOUT(T)≦1.5V (*1),
E2
VOUT=VOUT(T)+0.5V (*1), LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1
1.0
μA
③
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1
1.0
μA
③
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1
1.0
μA
③
260
330
400
mA
①
100
-
-
%
②
IPFM
MAXDTY
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(Ｔ)×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
Efficiency (*4)
EFFI
VIN=VCE=5.0V, VOUT(T)=4.0V (*1), IOUT=30mA.
-
93
-
%
①
Efficiency (*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
-
93
-
%
①
-
87
-
%
①
Efficiency
(*4)
LX SW “Pch”
ON Resistance (*5)
LX SW “Nch”
ON Resistance
Output Voltage
Temperature
Characteristics
(*1)
EFFI
VIN=VCE=3.6V, VOUT(T)=1.8V
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
-
0.4
0.65
Ω
④
RLXN
VIN=VCE=5.0V.
-
0.4 (*6)
-
Ω
-
-40℃≦Topr≦85℃.
-
±100
-
ppm/℃
②
1.2
-
6.0
V
⑤
GND
-
0.3
V
⑤
VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
0.4
0.5
0.6
V
②
55
80
105
Ω
③
-
8.0
-
μH
∆VOUT/
(VOUT・∆Topr)
, IOUT=30mA.
VOUT=0V. Resistor connected with LX pin.
CE “High” Voltage
VCEH
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
VOUT=0V. Resistor connected with LX pin.
CE “Low” Voltage
VCEL
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
CE “High” Current
ICEH
CE “Low” Current
ICEL
Short Protection
Threshold Voltage
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V→0V(*1).
CL Discharge
RDCHG
Inductance Value
L
VIN=VOUT=5.0V, VCE=0V, LX=Open.
Test Frequency=1MHz
(Coil) Rated Current
IDC_L
600
mA
∆T=+40℃
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3)
Not applicable to the products with VOUT(T) < 2.2V since it is out of operational volatge range.
(*4)
EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6)
Designed value
6/19
XCL210
Preliminary
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25˚C
●XCL210Dxx1GR-G, with CL Discharge Function
PARAMETER
SYMBOL
Input Voltage
VIN
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.0
-
6.0
V
①
V
②
Resistor connected with LX pin. Voltage which LX
Output Voltage
VOUT(E) (*2)
pin changes “L” to “H” level while VOUT is
E1
decreasing.
UVLO Release
Voltage
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E)
Voltage which LX pin changes “L” to “H” level
1.65
1.80
1.95
V
②
0.11
0.15
0.24
V
②
μA
③
while VIN is increasing.
UVLO Hysteresis
Voltage
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VHYS(E)
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
VIN=VCE=VOUT(T)+0.5V (*1),
Supply Current
Iq
VIN=2.0V, if VOUT(T)≦1.5V (*1),
E2
VOUT=VOUT(T)+0.5V (*1), LX=Open.
Standby Current
LX SW “H” Leak
Current
LX SW “L” Leak
Current
PFM Switching Current
Maximum
Duty Ratio (*3)
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1
1.0
μA
③
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1
1.0
μA
③
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1
1.0
μA
③
115
180
250
mA
100
-
-
%
②
IPFM
MAXDTY
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(Ｔ)×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
①
Efficiency (*4)
EFFI
VIN=VCE=5.0V,VOUT(T)=4.0V (*1), IOUT=30mA.
-
95
-
%
①
(*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
-
95
-
%
①
Efficiency (*4)
EFFI
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
89
-
%
①
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
-
0.4
0.65
Ω
④
RLXN
VIN=VCE=5.0V.
-
0.4 (*6)
-
Ω
-
-40℃≦Topr≦85℃.
-
±100
-
ppm/℃
②
1.2
-
6.0
V
⑤
GND
-
0.3
V
⑤
Efficiency
LX SW “Pch”
ON Resistance (*5)
LX SW “Nch”
ON Resistance
Output Voltage
Temperature
Characteristics
∆VOUT/
(VOUT・∆Topr)
VOUT=0V. Resistor connected with LX pin.
