Packaging Information / Reference Pattern Layout Dimensions ●SOP-8FD Unit: mm ■Reference Pattern Layout Dimension 6.0±0.2 1.55±0.2 (2.4) 0～0.11 （1.45） 3.9±0.1 0.4 MIN ■Packaging Information Taping Specifications ●SOP-8FD Reel Unit: mm 1,000pcs/reel ●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ● SOP-8FD Power Dissipation Power dissipation data for the SOP-8FD is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 40.0 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Board: 28.9 Lead (Pb) free Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Thickness: Through-hole: Glass Epoxy (FR-4) 1.6 mm 4 x 0.8 Diameter 2.54 1.4 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature (85℃) Board Mount (Tj max = 125℃) Power Thermal Temperature Dissipation Pd Resistance （℃） （mW） (℃/W) 25 1500 85 600 66.67 PPd d-Ta特性グラフ vs. Ta Power Dissipation Pd（mW） 許容損失Pd（mW） Ambient 1600 1400 1200 1000 800 600 400 200 0 25 45 65 85 周囲温度Ta（℃） 105 125 Ambient Temperature Ta（℃） 3. Power Dissipation vs. Ambient temperature (105℃) Board Mount (Tj max = 125℃) Ambient Power Thermal Temperature Dissipation Pd Resistance （℃） （mW） (℃/W) 25 1500 105 300 66.67 許容損失Pd（mW） Power Dissipation Pd（mW） Pd-Ta特性グラフ Pd vs. Ta 1600 1400 1200 1000 800 600 400 200 0 25 45 65 85 105 Ambient周囲温度Ta（℃） Temperature Ta（℃） 125 SOP-8FD構造図 SOP-8FD Perspective RoHS対応品 RoHS Compliance ① ② ③ ④ ⑤ 項 目 Item 封止樹脂 Resin リードフレーム Lead frame 端子処理 Lead plating ダイアタッチ Die attach ボンディングワイヤ Bonding wire シリコンチップ Si 捺印表示 Marking 材 料 Material エポキシ樹脂 Epoxy resin 銅系 Copper alloy 鉛フリーはんだメッキ Lead(Pb) free solder plating エポキシ Epoxy Au 備考 Note 難燃グレード/Flammability rating UL94V-0 Si レーザー Laser marking Ver.00