XC61G Series ETR0203_005a Low Voltage Detectors (VDF= 0.8V～1.5V) Standard Voltage Detectors (VDF 1.6V～6.0V) ■GENERAL DESCRIPTION The XC61G series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser trimming technologies. Detect voltage is extremely accurate with minimal temperature drift. Both CMOS and N-ch open drain output configurations are available. ■APPLICATIONS ■FEATURES ●Microprocessor reset circuitry Highly Accurate : ±2% Low Power Consumption : 0.7 μA [ VIN=1.5V ] (TYP.) Detect Voltage Range : 0.8V ~ 1.5V in 0.1V increments (Low Voltage) : 1.6V～6.0V in 0.1V increments (Standard Voltage) Operating Voltage Range : 0.7V ~ 6.0V (Low Voltage) : 0.7V～10.0V (Standard Voltage) Detect Voltage Temperature characteristics : ±100ppm/℃ (TYP.) Output Configuration : N-ch open drain output or CMOS ●Memory battery back-up circuits ●Power-on reset circuits ●Power failure detection ●System battery life and charge voltage monitors Operating Ambient Temperature : -40℃~+85℃ Package USP-3 Environmentally Friendly: EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUITS ■TYPICAL PERFORMANCE CHARACTERISTICS 1/16 XC61G Series ■PIN CONFIGURATION VIN VIN VOUT VSS (BOTTOM VIEW) ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 3 VIN Supply Voltage 1 VSS Ground 2 VOUT Output USP-3 ■PRODUCT CLASSIFICATION ●Ordering Information XC61G ①②③④⑤⑥⑦-⑧(*1) DESIGNATOR ITEM ① Output Configuration ②③ Detect Voltage 08 ~ 60 ④ Output Delay 0 No delay ⑤ Detect Accuracy 2 Within ± 2% ⑥⑦-⑧ Packages (Order Unit) HR USP-3 (3,000/Reel) HR-G USP-3 (3,000/Reel) (*1) SYMBOL DESCRIPTION C CMOS output N N-ch open drain output e.g. 0.8V → ②0, ③8 e.g. 1.5V → ②1, ③5 The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. ■BLOCK DIAGRAMS (1) CMOS Output 2/16 (2) N-ch Open Drain Output XC61G Series ■ABSOLUTE MAXIMUM RATINGS Ta = 25℃ PARAMETER SYMBOL *1 *2 *1 *2 Input Voltage Output Current VIN IOUT CMOS Output Voltage N-ch Open Drain Output *1 N-ch Open Drain Output *2 Power Dissipation USP-3 Operating Ambient Temperature Storage Temperature Range VOUT Pd Topr Tstg RATINGS VSS-0.3 ~ 9.0 VSS-0.3 ~ 12.0 50 50 VSS -0.3 ~ VIN +0.3 VSS -0.3 ~ 9.0 VSS -0.3 ~ 12.0 120 -40～+85 -40～+125 UNITS V mA V mW ℃ ℃ ■ELECTRICAL CHARACTERISTICS VDF(T) = 0.8 to 6.0V ± 2% Ta=25℃ PARAMETER SYMBOL Detect Voltage VDF Hysteresis Range VHYS Supply Current ISS Operating Voltage VIN CONDITIONS VDF(T)=0.8V~1.5V*1 VDF(T)=1.6V~6.0V*2 VDF x 0.05 0.7 0.8 0.9 1.0 1.1 - MAX. VDF x 1.02 VDF x 0.08 2.3 2.7 3.0 3.2 3.6 6.0 10.0 VIN =0.7V 0.10 0.80 - VIN =1.0V 0.85 2.70 - - -7.5 -1.5 VIN =1.0V 1.0 2.2 - VIN =2.0V 3.0 7.7 - VIN =3.0V 5. 0 10.1 - VIN = 1.5V VIN = 2.0V VIN = 3.0V VIN = 4.0V VIN = 5.0V VDF(T) = 0.8V to 1.5V VDF(T) = 1.6V to 6.0V N-ch, VDS = 0.5V Output Current (Low Voltage) MIN. VDF x 0.98 VDF x 0.02 0.7 0.7 CMOS, P-ch, VDS=2.1V VIN =6.0V IOUT Output Current (Standard Voltage) N-ch, VDS = 0.5V CMOS, P-ch, VDS=2.1V CMOS Output Leakage ILEAK (Pch) Current N-ch Open Drain Temperature ΔVDF/ Characteristics (ΔTopr･VDF) Delay Time tDLY (VDR → VOUT inversion) TYP. VDF VIN =4.0V 6.0 11.5 - VIN =5.0V 7.0 13.0 - VIN =8.0V - -10.0 -2.0 - -10 - VIN=VDFx0.9, VOUT=0V UNITS CIRCUITS V 1 V 1 μA 2 V 1 3 4 mA 3 4 nA 3 *1 VIN=6.0V, VOUT=6.0V VIN=10.0V, VOUT=10.0V*2 - 10 100 -40℃ ≦ Topr ≦ 85℃ - ±100 - ppm/ ℃ 1 VDR→VOUT inversion - 0.03 0.2 ms 5 NOTE: ＊ 1：Low Voltage (VDF(T)=0.8Ｖ～1.5V) ＊ 2：Standard Voltage (VDF(T)=1.6Ｖ～6.0V) VDF(T): Nominal detect voltage Release Voltage: VDR = VDF + VHYS 3/16 XC61G Series ■OPERATIONAL EXPLANATION ●CMOS output ① When input voltage (VIN) is higher than detect voltage (VDF), output voltage (VOUT) will be equal to VIN. (A condition of high impedance exists with N-ch open drain output configurations.) ② When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage (VSS) level. ③ When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become unstable. (As for the N-ch open drain product of XC61CN, the pull-up voltage goes out at the output voltage.) ④ When input voltage (VIN) rises above the ground voltage (VSS) level, output will be unstable at levels below the minimum operating voltage (VMIN). Between the VMIN and detect release voltage (VDR) levels, the ground voltage (VSS) level will be maintained. ⑤ When input voltage (VIN) rises above detect release voltage (VDR), output voltage (VOUT) will be equal to VIN. (A condition of high impedance exists with N-ch open drain output configurations.) ⑥ The difference between VDR and VDF represents the hysteresis range. ●Timing Chart 4/16 XC61G Series ■NOTES ON USE 1. Please