CE “High” Voltage
VCEH
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
CE “Low” Voltage
VCEL
CE “High” Current
ICEH
VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
CE “Low” Current
ICEL
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
0.4
0.5
0.6
V
②
55
80
105
Ω
③
-
8.0
-
μH
VCE=1.5→0.2V.
Short Protection
Threshold Voltage
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V→0V(*1).
CL Discharge
RDCHG
Inductance Value
L
VIN=VOUT=5.0V, VCE=0V, LX=Open.
Test Frequency=1MHz
Rated Current
IDC
600
mA
∆T=+40℃
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3)
Not applicable to the products with VOUT(T) < 2.2V since it is out of operational volatge range.
(*4)
EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6)
Designed value
7/19
XCL210 series
Preliminary
■ELECTRICAL CHARACTERISTICS (Continued)
XCL210 Series voltage chart
SYMBOL
E1
E2
SYMBOL
E1
E2
PARAMETER
OUTPUT VOLTAGE
SUPPLY CURRENT
PARAMETER
OUTPUT VOLTAGE
SUPPLY CURRENT
UNITS: V
UNITS: V
UNITS: μA
UNITS: V
UNITS: V
UNITS: μA
OUTPUT
MIN.
MAX.
MIN.
MAX.
1.0
0.980
1.020
1.1
1.078
1.122
2.5
2.450
2.550
2.6
2.548
1.2
1.176
1.224
2.652
2.7
2.646
1.3
1.274
2.754
1.326
2.8
2.744
2.856
1.4
1.5
1.372
1.428
2.9
2.842
2.958
1.470
1.530
3.0
2.940
3.060
1.6
1.568
1.632
3.1
3.038
3.162
1.7
1.666
1.734
3.2
3.136
3.264
1.8
1.764
1.836
3.3
3.234
3.366
1.9
1.862
1.938
3.4
3.332
3.468
2.0
1.960
2.040
3.5
3.430
3.570
2.1
2.058
2.142
3.6
3.528
3.672
2.2
2.156
2.244
3.7
3.626
3.774
2.3
2.254
2.346
3.8
3.724
3.876
2.4
2.352
2.448
3.9
3.822
3.978
4.0
3.920
4.080
VOLTAGE
TYP.
MAX.
OUTPUT
0.5
0.8
0.5
0.9
0.6
1.1
VOLTAGE
TYP.
MAX.
0.7
1.5
0.8
2.1
1.5
3.0
■TYPICAL APPLICATION CIRCUIT
7
VOUT
1 Lx
VIN 6
2 GND
NC 5
3 VOUT
CE 4
CL
VIN
CIN
NOTE:
The integrated Inductor can be used only for this
DC/DC converter. Please do not use this inductor
for other reasons.
8
Manufacturer
Taiyo Yuden
CIN
TDK
Taiyo Yuden
CL
TDK
Part Number
VALUE
LMK107BBJ106MALT
10μF/10V
LMK212ABJ106MG
10μF/10V
C1608X5R1A106M
10μF/10V
C2012X5R1A106M
10μF/10V
LMK107BBJ226MA
22μF/10V
LMK212BBJ226MG
22μF/10V
C1608X5R1A226M
22μF/10V
C2012X5R1A226M
22μF/10V
* Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components.
8/19
XCL210
Preliminary
Series
■ OPERATIONAL EXPLANATION
The XCL210 series consists of a reference voltage supply, PFM comparator, Pch driver Tr, Nch synchronous rectification switch Tr, current
sensing circuit, PFM control circuit, CE control circuit, and others. (Refer to the block diagram below.)
L1
L2
Inductor
VOUT
Short
Protection
R1
PFM
CFB
Comparator
Current
Sense
CL
Discharge
R2
Vref
PFM
Controller
CE
Synch
Buffer
Drive
Lx
CE Controller Logic
VDD
UVLO
VIN Start Up
Controller
VIN
GND
An ultra-low quiescent current circuit and synchronous rectification enable a significant reduction of dissipation in the IC, and the IC operates with
high efficiency at both light loads and heavy loads. Current limit PFM is used for the control method, and even when switching current
superposition occurs, increases of output voltage ripple are suppressed, allowing use over a wide voltage and current range. The IC is compatible
with low-capacitance ceramic capacitors, and a small, high-performance step-down DC-DC converter can be created.
