XC8109 series - Torex Semiconductor

XC8109 Series
ETR33004-001a
85mΩ High Function Power Switch
■GENERAL DESCRIPTION
The XC8109 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current
prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are
incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open
drain structure, and outputs Low level signal while over-current or overheating is detected, or while the reverse current
prevention is operated.
A variable current limiting function is integrated, allowing the current limit value to be set, using an external resistor.
The voltage level which is fed to CE pin determines the status of XC8109. The logic level of CE pin is selectable between
either one of active high or active low.
■APPLICATIONS
■FEATURES
●Set Top Boxes
Input Voltage
Maximum Output Current
ON Resistance
Supply Current
Stand-by Current
Flag Delay Time
●Digital TVs
●PCs
●USB Ports/USB Hubs
●HDMI
Protection Circuit
Functions
Current Limit Response Time
Operating Ambient Temperature
Package
Environmentally Friendly
■TYPICAL APPLICATION CIRCUIT
: 2.5V~5.5V
: 0.9A
: 85mΩ@VIN=5.0V (TYP.)
: 40μ[email protected] VIN=5.0V
: 0.1μA (TYP.)
: 7.5ms (TYP.)
* At over-current detection
: 4ms (TYP.)
* At reverse voltage detection
: Reverse Current Prevention
75mA~1.3A (TYP.)
Thermal Shutdown
Under Voltage Lockout (UVLO)
Soft-start
: Flag Output
CE Pin Input Logic Selectable
: 2μs (TYP.)
*Reference value
: -40℃~+105℃
: USP-6C
: EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
XC8109xC10ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
* The Typical circuit is base on USB high side switch.
The XC8109 series can accommodate 1μF output capacitor (CL).
Output Voltage : VOUT [V]
6.0
RILIM=515kΩ
RILIM=18.4kΩ
RILIM=0kΩ
5.0
4.0
3.0
2.0
1.0
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Output Current : IOUT [A]
1/26
XC8109 Series
■BLOCK DIAGRAM
XC8109 Series
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2/26
XC8109
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC8109①②③④⑤⑥-⑦
DESIGNATOR
ITEM
①
CE Logic
B
C
Protection Circuits Type
③④
Maximum Output Current
10
Package (Order Unit)
ER-G
(*1)
DESCRIPTION
A
②
⑤⑥-⑦
(*1)
SYMBOL
Refer to Selection Guide
D
0.9A
(* Adjustable current limit range:75mA~1300mA)
USP-6C (3,000/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
●Selection Guide
TYPE
CE LOGIC SELECTABLE
SOFT-START
CURRENT LIMIT
ADJUSTABLE
AC
Active High
Yes
Yes
AD
Active High
Yes
Yes
BC
Active Low
Yes
Yes
BD
Active Low
Yes
Yes
TYPE
UVLO
FLG OUTPUT
REVERSE CURRENT
PREVENTION
AC
Yes
Yes
Yes
AD
Yes
Yes
Yes
BC
Yes
Yes
Yes
BD
Yes
Yes
Yes
TYPE
THERMAL
SHUT DOWN
LATCH
PROTECTION
AC
Yes
No
AD
Yes
Yes
BC
Yes
No
BD
Yes
Yes
3/26
XC8109 Series
■PIN CONFIGURATION
FLG 3
4 CE
ILIM 2
5 VSS
VOUT 1
6 VIN
USP-6C
(BOTTOM VIEW)
* The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation.
Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
VOUT
Output
2
ILIM
Current Limit Adjustment
3
FLG
Fault Report
4
CE
ON/OFF Control
5
VSS
Ground
6
VIN
Power Input
USP-6C
■FUNCTION
TYPE
PIN NAME
A
CE
B
SIGNAL
STATUS
H
Active
L
Stand-by
OPEN
Undefined State (*1)
H
Stand-by
L
Active
OPEN
Undefined State (*1)
* Avoid leaving the CE pin open; set to any fixed voltage.
4/26
XC8109
Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
VIN
-0.3~+6.0
V
Output Voltage
VOUT
-0.3~+6.0
V
Output Current
IOUT
1.7
A
CE Input Voltage
VCE
-0.3~+6.0
V
FLG Pin Voltage
VFLG
-0.3~+6.0
V
FLG Pin Current
IFLG
15
mA
ILIM Pin Voltage
VILIM
-0.3~+6.0
V
ILIM Pin Current
IILIM
±1
mA
Power Dissipation
USP-6C
Pd
120
1000 (*2)
mW
Operating Ambient Temperature
Topr
-40~+105
℃
Storage Temperature
Tstg
-55~+125
℃
* All voltages are described based on the VSS.
(*1)
Use with IOUT less than Pd/(VIN-VOUT).
