XC6503 Series
ETR0346-008
CL Capacitor-Less 500mA Low Power Consumption High Speed LDO Regulator
■GENERAL DESCRIPTION
The XC6503 series is a 500mA high speed CMOS LDO regulator that can provide stable output voltages even without a load
capacitor CL. The devices are available in fixed output voltage from 1.2V to 5.0V in 0.05V increments
The CL capacitor-less is possible because phase compensation is carried out internally unlike other LDOs where it is done
externally. It results in saving board design space. The current limit fold-back circuit and thermal shutdown circuit work as
protection circuit. The XC6503P is a 3-Terminal regulator and the XC6503D has a chip enable function, which enables the
entire circuit to be turned off by a low level input signal to the CE pin.
When a CL capacitor is used, the IC can discharge the electric charge stored at the output capacitor through the internal switch
while in standby state, and as a result the VOUT quickly returns to the VSS level.
■APPLICATIONS
■FEATURES
●Smart phones / Mobile phones
●Portable game consoles
●Modules (wireless, cameras,etc.)
●Bluetooth modules
●Digital TV tuner modules
Maximum Output Current
:
500mA
Input Voltage Range
:
1.7V ～ 6.0V
Output Voltage Range
:
1.2V ～ 5.0V (0.05V increments)
Output Accuracy
:
±1.0% (2.0V～5.0V)
±20mV (1.2V～1.95V)
Temperature Stability
:
±30ppm/℃
Dropout Voltage
:
190mV＠VOUT=2.8V, IOUT =300mA
Low Power Consumption
:
15μA (TYP.), 0.1μA (in standby)
High PSRR
:
55dB＠1kHz, VOUT=2.8V
Protection Current
:
Current Limiter （630mA TYP.）
Short-circuit Protection
Thermal Shutdown
CL Capacitor-Less
:
Internal Phase Compensation
Operating Ambient Temperature
:
-40℃～+85℃
Packages
:
USP-4, SOT-25, SOT-89-5 (XC6503D)
SOT-89 (XC6503P)
Environmentally Friendly
EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
X C6 5 0 3 x2 8 1 xx
250
VIN=3.8V, tr=tf=5μs, IO UT=10⇔150mA, Ta=25℃
CL =0.1μF(ceramic)
without CL
3.4
3.1
OutputVoltage
2.8
200
2.5
150
OutputCurrent
100
2.2
50
1.9
0
1.6
OutputVoltage : VOUT (V)
300
OutputCurrent : I OUT (mA)
■TYPICAL APPLICATION CIRCUIT
:
Time : 40μs/div
1/26
XC6503 Series
■PIN CONFIGURATION
*The dissipation pad for the USP-4 package should be solder-plated in reference mount pattern and metal masking so as to enhance mounting
strength and heat release.
If the pad needs to be connected to other pins, it should be connected to the VSS (No. 2) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
3
VIN
Power Input
1
VOUT
Output
2
2
VSS
Ground
3
-
CE
ON/OFF Control
1
-
NC
No Connection
USP-4
SOT-25
SOT89-5
SOT-89
4
1
4
1
5
5
2
2
3
3
-
4
■PIN FUNCTION ASSIGNMENT
XC6503 Series (D Type)
PIN NAME
CE
2/26
LOGIC
IC OPERATION
L
Operation OFF
H
Operation ON
OPEN
Operation OFF
XC6503
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC6503①②③④⑤⑥-⑦(
DESIGNATOR
①
XC6503D with ON/OFF function
*1)
ITEM
SYMBOL
Type of Regulator
(*2)
D
DESCRIPTION
CE Active High, with CE Pull-down, CL discharge
②③
Output Voltage (*3)
④
Output Accuracy
1
GR-G
USP-4 (3,000/Reel)
⑤⑥-⑦
Packages (Order Unit)
MR-G
SOT-25 (3,000/Reel)
PR-G
SOT-89-5 (1,000/Reel)
12～50
ex.) ②=2, ③=8 → 2.8V
±0.02V (1.2～1.9V)、±1% (2.0～5.0V)
(*1)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
For without CE Pull-down or without CL discharge function, please contact your local Torex sales office or representative.
(*3)
For the output voltage in 0.05V increments, please contact your local Torex sales office or representative.
(*2)
●Ordering Information
XC6503P 3-Terminal regulator
XC6503①②③④⑤⑥-⑦(*1)
DESIGNATOR
ITEM
①
Type of Regulator
②③
(*1)
(*2)
Output Voltage
SYMBOL
(*2)
P
12～50
④
Output Accuracy
1
⑤⑥-⑦
Packages (Order Unit)
PR-G
DESCRIPTION
3-Terminal regulator, without CE pin
ex.) ②=2、③=8 → 2.8V
±0.02V (1.2～1.9V)、±1% (2.0～5.0V)
SOT-89 (1,000/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.
For the output voltage in 0.05V increments, please contact your local Torex sales office or representative.
3/26
XC6503 Series
■BLOCK DIAGRAMS
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
Input Voltage
Output Current
Output Voltage
CE Input Voltage
USP-4
SOT-25
Power Dissipation
SOT-89-5
SOT-89
USP-4
SOT-25
Power Dissipation (*2)
(PCB mounted)
SOT-89-5
SOT-89
Operating Ambient Temperature
Storage Temperature
Ta=25℃
UNITS
SYMBOL
RATINGS
VIN
IOUT
VOUT
VCE
VSS-0.3～VSS+6.5
850 (*1)
VSS-0.3～VIN+0.3≦VSS+6.5
VSS-0.3～VSS+6.5
120
250
500
500
1000
600
1300
1000
-40～+85
-55～+125
Pd
Pd
Topr
Tstg
V
mA
V
V
mW
mW
℃
℃
(*1) Pd＞（VIN-VOUT）×IOUT
(*2) The power dissipation measured with the test board condition is listed as reference data.