The actual output voltage VOUT(E) in the electrical characteristics is the threshold voltage of the PFM comparator in the block diagram. Therefore
the average output voltage of the step-down circuit, including peripheral components, depends on the ripple voltage. Before use, test fully using
the actual device.
VIN=VCE=3.6V、VOUT=1.8V、IOUT=5mA、L=8.0μH、CL=22uF、Ta=25℃
VIN=VCE=3.6V、VOUT=1.8V、IOUT=30mA、L=8.0μH、CL=22uF、Ta=25℃
VLX
VLX
VOUT
VOUT
VLX : 2[V/div]
VOUT : 50[mV/div]
VOUT(E)
Voltage
ILX
ILX
IPFM
10[μs/div]
ILX : 100[mA/div]
10[μs/div]
<Reference voltage supply (VREF)>
Reference voltage for stabilization of the output voltage of the IC.
<PFM control>
(1) The feedback voltage (FB voltage) is the voltage that results from dividing the output voltage with the IC internal dividing resistors RFB1 and
RFB2. The PFM comparator compares this FB voltage to VREF. When the FB voltage is lower than VREF, the PFM comparator sends a signal to the
buffer driver through the PFM control circuit to turn on the Pch driver Tr. When the FB voltage is higher than VREF, the PFM comparator sends a
signal to prevent the Pch driver Tr from turning on.
(2) When the Pch driver Tr is on, the current sense circuit monitors the current that flows through the Pch driver Tr connected to the Lx pin. When the
current reaches the set PFM switching current (IPFM), the current sense circuit sends a signal to the buffer driver through the PFM control circuit. This
signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(3) The on time (off time) of the Nch synchronous rectification switch Tr is dynamically optimized inside the IC. After the off time elapses and the
PFM comparator detects that the VOUT voltage is higher than the set voltage, the PFM comparator sends a signal to the PFM control circuit that
prevents the Pch driver Tr from turning on. However, if the VOUT voltage is lower than the set voltage, the PFM comparator starts Pch driver Tr on.
9/19
XCL210 series
Preliminary
■OPERATIONAL EXPLANATION (Continued)
By continuously adjusting the interval of the linked operation of (1), (2) and (3) above in response to the load current, the output voltage is
stabilized with high efficiency from light loads to heavy loads.
<PFM Switching Current >
The PFM switching current monitors the current that flows through the Pch driver Tr, and is a value that limits the Pch driver Tr current.
The Pch driver Tr remains on until the coil current reaches the PFM switching current (IPFM). An approximate value for this on-time tON can be
calculated using the following equation:
tON = L × IPFM / (VIN – VOUT)
<Maximum on-time function>
To avoid excessive ripple voltage in the event that the coil current does not reach the PFM switching current within a certain interval even though
the Pch driver Tr has turned on and the FB voltage is above VREF, the Pch driver Tr can be turned off at any timing using the maximum on-time
function of the PFM control circuit. If the Pch driver Tr turns off by the maximum on-time function instead of the current sense circuit, the Nch
synchronous rectification switch Tr will not turn on and the coil current will flow to the VOUT pin by means of the parasite diode of the Nch
synchronous rectification switch Tr.
<Through mode>
When the VIN voltage is lower than the output voltage, through mode automatically activates and the Pch driver Tr stays on continuously.
(1) In through mode, when the load current is increased and the current that flows through the Pch driver Tr reaches a load current that is several tens
of mA lower than the set PFM switching current (IPFM), the current sense circuit sends a signal through the PFM control circuit to the buffer driver. This
signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(2) After the on-time (off-time) of the Nch synchronous rectification switch Tr, the Pch driver Tr turns on until the current reaches the set PFM
switching current (IPFM) again.
If the load current is large as described above, operations (1) and (2) above are repeated. If the load current is several tens of mA lower than the
PFM switching current (IPFM), the Pch driver Tr stays on continuously.