(*2)
This is a reference data taken by using the test board.
Please refer to page 24for details.
5/26
XC8109 Series
■ELECTRICAL CHARACTERISTICS
PARAMETER
SYMBOL
Input Voltage
VIN
On Resistance
RON
Supply Current
ISS
Stand-by Current
ISTBY
Switch Leakage Current
ILEAK
Current Limit
ILIMT
CONDITIONS
VIN=3.3V, IOUT=1.0A
VIN=5.0V, IOUT=1.0A
VOUT=OPEN
VIN=5.5V, VOUT=OPEN
VCE=VSS (XC8109A series)
VCE=VIN (XC8109B series)
VIN=5.5V, VOUT=0V
VCE=VSS (XC8109A series)
VCE=VIN (XC8109B series)
VOUT=VIN-0.3V
ILIM shorted to VSS
VOUT=VIN-0.3V
RILIM=18.4kΩ
VOUT=0V
Short-Circuit Current
ISHORT
ILIM shorted to VSS
VOUT=0V
RILIM=18.4kΩ
Ta=25℃
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.5
-
100
85
40
5.5
110
104
75
V
mΩ
mΩ
μA
①
②
-
0.01
1.0
μA
②
-
0.01
1.0
μA
②
1.170
1.300
1.430
A
①
0.621
0.730
0.840
-
0.650
A
①
-
0.365
-
μs
①
V
①
VIN=5.0V, VOUT: OPEN→0V
Measure from VOUT=0V
to when current falls below
a certain ILIMT value
VIN=5.5V, XC8109A series
VIN=5.5V, XC8109B series
VIN=5.5V, XC8109A series
VIN=5.5V, XC8109B series
VIN=5.5V, VCE=5.5V
VIN=5.5V, VCE=0V
-
2.0
-
1.5
1.5
-0.1
-0.1
-
5.5
0.8
0.8
5.5
0.1
0.1
V
①
μA
μA
①
①
VUVLOD
VIN: 2.2V→1.7V
1.8
1.9
2.0
V
①
UVLO Released Voltage
VUVLOR
VIN: 1.7V→2.2V
1.9
2.0
2.1
V
①
UVLO Hysteresis
VUHYS
-
-
0.1
-
V
①
Current Limit Circuit
Response Time (*2)
tCLR
CE "H" Level Voltage
VCEH
CE "L" Level Voltage
VCEL
CE "H" Level Current
CE "L" Level Current
ICEH
ICEL
UVLO Detected Voltage
NOTE:
Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8109A series) or VCE=VSS (XC8109B series)
(*2)
①
Design reference value. This parameter is provided only for reference.
6/26
XC8109
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25℃
PARAMETER
SYMBOL
turn-on time
tON
turn-off time
CONDITIONS
MIN.
TYP.
MAX.
UNITS
CIRCUIT
RLOAD=10Ω, VCE=0V→2.2V
-
0.60
1.00
ms
①
tOFF
RLOAD=10Ω, VCE=2.2V→0V
-
0.08
0.13
ms
①
FLG output FET
On-resistance
RFLG
IFLG=10mA, VOUT=5.5V
-
15
20
Ω
③
FLG output FET
Leakage Current
IFOFF
VIN=5.5V, VFLG=5.5V, VOUT=OPEN
-
0.01
0.1
μA
③
tFD1
over-current condition
6.5
7.5
8.5
ms
①
tFD2
reverse-voltage condition
2.7
4.0
4.7
ms
①
Reverse Current
IREV
VIN=0V, VOUT=5.5V
VCE=5.0V (XC8109A series)
VCE=VSS (XC8109B series)
-
0.1
1.0
μA
①
Reverse Current
Prevention
Detect Voltage
VREV_D
VIN: 5.0V→4.7V
VOUT=5.0V
-
140
-
mV
①
Thermal Shutdown
Detect Temperature
TTSD
Junction Temperature
-
150
-
℃
①
Thermal Shutdown
Release Temperature
TTSR
Junction Temperature
-
130
-
℃
①
Thermal Shutdown
Hysteresis Width
THYS
Junction Temperature
-
20
-
℃
①
FLG delay time
NOTE:
Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8109A series) or VCE=VSS (XC8109B series)
■TIMING CHART
●turn-on time, turn-off time
XC8109 Series, Type A
XC8109 Series, Type B
7/26
XC8109 Series
■TEST CIRCUITS
CIN=1.0μF, CL=1.0μF
1) CIRCUIT①
2) CIRCUIT②
3) CIRCUIT③
8/26
XC8109
Series
■OPERATIONAL EXPLANATION
The XC8109 series is a P-channel MOSFET power switch IC.
The XC8109 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current
prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block.
The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current.