4/26
Please refer to page 21～24 for details.
XC6503
Series
■ELECTRICAL CHARACTERISTICS
●XC6503D Type
Ta=25℃
PARAMETER
SYMBOL
Output Voltage
Maximum Output
Current
Load Regulation
Dropout Voltage
(*5)
VOUT(E)
ΔVOUT
Vdif
ISS
ISTB
Output Voltage
Temperature
Characteristics
B
ΔVOUT/
(ΔVIN・VOUT)
(*3)
OUT（T）
, VCE=VIN, IOUT=10mA
2.0V≦VOUT（T）, VCE=VIN, IOUT=10mA
VCE=VIN
Supply Current
Input Voltage
2.0V＞V
IOUTMAX
Stand-by Current
Line Regulation
(*2)
CONDITIONS
MIN.
－0.02
×0.99
TYP.
(*4)
-
VCE=VIN, 0.1mA≦IOUT≦300mA
-
20
VCE=VIN , IOUT=300mA
-
VIN=VCE=6.0V, IOUT=0mA
-
15
VIN=6.0V, VCE=VSS
-
0.01
VCE=VIN, IOUT=30mA
VIN
ΔVOUT/
VCE=VIN, IOUT=30mA
(ΔTopr・VOUT)
-40℃≦Topr≦85℃
＋0.02
VOUT（T）
500
VOUT(T)+0.5V≦VIN≦6.0V,
MAX.
(*4)
×1.01
-
(*4)
50
E-1
E-2
UNITS
CIRCUITS
V
①
mA
①
(*4)
mV
①
mV
①
30
μA
②
0.1
μA
②
%/V
①
(*8)
(*9)
1.7
-
6.0
V
①
-
±30
-
ppm/℃
①
-
55
-
dB
③
510
630
750
mA
①
-
120
210
mA
①
VOUT(T)≦4.75V
VIN=｛VOUT(T)+1.0｝VDC+0.5Vp-pAC
Power Supply
Rejection Ratio
PSRR
VCE=VIN, IOUT=30mA, f=1kHz
VOUT(T)≧4.80V
VIN=5.75VDC+0.5Vp-pAC
VCE=VIN, IOUT=30mA, f=1kHz
Current Limit
ILIM
VCE=VIN
VCE=VIN
Short-circuit Current
ISHORT
CE High Level Voltage
VCEH
1.0
-
6.0
V
①
CE Low Level Voltage
VCEL
VSS
-
0.3
V
①
CE High Level
Current
ICEH
VIN=VCE=6.0V
3.5
6
10
μA
①
CE Low Level Current
ICEL
VCE=VSS
-0.1
-
0.1
μA
①
VIN=6.0V, VOUT=5.0V, VCE=VSS
300
430
500
Ω
①
CL Discharge
(*10)
Resistance
Thermal Shutdown
Detect Temperature
Thermal Shutdown
Release
Temperature
Thermal Shutdown
Hysteresis Width
RDCHG
Short VOUT to VSS level
TTSD
Junction Temperature
-
150
-
℃
-
TTSR
Junction Temperature
-
125
-
℃
-
THYS
TTSD-TTSR
-
25
-
℃
-
NOTE:
(*3)
(*1) Unless otherwise stated regarding input voltage conditions, VIN=VOUT(T) +1.0V.
(*2) VOUT(E): Effective output voltage
(i.e. the output voltage when “VOUT(T)+1.0V” is provided at the VIN pin while maintaining a certain IOUT value.)
(*3) VOUT(T): Nominal output voltage
(*4) Characteristics of the actual VOUT(E) by setting output voltage is shown in the voltage chart.
(*7)
(*6)
(*5) Vdif＝VIN1 －VOUT1
(*6) VOUT1 is a voltage equal to 98% of the output voltage whenever an amply stabilized IOUT {VOUT(T)+1.0V} is input
(*7) VIN1 is an input voltage when VOUT1 appears at the VOUT pin while the input voltage is gradually decreased.
(*8) E-1:DROPOUT VOLTAGE (Refer to Voltage Chart.)
(*9) E-2:LINE REGULATION (Refer to Voltage Chart.)
(*10) This function is built in the XC6503B/D series only.
The XC6503A/C series discharges by only R1+ R2 resistors as shown in the block diagrams.
5/26
XC6503 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC6503P Type
Ta=25℃
PARAMETER
SYMBOL
Output Voltage
VOUT(E)
CONDITIONS
(*3)
Maximum Output
Current
Load Regulation
Dropout Voltage
(*5)
Supply Current
Line Regulation
Input Voltage
Output Voltage
Temperature
Characteristics
(*2)
2.0V＞VOUT（T）
, IOUT=10mA
2.0V≦VOUT（T）, IOUT=10mA
Vdif
ISS
ΔVOUT/
(ΔVIN・VOUT)
ΔVOUT/
×0.99
(*4)
-
20
IOUT=300mA
-
VIN= 6.0V, IOUT=0mA
-
IOUT=30mA
-40℃≦Topr≦85℃
＋0.02
VOUT（T）
0.1mA≦IOUT≦300mA
VOUT(T)+0.5V≦VIN≦6.0V, IOUT=30mA
MAX.
