Packaging Information / Reference Pattern Layout Dimensions ●USPN-4 ■Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design Taping Specifications ●USPN-4 Reel Unit: mm 5000pcs/reel ●Taping Specifications R Type :[Device orientation : Right] Standard feed L Type :[Device orientation : Left] Reverse feed ● USPN-4 Power Dissipation Power dissipation data for the USPN-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the front and 50% of the back. The copper area is divided into four block, one block is 12.5% of total. The USPN-4 package has for terminals. Each terminal connects one copper block in the front and one in the back. Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature（85℃） Board Mount (Tj max = 125℃) Power Dissipation Pd （mW） 600 240 Thermal Resistance (℃/W) 166.67 Power許容損失Pd（mW） Dissipation Pd(mW) Ambient Temperature （℃） 25 85 Pd vs Ta Pd-Ta特性グラフ 700 600 500 400 300 200 100 0 25 45 65 85 105 125 Ambient Temperature Ta(℃) 周囲温度Ta（℃） 3. Power Dissipation vs. Ambient temperature（105℃） Board Mount ( Tjmax=125℃) Power Dissipation Pd （mW） 600 120 Thermal Resistance (℃/W) 166.67 Pd-Ta特性グラフ Pd vs Ta Power許容損失Pd（mW） Dissipation Pd(mW) Ambient Temperature （℃） 25 105 700 600 500 400 300 200 100 0 25 45 65 85 105 周囲温度Ta（℃） Ambient Temperature Ta(℃) 125 USPN-4 構造図 USPN-4 Perspective RoHS対応品 RoHS Compliance ① ② ③ ④ 項 目 材 料 備考 Item Material Note 封止樹脂 エポキシ樹脂 難燃グレード/Flammability rating Resin Epoxy resin UL94V-0 リードパッド ニッケル Lead pad Nickel 端子処理 Auメッキ Outer pad plating Gold plating ダイアタッチ ダイアタッチフィルム Die attach Die attach film ボンディングワイヤ Au Bonding wire ⑤ シリコンチップ Si Silicon chip 捺印表示 レーザー Marking Laser marking Ver.00