use this IC within the stated absolute maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. When a resistor is connected between the VIN pin and the power supply with CMOS output configurations, oscillation may occur as a result of voltage drops at RIN if load current (IOUT) exists. (refer to the Oscillation Description (1) below) 3. When a resistor is connected between the VIN pin and the power supply with CMOS output configurations, irrespective of N-ch open-drain output configurations, oscillation may occur as a result of through current at the time of voltage release even If load current (IOUT) does not exist. (refer to the Oscillation Description (2) below ) 4. Please use N-ch open drain output configuration, when a resistor RIN is connected between the VIN pin and power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF, please test with the actual device. (refer to the Oscillation Description (1) below) 5. With a resistor RIN connected between the VIN pin and the power supply, the VIN pin voltage will be getting lower than the power supply voltage as a result of the IC's supply current flowing through the VIN pin. 6. In order to stabilize the IC's operations, please ensure that VIN pin input frequency's rise and fall times are more than 2 μ s/ V. 7. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. Power supply ●Oscillation Description (1) Load current oscillation with the CMOS output configuration When the voltage applied at power supply, release operations commence and the detector's output voltage increases. Load current (IOUT) will flow at RL. Because a voltage drop (RIN x IOUT) is produced at the RIN resistor, located between the power supply and the VIN pin, the load current will flow via the IC's VIN pin. The voltage drop will also lead to a fall in the voltage level at the VIN pin. When the VIN pin voltage level falls below the detect voltage level, detect operations will commence. Following detect operations, load current flow will cease and since voltage drop at RIN will disappear, the voltage level at the VIN pin will rise and release operations will begin over again. Oscillation may occur with this "release - detect - release" repetition. Further, this condition will also appear via means of a similar mechanism during detect operations. (2) Oscillation as a result of through current Since the XC61G series are CMOS IC S, through current will flow when the IC's internal circuit switching operates (during release and detect operations). Consequently, oscillation is liable to occur as a result of drops in voltage at the through current's resistor (RIN) during release voltage operations. (refer to Figure 3 ) Since hysteresis exists during detect operations, oscillation is unlikely to occur. Power supply Power supply 5/16 XC61G Series ■TEST CIRCUITS 6/16 XC61G Series ■TYPICAL PERFORMANCE CHARACTERISTICS ●Low Voltage Note: Unless otherwise stated, the N-ch open drain pull-up resistance value is 100kΩ. 7/16 XC61G Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) ●Low Voltage (Continued) 8/16 XC61G Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) ●Standard Voltage 9/16 XC61G Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) ●Standard Voltage (Continued) Note: Unless otherwise stated, the N-ch open drain pull-up resistance value is 100kΩ. XC61GC4502 (4.5V) XC61CC4502 (4.5V品) 80 Ta=25℃ Output Current: I (mA) OUT 70 60 VIN =4.0V 3.5V 50 40 3.0V 30 2.5V 20 2.0V 10 1.5V 0 0 0.5 1.0 1.5 2.0 VDS (V) 10/16 2.5 3.0 3.5 4.0 XC61G Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) ●Standard Voltage (Continued) 11/16 XC61G Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) ●Standard Voltage (Continued) 12/16 XC61G Series ■PACKAGING INFORMATION ●USP-3 13/16 XC61G Series ■PACKAGING INFORMATION (Continued) ●USP-3 Reference Pattern Layout Dimension 14/16 Reference metal mask design XC61G Series ■MARKING RULE ●USP-3 USP-3 （TOP VIEW） represents integer of output voltage and detect voltage ① CMOS Output (XC61GC series) N-ch Open Drain Output (XC61GN series) MARK VOLTAGE (V) MARK VOLTAGE (V) A B C D E F H 0.X 1.X 2.X 3.X 4.X 5.X 6.X K L M N P R S 0.X 1.X 2.X 3.X 4.X 5.X 6.X ② represents decimal number of detect voltage Ex: MARK VOLTAGE (V) PRODUCT SERIES 3 0 X.3 X.0 XC61G**3 XC61G**0 ③ represents delay time MARK 3 Delay Time No PRODUCT SERIES XC61G***0 ④ represents production lot number 0 to 9,A to Z reverse character 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) 15/16 XC61G Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 16/16