(*4)
-
VIN
(ΔTopr・VOUT)
－0.02
TYP.
500
IOUTMAX
ΔVOUT
MIN.
×1.01
E-2
(*9)
15
-
(*4)
50
(*8)
CIRCUITS
V
①
mA
①
(*4)
-
E-1
UNITS
30
mV
①
mV
①
μA
②
%/V
①
1.7
-
6.0
V
①
-
±30
-
ppm/℃
①
-
55
-
dB
③
VOUT(T)≦4.75V
VIN=｛VOUT(T)+1.0｝VDC+0.5Vp-pAC
Power Supply
Rejection Ratio
PSRR
IOUT=30mA, f=1kHz
VOUT(T)≧4.80V
VIN=5.75VDC+0.5Vp-pAC
IOUT=30mA, f=1kHz
Current Limit
ILIM
510
630
750
mA
①
Short-circuit Current
ISHORT
Short VOUT to VSS level
-
120
210
mA
①
TTSD
Junction Temperature
-
150
-
℃
-
TTSR
Junction Temperature
-
125
-
℃
-
THYS
TTSD-TTSR
-
25
-
℃
-
Thermal Shutdown
Detect Temperature
Thermal Shutdown
Release
Temperature
Thermal Shutdown
Hysteresis Width
NOTE:
(*3)
(*1) Unless otherwise stated regarding input voltage conditions, VIN=VOUT(T) +1.0V.
(*2) VOUT(E): Effective output voltage
(i.e. the output voltage when “VOUT(T)+1.0V” is provided at the VIN pin while maintaining a certain IOUT value.)
(*3) VOUT(T): Nominal output voltage
(*4) Characteristics of the actual VOUT(E) by setting output voltage is shown in the voltage chart.
(*7)
(*6)
(*5) Vdif＝VIN1 －VOUT1
(*6) VOUT1 is a voltage equal to 98% of the output voltage whenever an amply stabilized IOUT {VOUT(T)+1.0V} is input
(*7) VIN1 is an input voltage when VOUT1 appears at the VOUT pin while the input voltage is gradually decreased.
(*8) E-1:DROPOUT VOLTAGE (Refer to Voltage Chart.)
(*9) E-2:LINE REGULATION (Refer to Voltage Chart.)
6/26
XC6503
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart
Ta=25℃
E-0
E-1
E-2
E-0
E-1
E-2
NOMINAL
OUTPUT
DROPOUT
LINE
NOMINAL
OUTPUT
DROPOUT
LINE
VOLTAGE
VOLTAGE
VOLTAGE
REGULATION
VOLTAGE
VOLTAGE
VOLTAGE
REGULATION
(V)
(V)
(mV)
(%/V)
(V)
(V)
(mV)
VOUT(T)
VOUT(E)
ΔVOUT/
Vdif
(ΔVIN・VOUT)
VOUT(T)
VOUT(E)
(%/V)
ΔVOUT/
Vdif
(ΔVIN・VOUT)
MIN.
MAX.
TYP.
MAX.
TYP.
MAX.
MIN.
MAX.
TYP.
MAX.
TYP.
MAX.
1.200
1.1800
1.2200
555
660
0.1
0.25
3.150
3.1185
3.1815
190
250
0.1
0.2
1.250
1.2300
1.2700
↑
↑
↑
↑
3.200
3.1680
3.2320
170
230
↑
↑
1.300
1.2800
1.3200
↑
↑
↑
0.2
3.250
3.2175
3.2825
↑
↑
↑
↑
1.350
1.3300
1.3700
↑
↑
↑
↑
3.300
3.2670
3.3330
↑
↑
↑
↑
1.400
1.3800
1.4200
440
560
↑
↑
3.350
3.3165
3.3835
↑
↑
↑
↑
1.450
1.4300
1.4700
↑
↑
↑
↑
3.400
3.3660
3.4340
↑
↑
↑
↑
1.500
1.4800
1.5200
↑
↑
↑
↑
3.450
3.4155
3.4845
↑
↑
↑
↑
1.550
1.5300
1.5700
↑
↑
↑
↑
3.500
3.4650
3.5350
↑
↑
↑
↑
1.600
1.5800
1.6200
360
450
↑
↑
3.550
3.5145
3.5855
↑
↑
↑
↑
1.650
1.6300
1.6700
↑
↑
↑
↑
3.600
3.5640
3.6360
155
210
↑
↑
1.700
1.6800
1.7200
↑
↑
↑
↑
3.650
3.6135
3.6865
↑
↑
↑
↑
1.750
1.7300
1.7700
↑
↑
↑
↑
3.700
3.6630
3.7370
↑
↑
↑
↑
1.800
1.7800
1.8200
300
390
↑
↑
3.750
3.7125
3.7875
↑
↑
↑
↑
1.850
1.8300
1.8700
↑
↑
↑
↑
3.800
3.7620
3.8380
↑
↑
↑
↑
1.900
1.8800
1.9200
↑
↑
↑
↑
3.850
3.8115
3.8885
↑
↑
↑
↑
1.950
1.9300
1.9700
↑
↑
↑
↑
3.900
3.8610
3.9390
↑
↑
↑
↑
2.000
1.9800
2.0200
265
330
↑
↑
3.950
3.9105
3.9895
↑
↑
↑
↑
2.050
2.0295
2.0705
↑
↑
↑
↑
4.000
3.9600
4.0400
↑
↑
↑
↑
2.100
2.0790
2.1210
↑
↑
↑
↑
4.050
4.0095
4.0905
↑
↑
↑
↑
2.150
2.1285
2.1715
↑
↑
↑
↑
4.100
4.0590
4.1410
↑
↑
↑
↑
2.200
2.1780
2.2220
240
310
↑
↑
4.150
4.1085
4.1915
↑
↑
↑
↑
2.250
2.2275
2.2725
↑
↑
↑
↑
4.200
4.1580
4.2420
140
195
↑
↑
2.300
2.2770
2.3230
↑
↑
↑
↑
4.250
4.2075
4.2925
↑
↑
↑
↑
2.350
2.3265
2.3735
↑
↑
↑
↑
4.300
4.2570
4.3430
↑
↑
↑
↑
2.400
2.3760
2.4240
↑
↑
↑
↑
4.350
4.3065
4.3935
↑
↑
↑
↑
2.450
2.4255
2.4745
↑
↑
↑
↑
4.400
4.3560
4.4440
↑
↑
↑
↑
2.500
2.4750
2.5250
210
270
↑
↑
4.450
4.4055
4.4945
↑
↑
↑
↑
2.550
2.5245
2.5755
↑
↑
↑
↑
4.500
4.4550
4.5450
↑
↑
↑
↑
2.600
2.5740
2.6260
↑
↑
↑
↑
4.550
4.5045
4.5955
↑
↑
↑
↑
2.650
2.6235
2.6765
↑
↑
↑
↑
4.600
4.5540
4.6460
↑
↑
↑
↑
2.700
2.6730
2.7270
↑
↑
↑
↑
4.650
4.6035
4.6965
↑
↑
↑
↑
2.750
2.7225
2.7775
↑
↑
↑
↑
4.700
4.6530
4.7470
↑
↑
↑
↑
2.800
2.7720
2.8280
190
250
↑
↑
4.750