(See the BLOCK DIAGRAM below)
BLOCK DIAGRAM (XC8109 Series)
<CE Pin>
The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the
electrical specification is fed to CE pin, then XC8109 can operate in standard manner. However, if the middle voltage which is
neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal
circuits. Also if CE pin is open, the status of XC8109 cannot be fixed and the behavior will be unstable.
<Thermal Shutdown>
For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature
reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC
resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because
the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit
detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal
shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released
and the voltage level of FLG pin is high level.
<Under Voltage Lockout (UVLO) >
When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by
UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage
goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn
ON.
<Soft-start Function>
The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the
reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized
internally and defined as turn-on time. (TYP: 0.6ms)
9/26
XC8109 Series
■OPERATIONAL EXPLANATION (Continued)
<Current limiter, short-circuit protection>
When the output current reaches the current limit value, the constant current limit circuit activates and as a result, the output
voltage goes down.
If the short circuit comes at the VOUT pin, the output current is limited to the current which is specified as the short-circuit
current value. In over-current states, after output voltage drops and the situation is kept for 7.5ms (TYP.), the FLG pin changes
to Low level output.
Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type
D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two types.
The auto recovery type continuously limits the output current by the current limit value.
In over-current states, after output voltage returns to normal and the situation is kept for 7.5ms (TYP.), the voltage of FLG pin
goes up “H” level again.
The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained
regardless of whether the over-current state is released.
Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage
below the UVLO detected voltage once and after that raising it higher than UVLO released voltage.
<Current limit external adjustment function>
By connecting a resistor to the current limit external adjustment pin (ILIM pin), the current limit can be set to any value.
By the following equations, the current limit value can be set to any value within a range of 75mA to 1300mA. When the ILIM pin
is open, the switch transistor is forcibly turned off.
(In the case of ILIMIT(T)≧500mA.)
equation 1. RILIM(kΩ) = 32164 / ILIMIT(T)(mA) – 25.71(kΩ)
(In the case of ILIMIT(T)<500mA.)
equation 2. RILIM(kΩ) = 130170 / ILIMIT(T)(mA) 1.2814(kΩ)
RILIM: External resistance value ILIMIT(T): Current limit set value
Table1. Current limit set value
ILIMIT(T)
(mA)
E96 External
resistance value
(kΩ)
Current limit value when use
E96 external resistance (mA)(*)
MIN.
TYP.
MAX.
75
515
511
49
75
102
100
356
357
69
100
131
200
147
147
156
200
243
300
87.2
86.6
241
302
362
400
60.3
60.4
314
399
485
500
38.6
38.3
427
503
578
600
27.9
28.0
509
599
689
700
20.2
20.0
598
704
809
800
14.5
14.7
716
796
876
900
10.0
10.0
811
901
991
1000
6.46
6.49
899
999
1099
1100
3.53
3.57
989
1099
1208
1200
1.09
1.10
1080
1200
1320
1170
1300
1430
1300
(*)
RILIM
(kΩ)
ILIM shorted to VSS
MIN. value and MAX. value are reference values.
10/26
XC8109
Series
■OPERATIONAL EXPLANATION (Continued)
<Current limit external adjustment function> (Continued)
Fig1. Current limit set value
XC8109 電流制限設定値 - 外部抵抗値
XC8109 Current limit set value vs. External resistor
1400
ILIMIT (mA): Current limit set value
ILIMIT(T) (mA) : 電流制限設定値
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
0
50
100
150
200
250
300
350
400
450
500
550
: 外部抵抗値
ILIM (kΩ)
RILIM R
(kΩ):
External
resistor
11/26
XC8109 Series
■OPERATIONAL EXPLANATION (Continued)
<Current limit external adjustment function> (Continued)
The TYP value of dropout Voltage which is the voltage difference between VIN and VOUT is defined by the equation 3 using
output current (IOUT).
equation 3. Vdif(mV) = IOUT(mA) x 0.085(Ω)
The maximum value of dropout voltage has the influence of the setting of a current limit circuit. (Refer to Table 2)
【Example】 In the case of ILIMIT(T)=500mA, When output current is 200mA, dropout voltage MAX. value is 22mV.