<VIN start mode>
When the VIN voltage rises, VIN start mode stops the short-circuit protection function during the interval until the FB voltage approaches VREF. After
the VIN voltage rises and the FB voltage approaches VREF by step-down operation, VIN start mode is released. In order to prevent an excessive
rush current while VIN start mode is activated, the coil current flows to the VOUT pin by means of the parasitic diode of the Nch synchronous
rectification Tr. In VIN start mode as well, the coil current is limited by the PFM switching current.
<Short-circuit protection function>
The short-circuit protection function monitors the VOUT voltage. In the event that the VOUT pin is accidentally shorted to GND or an excessive load
current causes the VOUT voltage to drop below the set short-circuit protection voltage, the short-circuit protection function activates, and turns off
and latches the Pch driver Tr at any selected timing. Once in the latched state, the IC is turned off and then restarted from the CE pin, or operation
is started by re-applying the VIN voltage.
<UVLO function>
When the VIN pin voltage drops below the UVLO detection voltage, the IC stops switching operation at any selected timing, turns off the Pch driver
Tr and Nch synchronous rectification switch Tr (UVLO mode). When the VIN pin voltage recovers and rises above the UVLO release voltage, the
IC restarts operation.
<CL discharge function>
On the XCL210 series, a CL discharge function is available as an option (XCL210C/XCL210D types). This function enables quick discharging of
the CL load capacitance when “L” voltage is input into the CE pin by the Nch Tr connected between the VOUT-GND pins, or in UVLO mode. This
prevents malfunctioning of the application in the event that a charge remains on CL when the IC is stopped. The discharge time is determined by
CL and the CL discharge resistance RDCHG, including the Nch Tr (refer to the diagram below). Using this time constant τ= CL×RDCHG, the
discharge time of the output voltage is calculated by means of the equation below.
V = VOUT × e - t /τ, or in terms of t, t = τIn(VOUT / V)
V: Output voltage after discharge
VOUT : Set output voltage
ｔ: Discharge time
CL: Value of load capacitance (CL)
RDCHG : Value of CL discharge resistance Varies by power supply voltage.
τ: CL × RDCHG
The CL discharge function is not available on the XCL210A/XCL210B types.
10/19
XCL210
Preliminary
Series
■NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected
components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the
characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA
Standard) ceramic capacitor.
3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC
operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.
5. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple voltage will be
too large. Before use, test fully using the actual device.
6. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.
7. If other than the recommended inductance and capacitance values are used, excessive ripple voltage or a drop in efficiency may result.
8. If other than the recommended inductance and capacitance values are used, a drop in output voltage when the load is excessive may cause
the short-circuit protection function to activate. Before use, test fully using the actual device.
9. At high temperature, excessive ripple voltage may occur and cause a drop in output voltage and efficiency. Before using at high temperature,
test fully using the actual device
10. At light loads or when IC operation is stopped, leakage current from the Pch driver Tr may cause the output voltage to rise.
11. The average output voltage may vary due to the effects of output voltage ripple caused by the load current. Before use, test fully using the
actual device.
12. If the CL capacitance or load current is large, the output voltage rise time will lengthen when the IC is started, and coil current overlay may
occur during the interval until the output voltage reaches the set voltage (refer to the diagram below).
XCL210A Series、VIN
=VCE
=0→6.0V、VOUT
=1.0V、IOUT
=200ｍA、CL=22uF、Ta=25℃
IN=V
CE=0→6.0V、V
OUT=1.0V、I
OUT
XC9265Aシリーズ、V
=200mA、L=10μH、C
L=22uF、Ta=25℃
VLX
ILX
VLX : 10[V/div ]
IPFM
I L : 200[mA/div ]
VOUT : 1[V/div ]
VOUT
VIN : 5[V/div ]
VIN
Zoom
200[μs/div ]
VLX
VLX : 10[V/div ]
I L : 200[mA/div ]
ILX
VOUT : 1[V/div ]
VOUT
VIN
VIN : 5[V/div ]
5[μs/div ]
13. When the IC is started, the short-circuit protection function does not operate during the interval until the VOUT voltage reaches a value near the
set voltage.