4.7025
4.7975
↑
↑
↑
↑
2.850
2.8215
2.8785
↑
↑
↑
↑
4.800
4.7520
4.8480
↑
↑
↑
↑
2.900
2.8710
2.9290
↑
↑
↑
↑
4.850
4.8015
4.8985
↑
↑
↑
↑
2.950
2.9205
2.9795
↑
↑
↑
↑
4.900
4.8510
4.9490
↑
↑
↑
↑
3.000
2.9700
3.0300
↑
↑
↑
↑
4.950
4.9005
4.9995
↑
↑
↑
↑
3.050
3.0195
3.0805
↑
↑
↑
↑
5.000
4.9500
5.0500
↑
↑
↑
↑
3.100
3.0690
3.1310
↑
↑
↑
↑
7/26
XC6503 Series
■ OPERATIONAL EXPLANATION
The voltage divided by resistors R1 and R2 is compared with the internal reference voltage by the error amplifier. The
P-channel MOSFET which is connected to the VOUT pin is then driven by the subsequent output signal. The output voltage at the
VOUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit and short circuit protection operate
in relation to the level of output current and heat dissipation. Current limit circuit and short protection circuit operate with output
current and thermal shutdown circuit will operate with heating. Further, the IC’s internal circuitry can be shutdown via the CE pin
signal.
XC6503 Series D Type
<CL Auto-Discharge Function>
XC6503D can quickly discharge the electric charge at the output capacitor (CL), when a low signal to the CE pin, which enables
a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the VOUT pin and the VSS pin (cf.
BLOCK DIAGRAM). The CL discharge resistance is set to 430Ω when VIN is 6.0V (TYP.) and VOUT is 5.0V (TYP.). Moreover,
discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (RDCHG) and the output capacitor (CL). By
setting time constant of a CL auto-discharge resistance value (RDCHG) and an output capacitor value (CL) as τ(τ=C x R), the
output voltage after discharge via the N-channel transistor is calculated by the following formula.
–t/
V = VOUT x e τ, or ｔ=τln (VOUT(E) / V)
( V : Output voltage after discharge, VOUT(E) : Initial Output voltage, t: Discharge time,
τ: CL auto-discharge resistance RDCHG×CL Output capacitance
<Current Limiter, Short-Circuit Protection>
The protection circuit operates as a combination of an output current limiter and fold-back short circuit protection. When load
current reaches the current limit level, the output voltage drops. As a result, the load current starts to reduce with showing
fold-back curve. The output current finally falls at the level of 120mA when the VOUT pin is short-circuited.
<Thermal Shutdown>
When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown circuit
operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is
released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal
shutdown release voltage.
<CE Pin>
The IC's internal circuitry can be shutdown via the signal from the CE pin with the XC6503D series. In shutdown mode, output
at the VOUT pin will be pulled down to the VSS level via R1, R2 and CL auto-discharge resistance RDCHG. Please note the
XC6503P does not have the CE pin.
The XC6503D has a pulled down resistor at the CE pin in order to avoid an unstable operation with the CE pin open (the CE
pin is left open, operation will be stopped). However, the CE pin input current will increase slightly through the pulled down
resistor when operating. If the correct output voltage is applied to the CE pin, the logic is fixed and the IC will operate normally.
However, if the medium voltage is input, supply current may increase as a result of an internal through current.
8/26
XC6503
Series
■ NOTES ON USE
1． For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XC6503 series operates even if without attaching an output capacitor. However, when wiring impedance is high,
operations may become unstable due to noise and/or phase lag depending on output current. Please wire the input
capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
3.