Table2. Dropout volltage MAX. value (*)
unit: (mV)
Dropout voltage MAX. value
Output
Current:
IOUT
75mA
100mA
200mA
300mA
400mA
500mA
600mA
10mA
30mA
50mA
70mA
100mA
150mA
200mA
250mA
300mA
400mA
500mA
4
15
41
-
3
10
24
49
-
1
5
9
14
28
71
-
1
4
6
10
15
29
55
112
-
1
3
5
8
12
20
33
58
100
-
1
3
5
7
10
15
22
32
46
105
-
1
3
5
7
10
15
20
26
35
67
143
Current limit set value: ILIMIT(T)
unit: (mV)
Dropout voltage MAX. value
(*)
Output
Current:
IOUT
700mA
800mA
900mA
1000mA
1100mA
1200mA
1300mA
10mA
30mA
50mA
70mA
100mA
150mA
200mA
250mA
300mA
400mA
500mA
600mA
700mA
800mA
900mA
1
3
5
7
10
15
20
26
30
48
85
167
-
1
3
5
7
10
15
20
26
30
41
60
100
183
-
1
3
5
7
10
15
20
26
30
41
51
75
122
214
-
1
3
5
7
10
15
20
26
30
41
51
61
85
132
223
1
3
5
7
10
15
20
26
30
41
51
61
71
97
144
1
3
5
7
10
15
20
26
30
41
51
61
71
82
107
1
3
5
7
10
15
20
26
30
41
51
61
71
81
92
Current limit set value: ILIMIT(T)
MAX. value is reference value.
12/26
XC8109
Series
■OPERATIONAL EXPLANATION (Continued)
<Reverse current prevention>
An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin.
When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse
current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the
VIN pin is reduced to 0.1μA (TYP.).
If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output.
Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off
type (product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is
different between these two types.
On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops
immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms
(TYP.), the FLG pin returns to High level output.
On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released.
<Flag function>
The flag circuit is built in which monitors the state of the power switch.
The FLG pin outputs Low level when the reverse current prevention function is operating.
is recommended for the FLG pin pull-up resistance.
A resistance of 10kΩ to 100kΩ
Auto recovery type (product type C)
Protective function
FLG pin Low level output
Return to FLG pin High level output
Current limiter
In over-current states, after output voltage drops
and the situation is kept for 7.5ms (TYP.).
In over-current states, after output voltage
returns to normal and the situation is kept
for 7.5ms (TYP.).
Reverse current prevention
4.0ms after reverse voltage detection
4.0ms after reverse voltage release
Thermal shutdown
Same time as overheat state is detected
Same time as overheat state is released
Protective function
FLG pin Low level output
Return to FLG pin High level output
Current limiter
In over-current states, after output voltage drops
and the situation is kept for 7.5ms (TYP.).
When latch operation is released
Reverse current prevention
4.0ms after reverse voltage detection
When latch operation is released
Thermal shutdown
Same time as overheat state is detected
Same time as overheat state is released
Latch off type (product type D)
13/26
XC8109 Series
■NOTES ON USE
1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or
deteriorated if IC is used beyond the absolute MAX. specifications.
2. Where wiring impedance is high, operations may become unstable due to noise depending on output current.
Please keep the resistance low between VIN and VSS wiring in particular.
3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
For the input or output capacitor, a capacitance of 1.0μF or higher is recommended.
4. When the voltage which is higher than the maximum input voltage is fed to the VIN pin, and VOUT is shorted to the VSS level, in
this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range.
5. The current limit value can be adjusted by external resistor (RLIM). The characteristic of the resistor influence the current limit
value, please choose the resistor with small tolerance and temperature coefficient.
6. 80% of current limit set value is the recommended value of maximum output current.
7. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
14/26
XC8109
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) UVLO detect voltage vs. Input voltage
(2) UVLO release voltage vs. Input voltage
XC8109xx10ER
XC8109xx10ER
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
UVLO release voltage : UVLO [V]
UVLO detect voltage : UVLO [V]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
2.0
1.5
1.0
0.5
0.0
3.0
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
2.0
1.5
1.0
0.5
0.0
1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10
Input voltage : VIN [V]
1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10
Input voltage : VIN [V]
(3) UVLO threshold voltage vs. Ambient temperature
XC8109xx10ER
