Packaging Information / Reference Pattern Layout Dimensions ●QFN-24 Unit: mm ■Packaging Information 1 PIN INDENT 4.0±0.10 0.075 0.40±0.05 7 8 9 10 11 12 13 6 5 14 4 15 3 16 2 17 1 18 24 23 22 21 20 19 2.8±0.05 ■Reference Pattern Layout Dimensions 2.50 1.10 0.50 1.10 4.50 3.30 0.25 0.30 2.70 3.20 4.60 0.50 Note : reference metal mask design Taping Specifications 178.0±0.5 60±0.5 0.2 0.4 0.8 0.6 0.4 0.6 Unit: mm 0.2 0.8 ●QFN-24 Reel ●Taping Specifications direction of feed direction of feed L Type :[Device orientation : Left] Reverse feed (4.35) 12.0±0.3 5.5±0.05 1.75±0.1 R Type :[Device orientation : Right] Standard feed ● QFN-24 Power Dissipation Power dissipation data for the QFN-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 40.0 1. 2.5 Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Board Structure: 4 Copper Layers 1.4 40 x 40 mm (1600mm2) 40.0 Board Dimensions: 2.54 Soldering: Lead (Pb) free Each layer is 50% connected to the package heat-sink. Glass Epoxy (FR-4) Thickness: 1.0 mm Through-hole: 4 x 0.4 Diameter 28.9 28.9 Material: 2. Power Dissipation vs. Ambient Temperature Ambient Temperature（℃） Power Dissipation Pd（mW） 25 1500 85 600 Thermal Resistance(℃/W) 66.67 Power Dissipation Pd (mW) 許容損失Pd（mW） Pd-Ta特性グラフ Pd vs. Ta 1600 1400 1200 1000 800 600 400 200 0 25 45 65 85 周囲温度Ta（℃） Ambient Temperature Ta(℃) 105 125 QFN-24構造図 QFN-24 Perspective RoHS対応品 RoHS Compliance 項 目 Item 封止樹脂 Resin リードフレーム Lead frame 端子処理 Lead plating ダイアタッチ Die attach 材 料 Material エポキシ樹脂 Epoxy resin 銅系 Copper alloy 鉛フリーはんだメッキ Lead(Pb) free solder plating エポキシ Epoxy ④ ボンディングワイヤ Au ⑤ Bonding wire シリコンチップ Silicon chip Si ① ② ③ 捺印表示 Marking 備考 Note 難燃グレード/Flammability rating UL94V-0 端子側面は除く Except the side of the terminals. レーザー Laser marking Ver.00