The XC6503 installs fold-back current limit circuits. When start-up, this fold-back load curve affects its start-up
characteristics. The XC6503 having output current under 2.4V may not happen to start-up with the load conditions below.
In these cases, sequence control should be taken for connecting a load after the start-up execution.
Load Condition for Start-up：IOUT ≧ VOUT(T)/4.8
VOUT(T)：Nominal Output Voltage
CIN=CL =0.1μF(ceramic),VIN=VOUT+1V
3.2
XC6503x281
OutputVoltage : VOUT (V)
2.8
2.4
2.0
Start-up defect area which
it may happen.
1.6
●CONDITION
NOMINAL VOLTAGE
LOAD CONDITION FOR START-UP
1.2V
≦250mA
1.5V
≦312mA
1.8V
≦375mA
XC6503x121
1.2
0.8
0.4
0.0
0
100
200
300
400
500
600
700
OutputCurrent : I OUT (mA)
4.
Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
9/26
XC6503 Series
■TEST CIRCUITS
●Circuit ①
●測定回路①
CIN=0.1μF
(ceramic)
VIN
V
A
CE
V
IOUT
VOUT
VSS
A
V
●Circuit ②
●測定回路②
A
VIN
V
CE
VOUT
VSS
●Circuit ③
●測定回路③
VIN
V
CE
IOUT
VOUT
VSS
* For the XC6503P series, CE pin is connected to the VIN internally.
10/26
A
V
XC6503
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) OutputVoltage v.s. OutputCurrent
XC6503x121xx
XC6503x121xx
VIN=2.2V
1.6
VIN=1.7V
1.4
OutputVoltage : VOUT (V)
OutputVoltage : VOUT (V)
1.4
1.2
Ta=-40℃
Ta=25℃
Ta=85℃
1.0
0.8
0.6
0.4
0.2
VIN=2.2V
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0
0
100
200
300
400
500
600
700
0
100
200
300
400
500
OutputCurrent : IOUT (mA)
OutputCurrent : IOUT (mA)
XC6503x281xx
XC6503x281xx
VIN=3.8V
3.6
OutputVoltage : VOUT (V)
2.4
Ta=-40℃
Ta=25℃
Ta=85℃
2.0
1.6
1.2
0.8
0.4
700
Ta=25℃
VIN=3.3V
3.2
2.8
600
3.6
3.2
OutputVoltage : VOUT (V)
Ta=25℃
1.6
VIN=3.8V
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
0.0
0
100
200
300
400
500
600
700
0
100
200
OutputCurrent : IOUT (mA)
300
400
500
600
700
OutputCurrent : IOUT (mA)
(2) OutputVoltage v.s. InputVoltage
XC6503x121xx
XC6503x121xx
IOUT=30mA
1.6
1.4
1.24
OutputVoltage : VOUT (V)
OutputVoltage : VOUT (V)
IOUT=30mA
1.26
1.2
1.0
0.8
0.6
0.4
Ta=85℃
Ta=25℃
0.2
1.22
1.20
1.18
1.16
1.14
Ta=85℃
Ta=25℃
1.12
Ta=-40℃
Ta=-40℃
1.10
0.0
0
1
2
3
4
InputVoltage : VIN (V)
5
6
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
InputVoltage : VIN (V)
11/26
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) OutputVoltage v.s. InputVoltage
XC6503x281xx
XC6503x281xx
IOUT=30mA
3.6
2.84
OutputVoltage : VOUT (V)
OutputVoltage : VOUT (V)
3.2
2.8
2.4
2.0
1.6
1.2
0.8
Ta=85℃
0.4
Ta=-40℃
Ta=25℃
2.82
2.80
2.78
2.76
2.74
Ta=85℃
Ta=25℃
2.72
0.0
Ta=-40℃
2.70
0
1
2
3
4
5
6
3.0
3.5
4.0
4.5
5.0
InputVoltage : VIN (V)
InputVoltage : VIN (V)
XC6503x501xx
XC6503x501xx
IOUT=30mA
6.0
5.5
6.0
IOUT=30mA
5.06
5.04
5.0
OutputVoltage : VOUT (V)
OutputVoltage : VOUT (V)
IOUT=30mA
2.86
4.0
3.0
2.0
Ta=85℃
Ta=25℃
1.0
5.02
5.00
4.98
4.96
4.94
Ta=85℃
Ta=25℃
4.92
Ta=-40℃
0.0
Ta=-40℃
4.90
0
1
2
3
4
5
6
5.2
5.4
InputVoltage : VIN (V)
5.6
5.8
6.0
InputVoltage : VIN (V)
(3) DropoutVoltage v.s. OutputCurrent
XC6503x121xx
XC6503x281xx
900
900
DropoutVoltage : Vdif (mV)
800
Ta=25℃
700
Ta=-40℃
600
* Below is the forbidden
area due to the minimum
operating voltage.