UVLO threshold voltage : UVLO [V]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
2.5
2.0
1.5
1.0
UVLO detect
UVLO release
0.5
0.0
-50
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
125
(4) Stand-by current vs. Input voltage
(5) Stand-by current vs. Ambient temperature
XC8109xx10ER
XC8109xx10ER
Ta=105℃
2.5
Ta=25℃
Ta=-40℃
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input voltage : VIN [V]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
Stand-by current : Istby [μA]
Stand-by current : Istby [μA]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
3.0
Istby
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
125
15/26
XC8109 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Supply current vs. Input voltage(sweep up)
(7) Supply current vs. Ambient temperature
XC8109xx10ER
XC8109xx10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
Supply current : ISS [μA]
Supply current : ISS [μA]
VIN=5.0V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
50
45
40
35
30
25
20
15
10
5
0
Ta=105℃
Ta=25℃
Ta=-40℃
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
50
45
40
35
30
25
20
15
10
5
0
-50
Input voltage : VIN [V]
(8) CE "H" level voltage vs. Input voltage
VIN=5.0V
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
(9) CE "L" level voltage vs. Input voltage
XC8109xx10ER
XC8109xx10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
CE "L" level voltage : VCEL [V]
CE "H" level voltage : VCEH [V]
3.0
2.5
2.0
1.5
1.0
Ta=105℃
Ta=25℃
0.5
Ta=-40℃
0.0
0.5
1.0
1.5
2.0
Input voltage : VIN [V]
2.5
(10) CE threshold voltage vs. Ambient temperature
XC8109xx10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
CE threshold voltage : VCE [V]
2.5
2.0
1.5
1.0
Ta=105℃
Ta=25℃
0.5
Ta=-40℃
0.0
0.0
2.5
CE"H"level
2.0
CE"L"level
1.5
1.0
0.5
0.0
-50
16/26
125
-25
0
25
50
75
100
Ambient temperature : Ta [℃]
125
0.0
0.5
1.0
1.5
2.0
Input voltage : VIN [V]
2.5
XC8109
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) On resistance vs. Input voltage
(12) On resistance vs. Ambient temperature
XC8109xx10ER
XC8109xx10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
180
180
160
160
On resistance : Ron [mΩ]
On resistance : Ron [mΩ]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
140
120
100
80
60
40
Ta=105℃
Ta=25℃
20
Ta=-40℃
0
2.0
2.5
3.0 3.5 4.0 4.5 5.0
Input voltage : VIN [V]
5.5
140
120
100
80
VIN=3.5V
40
VIN=4.5V
20
VIN=5.0V
0
-50
6.0
(13) Turn-on time vs. Input voltage
VIN=2.5V
60
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
0.6
0.6
Turn-on time : tDLY(ON) [ms]
Turn-on time : tDLY(ON) [ms]
0.7
0.7
0.5
0.4
0.3
Ta=105℃
Ta=25℃
0.5
0.4
0.3
VIN=2.5V
0.2
VIN=3.5V
VIN=4.5V
0.1
VIN=5.0V
Ta=-40℃
0.0
VIN=5.5V
0.0
2.0
2.5
3.0 3.5 4.0 4.5 5.0
Input voltage : VIN [V]
5.5
6.0
-50 -25 0
25 50 75 100 125
Ambient temperature : Ta [℃]
(15) Turn-off time vs. Input voltage
(16) Turn-off time vs. Ambient temperature
XC8109xx10ER
0.08
0.07
0.06
0.05
0.04
Ta=105℃
0.03
Ta=25℃
0.02
Ta=-40℃
0.01
0.00
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
0.09
Turn-off time : tDLY(OFF) [ms]
Turn-off time : tDLY(OFF) [ms]
XC8109xx10ER
VIN=4.3V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
0.09
125
XC8109xx10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
0.1
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
(14) Turn-on time vs. Ambient temperature
XC8109xx10ER
0.2
VIN=5.5V
0.08
0.07
0.06
0.05
0.04
VIN=2.5V
VIN=3.5V
0.03
VIN=4.5V
VIN=5.0V
0.02
VIN=5.5V
0.01
0.00
2.0
2.5
3.0 3.5 4.0 4.5 5.0
Input voltage : VIN [V]
5.5
6.0
-50
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
125
17/26
XC8109 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) FLG delay time over-current
vs. Ambient temperature
(18) FLG delay time reverse-voltage
vs. Ambient temperature
XC8109xx10ER
XC8109xx10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
FLG reverse-voltage : tFD [ms]
FLG over-current : tFD [ms]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
9.0
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
VIN=5.5V
-50
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
125
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
-50
-25
0
25
50
75 100
Ambient temperature : Ta [℃]
125
(19) Output voltage vs. Output current
XC8109xD10ER
XC8108xD20ER
XC8109xC10ER
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
RILIM=515kΩ
RILIM=18.4kΩ
RILIM=0kΩ
5.0
6.0
Output voltage : VOUT [V]
Output voltage : VOUT [V]
6.0
4.0
3.0
2.0
1.0
RILIM=515kΩ
RILIM=18.4kΩ
RILIM=0kΩ
5.0
4.0
3.0
2.0
1.0
0.0
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Output current : IOUT [A]
Output current : IOUT [A]
In over-current states, after output voltage drops and the lapse of 7.5ms,
the latch off type turns off the power switch transistor.