14. If the IC is started at a VIN voltage that activates through mode, it is possible that the short-circuit protection function will not operate. Before
use, test fully using the actual device.
15. If the load current is excessively large when the IC is started, it is possible that the VOUT voltage will not rise to the set voltage. Before use, test
fully using the actual device.
11/19
XCL210 series
Preliminary
■NOTE ON USE (Continued)
16. In actual operation, the maximum on-time depends on the peripheral components, input voltage, and load current. Before use, test fully using
the actual device.
17. When the VIN voltage is turned on and off continuously, excessive rush current may occur while the voltage is on. Before use, test fully using
the actual device.
18. When the VIN voltage is high, the Pch driver may change from on to off before the coil current reaches the PFM switching current (IPFM), or
before the maximum on-time elapses. Before use, test fully using the actual device.
19. When the IC change to the Through Mode at light load, the supply current of this IC can increase in some cases.
20. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.
21. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
12/19
XCL210
Preliminary
Series
■NOTE ON USE (Continued)
●Instructions of pattern layouts
1. To suppress fluctuations in the VIN potential, connect a bypass capacitor (CIN) in the shortest path between the VIN pin and ground pin.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.
●Recommended Pattern Layout
Top view
Back side top view
13/19
XCL210 series
Preliminary
■TYPICAL PERFORMANCE CHARACTERISTICS
1) Output Voltage vs. Output Current
14/19
XCL210A121GR-G/XCL210C121GR-G
XCL210B121GR-G/XCL210D121GR-G
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
XCL210
Preliminary
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
2) Efficiency vs. Output Current
XCL210A121GR-G/XCL210C121GR-G
XCL210B121GR-G/XCL210D121GR-G
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
15/19
XCL210 series
Preliminary
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
3) Ripple Voltage vs. Output Current
16/19
XCL210A121GR-G/XCL210C121GR-G
XCL210B121GR-G/XCL210D121GR-G
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
XCL210
Preliminary
Series
■PACKAGING INFORMATION
●CL-2025-02 (unit: mm)
External Lead
●Reference Pattern Layout (unit: mm)
●Reference Metal Mask Design (unit: mm)
*Implementation of CL-2025-02 is recommended within accuracy 0.05mm.
17/19
XCL210 series
Preliminary
■MARKING RULE
●CL-2025-02
①
1
①
②
③
⑤
3
④
2
6
represents products series
MARK
PRODUCT SERIES
0
XCL210******-G
② represents integer of the output voltage
5
MARK
4
OUTPUT
Type
SERIES
1.x
XCL210A1****-G
8
9
E
A
2.x
XCL210A2****-G
3.x
XCL210A3****-G
F
4.x
XCL210A4****-G
H
1.x
XCL210B1****-G
2.x
XCL210B2****-G
K
L
B
M
3.x
XCL210B3****-G
4.x
XCL210B4****-G
N
1.x
XCL210C1****-G
P
2.x
XCL210C2****-G
R
C
3.x
XCL210C3****-G
S
4.x
XCL210C4****-G
T
1.x
XCL210D1****-G
U
2.x
XCL210D2****-G
3.x
XCL210D3****-G
4.x
XCL210D4****-G
V
D
X
Y
③
PRODUCT
VOLTAGE(V)
Custom
XCL210S*****-G
represents the decimal part of output voltage
OUTPUT
MARK
PRODUCT SERIES
X.0
0
XCL210**0***-G
X.1
1
XCL210**1***-G
X.2
2
XCL210**2***-G
X.3
3
XCL210**3***-G
X.4
4
XCL210**4***-G
X.5
5
XCL210**5***-G
X.6
6
XCL210**6***-G
X.7
7
XCL210**7***-G
X.8
8
XCL210**8***-G
X.9
9
XCL210**9***-G
VOLTAGE(V)
④,⑤ represents production lot number
01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order.
(G, I, J, O, Q, W excluded)
Note: No character inversion used.
18/19
XCL210
Preliminary
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
19/19