500
400
300
200
100
800
Ta=85℃
700
Ta=-40℃
Ta=25℃
600
500
400
300
200
100
0
0
0
100
200
300
OutputCurrent : IOUT (mA)
12/26
DropoutVoltage : Vdif (mV)
Ta=85℃
400
500
0
100
200
300
OutputCurrent : IOUT (mA)
400
500
XC6503
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) DropoutVoltage v.s. OutputCurrent
XC6503x501xx
900
Ta=85℃
DropoutVoltage : Vdif (mV)
800
Ta=25℃
700
Ta=-40℃
600
500
400
300
200
100
0
0
100
200
300
400
500
OutputCurrent : IOUT (mA)
(4) SupplyCurrent v.s. InputVoltage
XC6503x281xx
40
40
36
36
32
32
SupplyCurrent : ISS (μA)
SupplyCurrent : ISS (μA)
XC6503x121xx
28
24
20
16
12
8
Ta=85℃
Ta=25℃
4
28
24
20
16
12
Ta=85℃
8
Ta=25℃
4
Ta=-40℃
0
Ta=-40℃
0
0
1
2
3
4
5
6
InputVoltage : VIN (V)
0
1
2
3
4
5
6
InputVoltage : VIN (V)
XC6503x501xx
40
SupplyCurrent : ISS (μA)
36
32
28
24
20
16
12
Ta=85℃
8
Ta=25℃
4
Ta=-40℃
0
0
1
2
3
4
5
6
InputVoltage : VIN (V)
13/26
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) OutputVoltage v.s. AmbientTemperature
XC6503x121xx
XC6503x281xx
VIN=2.2V
1.26
VIN=3.8V
2.95
IOUT=10mA
IOUT=30mA
1.24
IOUT=300mA
1.22
1.20
1.18
1.16
1.14
-50
-25
0
25
50
75
IOUT=30mA
2.90
OutputVoltage : VOUT (V)
OutputVoltage : VOUT (V)
IOUT=10mA
IOUT=300mA
2.85
2.80
2.75
2.70
2.65
-50
100
AmbientTemperature : Ta (℃)
-25
0
25
50
75
100
AmbientTemperature : Ta (℃)
XC6503x501xx
VIN=6.0V
5.20
IOUT=10mA
OutputVoltage : VOUT (V)
5.15
IOUT=30mA
IOUT=300mA
5.10
5.05
5.00
4.95
4.90
4.85
4.80
-50
-25
0
25
50
75
100
AmbientTemperature : Ta (℃)
(6) Rising Respose Time
XC6503x121xx
2.4
1
2.0
0
OutputVoltage
1.6
-1
1.2
-2
0.8
-3
0.4
-4
0.0
Time : 40μs/div
14/26
4.2
InputVoltage
2.8
2
VIN=0V→3.8V
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
4
3.5
OutputVoltage
OutputVoltage : VOUT (V)
InputVoltage
6
3.2
InputVoltage : VIN (V)
InputVoltage : VIN (V)
3
XC6503x281xx
OutputVoltage : VOUT (V)
4
VIN=0V→2.2V
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
2
2.8
0
2.1
-2
1.4
-4
0.7
-6
0.0
Time : 40μs/div
XC6503
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Rising Respose Time
XC6503x501xx
VIN=0V→6.0V
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
8
8.0
InputVoltage
7.0
4
OutputVoltage
OutputVoltage : VOUT (V)
InputVoltage : VIN (V)
6
6.0
2
5.0
0
4.0
-2
3.0
-4
2.0
-6
1.0
-8
0.0
Time : 40μs/div
(7) Rush Current
XC6503x281xx
600
7
600
400
6
5
200
RushCurrent
4
0
InputVoltage
3
-200
OutputVoltage
-400
-600
-800
2
Rush Current : IRUSH (mA)
800
Voltage : VIN (V), VOUT (V)
8
800
Rush Current : IRUSH (mA)
VIN=0V→3.8V
tr=5μs, CL=0.1μF(ceramic), IOUT=30mA, Ta=25℃
VIN=0V→3.8V
tr=5μs, CL=22μF(ceramic), IOUT=30mA, Ta=25℃
RushCurrent
8
7
400
6
200
5
4
0
InputVoltage
3
-200
OutputVoltage
-400
1
-600
0
-800
Time : 40μs/div
2
Voltage : VIN (V), VOUT (V)
XC6503x281xx
1
0
Time : 40μs/div
(8) CE Rising Respose Time
XC6503x121xx
2.4
1
2.0
OutputVoltage
1.6
-1
1.2
-2
0.8
-3
0.4
-4
0.0
Time : 40μs/div
4.2
CE Voltage
2.8
2
0
6
VIN=3.8V, Ta=25℃
VＣＥ=0V→3.8V, tr=5μs, Without CL, IOUT=30mA
3.5
4
OutputVoltage
OutputVoltage : VOUT (V)
CE Voltage
3.2
CE Voltage : VCE (V)
CE Voltage : VCE (V)
3
XC6503x281xx
OutputVoltage : VOUT (V)
4
VIN=2.2V, Ta=25℃
VCE=0V→2.2V, tr=5μs, Without CL, IOUT=30mA
2
2.8
0
2.1
-2
1.4
-4
0.7
-6
0.0
Time : 40μs/div
15/26
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) CE Rising Respose Time
XC6503x501xx
8
VIN=6V, Ta=25℃
VCE=0V→6.0V, tr=5μs, Without CL, IOUT=30mA
8.0
CE Voltage
CE Voltage : VCE (V)
OutputVoltage : VOUT (V)
7.0
6
6.0
4
OutputVoltage
2
5.0
0
4.0
-2
3.0
-4
2.0
-6
1.0
-8
0.0
Time : 40μs/div
(9) Line transient response
XC6503x121xx
XC6503x121xx
4
2.4
1.8
0
1.2
-1
-2
4
2
1.8
1
1.5
OutputVoltage
1.2
0.9
-1
0.9
0.6
-2
0.6
Time : 100μs/div
Time : 100μs/div
XC6503x281xx
XC6503x281xx