XC8109xx10ER
VCE=5.0V→0V, tf=5μs, RL=10Ω, Ta=25℃
VIN=5.0V, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
CE Input voltage
Voltage : [V]
4.0
2.0
3.5
8.0
3.0
6.0
2.5
Output voltage
0.0
2.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply current
-8.0
-0.5
Time [100μs/div]
18/26
0.0
4.0
Voltage : [V]
6.0
XC8109xx10ER
VCE=0V→5.0V, tr=5μs, RL=10Ω, Ta=25℃
VIN=5.0V, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
Supply current : Isupply [A]
8.0
(21) Turn-off delay vs. Fall time (CL=1.0μF)
3.0
Output voltage
1.5
0.0
CE Input voltage
1.0
0.5
-4.0
-6.0
2.5
2.0
2.0
-2.0
3.5
Supply current
0.0
-0.5
-8.0
Time [100μs/div]
Supply current : Isupply [A]
(20) Turn-on delay vs. Rise time (CL=1.0μF)
XC8109
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(22) Turn-on delay vs. Rise time (CL=120μF)
(23) Turn-off delay vs. Fall time (CL=120μF)
Voltage : [V]
4.0
CE Input voltage
Output voltage
8.0
3.0
6.0
2.5
2.0
2.0
0.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
0.0
Supply current
-8.0
2.0
2.5
Output voltage
2.0
0.0
1.5
CE Input voltage
-2.0
1.0
-4.0
0.5
-6.0
0.0
Supply current
-8.0
-0.5
3.5
3.0
4.0
Voltage : [V]
6.0
3.5
Supply current : Isupply [A]
8.0
XC8109xx10ER
VCE=5.0V→0V, tf=5μs, RL=10Ω, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
Supply current : Isupply [A]
XC8109xx10ER
VCE=0V→5.0V, tr=5μs, RL=10Ω, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
-0.5
Time [500μs/div]
Time [500μs/div]
(24) Short circuit current, Device enabled into short
XC8109xx10ER
8.0
XC8109xx10ER
VCE=0V→5.0V, tr=5μs, Ta=25℃
VIN=5.0V, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
8.0
3.5
VCE=5.0V→0V, tf=5μs, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
3.5
3.0
4.0
2.5
2.0
2.0
0.0
1.5
Output voltage
-4.0
-6.0
1.0
0.5
Supply current
-8.0
6.0
3.0
4.0
2.5
2.0
2.0
0.0
-2.0
-6.0
-0.5
-8.0
-0.5
(26) Short-curcuit transient response
(VOUT=short→5.0Ω, CL=1.0μF)
XC8109xC10ER
VIN=5.0V, tf=100μs, Ta=25℃
FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
3.5
8.0
3.0
2.0
2.0
0.0
1.5
Output voltage
-4.0
1.0
0.5
Supply current
-6.0
-8.0
Time [2ms/div]
4.0
Voltage : [V]
2.5
FLG voltage
6.0
Supply current : Isupply [A]
VOUT = Short circuit to Vss
4.0
Voltage : [V]
0.0
Time [40μs/div]
XC8109xC10ER
-2.0
0.5
Supply current
0.0
(25) Short-curcuit transient response
(VOUT=5.0Ω→short, CL=1.0μF)
6.0
1.0
-4.0
Time [40μs/div]
8.0
1.5
Output voltage
VIN=5.0V, tr=100μs, Ta=25℃
FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
VOUT = Removed short circuit
3.5
3.0
2.5
Output voltage
2.0
2.0
FLG voltage
0.0
1.5
-2.0
1.0
-4.0
0.0
-6.0
-0.5
-8.0
Supply current
0.5
Supply current : Isupply [A]
-2.0
Voltage : [V]
CE Input voltage
Supply current : Isupply [A]
Voltage : [V]
6.0
Supply current : Isupply [A]
CE Input voltage
0.0
-0.5
Time [2ms/div]
19/26
XC8109 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(27) Short-curcuit transient response
(VOUT=open→short, CL=1.0μF)
(28) Short-curcuit transient response
(VOUT=short→open, CL=1.0μF)
XC8109xC10ER
VIN=5.0V, tf=100μs, Ta=25℃
FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
3.5
8.0
VOUT = Short circuit to Vss
FLG voltage
2.5
2.0
2.0
1.5
0.0
Output voltage
-2.0
1.0
-4.0
0.5
Supply current
-8.0
4.0
Voltage : [V]
VOUT = Short circuit to Vss
1.5
-2.0
1.0
-4.0
0.5
-6.0
-0.5
-8.0
-0.5
(30) Short-curcuit transient response
(VOUT=short→5.0Ω, CL=120μF)
