XP152A12C0MR-G - Torex Semiconductor

XP152A12C0MR-G
ETR1121_003
Power MOSFET
■GENERAL DESCRIPTION
The XP152A12C0MR-G is a P-channel Power MOSFET with low on-state resistance and ultra high-speed switching
characteristics.
Because high-speed switching is possible, the IC can be efficiently set thereby saving energy.
In order to counter static, a gate protect diode is built-in.
The small SOT-23 package makes high density mounting possible.
■FEATURES
■APPLICATIONS
●Notebook PCs
●Cellular and portable phones
●On-board power supplies
●Li-ion battery systems
■PIN CONFIGURATION/
MARKING
Low On-State Resistance : Rds(on) = 0.3Ω@ Vgs = -4.5V
: Rds(on) = 0.5Ω@ Vgs = -2.5V
Ultra High-Speed Switching
Gate Protect Diode Built-in
Driving Voltage
: -2.5V
P-Channel Power MOSFET
DMOS Structure
Small Package
: SOT-23
Environmentally Friendly : EU RoHS Compliant, Pb Free
■PIN ASSIGNMENT
PRODUCTS
PACKAGE
ORDER UNIT
SOT-23
3,000/Reel
SOT-23
3,000/Reel
XP152A12C0MR
G:Gate
2 1
2 x
S:Source
D:Drain
* x represents production lot number.
(*)
XP152A12C0MR-G
(*)
The “-G” suffix denotes Halogen and Antimony free as well as
being fully RoHS compliant.
■ABSOLUTE MAXIMUM RATINGS
Ta = 25℃
■EQUIVALENT CIRCUIT
PARAMETER
SYMBOL RATINGS UNITS
Drain - Source Voltage
Vdss
-20
V
Gate - Source Voltage
Vgss
±12
V
Drain Current (DC)
Id
-0.7
A
Drain Current (Pulse)
Idp
-2.8
A
Reverse Drain Current
Idr
-0.7
A
Channel Power Dissipation *
Pd
0.5
W
Channel Temperature
Tch
150
℃
Storage Temperature
Tstg
-55~150
℃
* When implemented on a ceramic PCB
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XP152A12C0MR-G
■ELECTRICAL CHARACTERISTICS
DC Characteristics
Ta = 25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Drain Cut-Off Current
Idss
Vds= -20V, Vgs= 0V
-
-
-10
μA
Gate-Source Leak Current
Igss
Vgs= ±12V, Vds= 0V
-
-
±10
μA
Gate-Source Cut-Off Voltage
Vgs(off)
Id= -1mA, Vds= -10V
-0.5
-
-1.2
V
Drain-Source On-State Resistance *1
Rds(on)
Id= -0.4A, Vgs= -4.5V
-
0.23
0.30
Ω
Id= -0.4A, Vgs= -2.5V
-
0.37
0.50
Ω
Forward Transfer Admittance *1
| Yfs |
Id= -0.4A, Vds= -10V
-
1.5
-
S
Body Drain Diode
Forward Voltage
Vf
If= -0.7A, Vgs= 0V
-
-0.8
-1.1
V
*1 Effective during pulse test.
Dynamic Characteristics
Ta = 25℃
PARAMETER
SYMBOL
Input Capacitance
Ciss
Output Capacitance
Coss
Feedback Capacitance
Crss
CONDITIONS
Vds= -10V, Vgs=0V
f= 1MHz
MIN.
TYP.
MAX.
UNITS
-
180
-
pF
-
120
-
pF
-
60
-
pF
Switching Characteristics
Ta = 25℃
PARAMETER
SYMBOL
Turn-On Delay Time
td (on)
Rise Time
tr
Turn-Off Delay Time
td (off)
Fall Time
tf
CONDITIONS
Vgs= -5V, Id= -0.4A
Vdd= -10V
MIN.
TYP.
MAX.
UNITS
-
5
-
ns
-
20
-
ns
-
55
-
ns
-
70
-
ns
Thermal Characteristics
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PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Thermal Resistance
(Channel-Ambience)
Rth (ch-a)
Implement on a ceramic PCB
-
250
-
℃/W
XP152A12C0MR-G
■TYPICAL PERFOMANCE CHARACTERISTICS
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XP152A12C0MR-G
■TYPICAL PERFOMANCE CHARACTERISTICS (Continued)
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XP152A12C0MR-G
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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