VIN=3.8V⇔4.8V
tr=5μs, CL=0.1μF(ceramic), IOUT=30mA, Ta=25℃
InputVoltage
2
4.0
6
3.7
4
3.4
0
3.1
OutputVoltage
-2
2.8
-4
-6
Time : 100μs/div
16/26
2.1
0
InputVoltage : VIN (V)
6
InputVoltage : VIN (V)
1.5
OutputVoltage
3
OutputVoltage : VOUT (V)
2
InputVoltage : VIN (V)
2.1
OutputVoltage : VOUT (V)
3
1
2.4
InputVoltage
OutputVoltage : VOUT (V)
InputVoltage : VIN (V)
InputVoltage
VIN=2.2V⇔3.2V
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
VIN=3.8V⇔4.8V
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
InputVoltage
2
4.0
3.7
OutputVoltage : VOUT (V)
4
VIN=2.2V⇔3.2V
tr=5μs, CL=0.1μF(ceramic), IOUT=30mA, Ta=25℃
3.4
0
3.1
OutputVoltage
-2
2.8
2.5
-4
2.5
2.2
-6
2.2
Time : 100μs/div
XC6503
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Line transient response
5.9
7
InputVoltage
6
5.6
5
5.3
5.0
4
OutputVoltage
3
4.7
2
4.4
InputVoltage : VIN (V)
InputVoltage : VIN (V)
7
6.2
8
OutputVoltage : VOUT (V)
8
XC6503x501xx
VIN=5.5V⇔6.0V
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
6.2
5.9
InputVoltage
6
5.6
5
5.3
5.0
4
OutputVoltage
3
4.7
2
4.4
Time : 100μs/div
OutputVoltage : VOUT (V)
XC6503x501xx
VIN=5.5V⇔6.0V
tr=5μs, CL=0.1uF(ceramic), IOUT=30mA, Ta=25℃
Time : 100μs/div
(10) Load transient response
1.5
OutputVoltage
200
1.2
150
0.9
0.6
OutputCurrent
50
0.3
0
0.0
250
100
0.6
50
0.3
0
0.0
XC6503x281xx
2.8
150
2.5
2.2
OutputCurrent
50
1.9
0
1.6
OutputCurrent : IOUT (mA)
3.1
200
Time : 100μs/div
300
3.4
OutputVoltage
100
0.9
OutputCurrent
Time : 40μs/div
OutputVoltage : VOUT (V)
OutputCurrent : IOUT (mA)
250
CL=0.1μF(ceramic)
without CL
1.5
1.2
150
XC6503x281xx
300
1.8
OutputVoltage
200
Time : 100μs/div
VIN=3.8V, tr=tf=5μs, IOUT=0.1⇔50mA, Ta=25℃
CL=0.1μF(ceramic)
without CL
250
VIN=3.8V, tr=tf=5μs, IOUT=10⇔150mA, Ta=25℃
CL=0.1μF(ceramic)
without CL
3.4
3.1
OutputVoltage
200
2.8
150
2.5
OutputCurrent
100
2.2
50
1.9
0
1.6
OutputVoltage : VOUT (V)
100
300
1.8
OutputCurrent : IOUT (mA)
OutputCurrent : IOUT (mA)
250
CL=0.1μF(ceramic)
without CL
OutputVoltage : VOUT (V)
300
XC6503x121xx
VIN=2.2V, tr=tf=5μs, IOUT=10⇔150mA, Ta=25℃
OutputVoltage : VOUT (V)
XC6503x121xx
VIN=2.2V, tr=tf=5μs, IOUT=0.1⇔50mA, Ta=25℃
Time : 40μs/div
17/26
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Load transient response
5.3
OutputVoltage
200
5.0
150
4.7
100
4.4
OutputCurrent
50
4.1
0
3.8
250
OutputCurrent : IOUT (mA)
250
300
5.6
CL=0.1μF(ceramic)
without CL
OutputVoltage : VOUT (V)
300
OutputCurrent : IOUT (mA)
XC6503x501xx
VIN=6.0V, tr=tf=5μs, IOUT=10⇔150mA, Ta=25℃
5.6
CL=0.1μF(ceramic)
without CL
5.3
OutputVoltage
200
5.0
150
4.7
OutputCurrent
100
4.4
50
4.1
0
3.8
Time : 40μs/div
Time : 100μs/div
(11) Ripple Rejection Ratio
XC6503x121xx
VIN=2.2V+0.5VP-PAC, IOUT=30mA, Ta=25℃
80
CL=0.1μF(ceramic)
Without CL
70
60
50
40
30
20
10
0
CL=0.1μF(ceramic)
Without CL
70
60
50
40
30
20
10
0
10
100
1k
10k
Ripple Frequency : f (Hz)
100k
XC6503x501xx
VIN=5.75V+0.5VP-PAC, IOUT=30mA, Ta=25℃
80
Ripple Rejection Ratio : PSRR (dB)
VIN=3.8V+0.5VP-PAC, IOUT=30mA, Ta=25℃
80
Ripple Rejection Ratio : PSRR (dB)
Ripple Rejection Ratio : PSRR (dB)
XC6503x281xx
CL=0.1μF(ceramic)
Without CL
70
60
50
40
30
20
10
0
10
18/26
100
1k
10k
Ripple Frequency : f (Hz)
100k
10
100
1k
10k
Ripple Frequency : f (Hz)
100k
OutputVoltage : VOUT (V)
XC6503x501xx
VIN=6.0V, tr=tf=5μs, IOUT=0.1⇔50mA, Ta=25℃
XC6503
Series
■PACKAGING INFORMATION
●USP-4
●SOT-25
2.9±0.2
+0.1
0.4 -0.05
5
4
0～0.1
1
2
3
+0.1
0.15 -0.05
(0.95)
1.9±0.2
●SOT-89
●SOT-89-5
4.5±0.1
+0.15
1.6 -0.2
+0.03
0.4 -0.02
(0.4)
0.42±0.06
2
5
4
3
(0.1)
0.42±0.06
0.4
+0.03
-0.02
（1.7)
（1.6)
（0.4)
2.5±0.1
2
0.47±0.06
（0.4)
1.5±0.1
（1.8)
1.5±0.1
（0.3)
1.5±0.1
（0.25) （1.85) （0.4)
（1.7)
1.5±0.1
1.5±0.1
1
0.42±0.06
0.8 MIN
+0.03