VIN=5.0V, tr=100μs, Ta=25℃
FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
8.0
3.5
6.0
2.5
2.0
2.0
1.5
0.0
Output voltage
1.0
-2.0
0.5
-4.0
Supply current
-6.0
-8.0
4.0
Voltage : [V]
FLG voltage
Supply current : Isupply [A]
Voltage : [V]
0.0
Supply current
Time [2ms/div]
3.0
4.0
VOUT = Removed short circuit
3.5
3.0
2.5
Output voltage
2.0
FLG voltage
2.0
0.0
1.5
-2.0
1.0
-4.0
0.5
Supply current
0.0
-6.0
-0.5
-8.0
0.0
-0.5
Time [2ms/div]
Time [2ms/div]
(31) Short-curcuit transient response
(VOUT=open→short, CL=120μF)
(32) Short-curcuit transient response
(VOUT=short→open, CL=120μF)
XC8109xC10ER
XC8109xC10ER
VIN=5.0V, tf=100μs, Ta=25℃
FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
FLG voltage
2.0
3.5
8.0
3.0
6.0
2.5
2.0
Output voltage
0.0
1.5
-2.0
1.0
-4.0
0.5
Supply current
-8.0
0.0
-0.5
Time [2ms/div]
4.0
Voltage : [V]
VOUT = Short circuit to Vss
VIN=5.0V, tr=100μs, Ta=25℃
FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
Supply current : Isupply [A]
8.0
Voltage : [V]
2.0
Supply current : Isupply [A]
8.0
20/26
2.5
Output voltage
XC8109xC10ER
VIN=5.0V, tf=100μs, Ta=25℃
FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
-6.0
3.0
0.0
XC8109xC10ER
4.0
3.5
FLG voltage
0.0
(29) Short-curcuit transient response
(VOUT=5.0Ω→short, CL=120μF)
6.0
VOUT = Removed short circuit
2.0
Time [2ms/div]
6.0
VIN=5.0V, tr=100μs, Ta=25℃
FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
VOUT = Removed short circuit
3.5
3.0
2.5
Output voltage
2.0
2.0
FLG voltage
0.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply current
-8.0
0.0
-0.5
Time [2ms/div]
Supply current : Isupply [A]
Voltage : [V]
4.0
-6.0
6.0
3.0
Supply current : Isupply [A]
6.0
8.0
Supply current : Isupply [A]
XC8109xC10ER
XC8109
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(33) UVLO transient response (CL=1.0μF)
Voltage : [V]
4.0
Input voltage
3.5
8.0
3.0
6.0
2.5
2.0
Output voltage
2.0
1.5
0.0
-2.0
1.0
-4.0
0.5
-6.0
Supply current
-8.0
Voltage : [V]
6.0
XC8109xx10ER
Supply current : Isupply [A]
8.0
VIN=0V→5.0V, tr=3ms, Ta=25℃
RL=5Ω, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
VIN=5.0V→0V, tf=3ms, Ta=25℃
RL=5Ω, CIN=CL=1.0μF(ceramic), RILIM=0kΩ
3.5
3.0
Input voltage
4.0
2.5
2.0
2.0
1.5
0.0
Output voltage
-2.0
0.5
-4.0
0.0
-6.0
-0.5
-8.0
1.0
Supply current : Isupply [A]
XC8109xx10ER
0.0
Supply current
-0.5
Time [500μs/div]
Time [500μs/div]
(34) UVLO transient response (CL=120μF)
Voltage : [V]
4.0
8.0
3.0
6.0
2.5
2.0
Output voltage
0.0
2.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply current
-8.0
2.0
2.0
0.0
-4.0
-6.0
-0.5
-8.0
Input voltage
2.0
0.0
-2.0
4.0
2.0
0.0
-8.0
Time [500μs/div]
6.0
5.0
Supply current
-6.0
8.0
6.0
1.0
-4.0
0.0
Supply current
-0.5
XC8109xC10ER
3.0
FLG voltage
0.5
(36) Reverse voltage released voltage (CL=1.0μF)
4.0
Voltage : [V]
Voltage : [V]
4.0
1.0
Time [500μs/div]
Supply current : Isupply [A]
6.0
Output voltage
1.5
Input voltage
-2.0
XC8109xC10ER
VOUT=5.5V
3.0
Output voltage
2.5
0.0
(35) Reverse voltage detected voltage (CL=1.0μF)
8.0
3.5
4.0
Time [500μs/div]
VIN=5.0V, RL=5Ω, Ta=25℃
CIN=CL=1.0μF(ceramic), RILIM=0kΩ
VIN=5.0V→0V, tf=3ms, Ta=25℃
RL=5Ω, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
VIN=5.0V, RL=5Ω, Ta=25℃
CIN=CL=1.0μF(ceramic), RILIM=0kΩ
VOUT = 5.5V removed
Input voltage
Output voltage
2.0
6.0
5.0
4.0
3.0
FLG voltage
0.0
2.0