0.4 -0.02
1.5±0.1
0.42±0.06
(0.1)
0.47±0.06
4.35 MAX
Φ1.0
1.0±0.2
2.5±0.1
4.0±0.25
φ1.0
0.42±0.06
+0.03
0.4 -0.02
0.42±0.06
0.42±0.06
0.8 MIN
4.5±0.1
1.6 +0.15
-0.2
19/26
XC6503 Series
■PACKAGING INFORMATION (Continued)
●USP-4 Reference Pattern Layout
●USP-4 Reference Metal Mask Design
1.0
0.8
0.35
0.35
0.35
4
3
4
3
0.3
0.4
0.35
1
2
0.6
20/26
0.5
1.9
0.3
0.4
0.7
2.0
0.3
1
2
0.6
XC6503
Series
■PACKAGING INFORMATION (Continued)
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm in one side)
2
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
Evaluation Board (Unit：mm)
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
25
1000
85
400
Thermal Resistance (℃/W)
100.00
Power Dissipation: Pd
（mW）
Pd Vs. Ta
1200
1000
800
600
400
200
0
25
45
65
85
105
Ambient
Temperature:
Ta (℃) （℃）
Ambient
TemperatureTa:
125
21/26
XC6503 Series
■PACKAGING INFORMATION (Continued)
●
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm in one side)
2
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
評価基板レイアウト（単位：mm）
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
25
600
85
240
Thermal Resistance (℃/W)
166.67
Power
Dissipation: Pd (mW)
許容損失Pd（mW）
Pd-Ta特性グラフ
Pd vs. Ta
700
600
500
400
300
200
100
0
25
22/26
45
65
85
Ambient
Temperature: Ta (℃)
周辺温度Ta（℃）
105
125
XC6503
Series
■PACKAGING INFORMATION (Continued)
●
SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
て
1.
Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm in one side)
2
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
5 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
25
1300
85
520
Thermal Resistance (℃/W)
76.92
許容損失Pd（mW）
Power Dissipation: Pd (mW)
Pd-Ta特性グラフ
Pd vs. Ta
1400
1200
1000
800
600
400
200
0
25
45
65
85
Ambient
Temperature: Ta (℃)
周辺温度Ta（℃）
105
125
23/26
XC6503 Series
■PACKAGING INFORMATION (Continued)
● SOT-89 Power Dissipation
Power dissipation data for the SOT-89 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
2
Board : Dimensions 40×40mm（1600mm in one side）
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Material : Glass Epoxy（FR-4）
40.0
28.9
Package heat-sink is tied to the copper traces
Thickness : 1.6mm
Through-hole : 5 x 0.8 Diameter
Evaluation Board (Unit: mm)
Power Dissipation vs. Ambient temperature
2.5
2.
Evaluation Board (Unit: mm)
Board Mount ( Tjmax=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
25
1000
85
400
Thermal Resistance (℃/W）
100.00
Pd vs Ta
Power Dissipation Pd（mW）
1200
1000
800
600
400
200
0
25
24/26
45
65
85
Ambient Temperature Ta（℃）
105
125
XC6503
Series
■MARKING RULE
●SOT-25(Under dot), SOT-89, SOT-89-5, USP-4
① represents product series.
MARK
PRODUCT SERIES
1
XC6503******-G
② represents type of regulators.
MARK
OUTPUT VOLTAGE
OUTPUT VOLTAGE
0.1V INCREMENTS
0.05V INCREMENTS
VOLTAGE=
VOLTAGE=
VOLTAGE=
VOLTAGE=
1.2～4.1V
4.2～5.0V
1.25～4.15V
4.25～4.95V
0
1
2
3
C
D
E
F
③ represents output voltage.
MARK
OUTPUT VOLTAGE (V)
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
2.50
2.60
4.20
4.30
4.40
4.50
4.60
4.70
4.80
4.90
5.00
-
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
2.55
2.65
4.25
4.35
4.45
4.55
4.65
4.75
4.85
4.95
-
MARK
F
H
K
L
M
N
P
R
S
T
U
V
X
Y
Z
PRODUCT SERIES
PACKAGE
XC6503P*****-G
XC6503D*****-G
SOT-89
SOT-25, SOT-89-5, USP-4
OUTPUT VOLTAGE (V)
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.40
3.50
3.60
3.70
3.80
3.90
4.00
4.10
-
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
4.05
4.15
-
④⑤ represents production lot number
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ repeated. (G, I, J, O, Q, W excluded)
* No character inversion used.
●SOT-25(Under dot)
●SOT-89-5
●USP-4
●SOT-89
Enlarge
25/26
XC6503 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
26/26