-2.0
1.0
-4.0
-1.0
-6.0
-2.0
-8.0
Supply current
0.0
Supply current : Isupply [A]
Input voltage
3.5
Voltage : [V]
6.0
XC8109xx10ER
Supply current : Isupply [A]
8.0
VIN=0V→5.0V, tr=3ms, Ta=25℃
RL=5Ω, CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
Supply current : Isupply [A]
XC8109xx10ER
-1.0
-2.0
Time [500μs/div]
21/26
XC8109 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(37) Reverse voltage detected voltage (CL=120μF)
(38) Reverse voltage released voltage (CL=120μF)
Voltage : [V]
4.0
Output voltage
6.0
3.0
2.0
FLG voltage
0.0
2.0
1.0
-2.0
0.0
-4.0
Supply current
-1.0
-6.0
4.0
4.0
Output voltage
2.0
6.0
5.0
Input voltage
3.0
FLG voltage
0.0
2.0
-2.0
1.0
-4.0
0.0
Supply current
-6.0
-1.0
-8.0
-2.0
-8.0
VOUT = 5.5V removed
6.0
5.0
4.0
Input voltage
VIN=5.0V, Ta=25℃
CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
8.0
Voltage : [V]
6.0
VOUT=5.5V forced
XC8109xC10ER
Supply current : Isupply [A]
8.0
VIN=5.0V, Ta=25℃
CIN=1.0μF, CL=120μF(ceramic), RILIM=0kΩ
Supply current : Isupply [A]
XC8109xC10ER
-2.0
Time [500μs/div]
Time [500μs/div]
(39) CE transient response
XC8109xx10ER
XC8109xx10ER
VCE=0→5.0V, tr=5μs, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic)
VCE=0→5.0V, tr=5μs, Ta=25℃
VIN=5.0V, CIN=CL=1.0μF(ceramic)
0.035
CE voltage
0.030
0.025
2.0
0.020
0.0
0.015
-2.0
RILIM=18.4kΩ
RILIM=0kΩ
-4.0
-6.0
0.010
0.005
4.0
2.5
2.0
2.0
0.0
1.5
-2.0
RILIM=18.4kΩ
0.000
0.5
-6.0
0.0
In rush current
-0.005
-8.0
-0.5
Time [500μs/div]
(41) Current limit adapted time
(40) Short applied
XC8109xx10ER
XC8109xx10ER
Voltage : [V]
4.0
12.0
10.0
2.0
8.0
Output voltage
0.0
6.0
-2.0
4.0
-4.0
2.0
In rush current
-6.0
0.0
-8.0
-2.0
Time [2μs/div]
22/26
Current limit response : [μs]
VOUT = Short circuit to Vss
14.0
In rush current : [A]
6.0
VIN=5.0V, Ta=25℃
CL=open, RILIM=0kΩ
1.0
RILIM=0kΩ
Time [500μs/div]
8.0
3.0
-4.0
In rush current
-8.0
3.5
CE voltage
6.0
Voltage : [V]
4.0
In rush current : IRUSH [A]
Voltage : [V]
6.0
8.0
VIN=5.0V, Ta=25℃
CL=open, RILIM=0kΩ
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0.0
1.0
2.0
3.0
4.0
5.0
Peak limit current [A]
6.0
In rush current : IRUSH [A]
8.0
XC8109
Series
■PACKAGING INFORMATION
●USP-6C (unit:mm)
1.8±0.05
1pin INDENT
0.05
0.30±0.05
(0.1)
(0.50)
0.10±0.05
●USP-6C
0.20±0.05
1.4±0.05
Reference Pattern Layout (unit: mm)
●USP-6C Reference Metal Mask Design (unit: mm)
23/26
XC8109 Series
■PACKAGING INFORMATION (Continued)
●
USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:
Thickness:
Through-hole
Glass Epoxy (FR-4)
1.6mm
4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
25
1000
105
200
Thermal Resistance (℃/W)
100.00
Power
Dissipation: Pd (mW)
許容損失Pd(mW)
Pd vs. Ta
Pd-Ta特性グラフ
1200
1000
800
600
400
200
0
25
24/26
45
65
85
周囲温度Ta(℃)
Ambient
Temperature: Ta (℃)
105
125
XC8109
Series
■MARKING RULE
① represents products series
USP-6C
②
⑤
③
3
④
2
①
1
6
5
4
MARK
PRODUCT SERIES
Z
XC8109******-G
② represents product type
MARK
CE LOGIC
PROTECTION CIRCUIT TYPE
PRODUCT
1
Active High
Auto-recovery
XC8109AC****-G
2
Active High
Latch-off
XC8109AD****-G
3
Active Low
Auto-recovery
XC8109BC****-G
4
Active Low
Latch-off
XC8109BD****-G
③ represents maximum output current
MARK
CURRENT (A)
PRODUCT SERIES
6
0.9
XC8109**10**-G
④⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
25/26
XC8109 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
26/26