Packaging Information / Reference Pattern Layout Dimensions ●USP-8 Unit: mm ■Packaging Information *The side of pins are not gilded, but nickel is used. *Pin #1 is wider than other pins. ■Reference Pattern Layout Dimension Note : reference metal mask design テーピング仕様 / Taping Specifications USP-8 11.4±1.0 Unit: mm ●リール/Reel 9.0±0.3 2±0.2 φ 13±0.2 (1.5) 3,000pcs/reel (2.7) 8.0±0.2 3.5±0.05 1.75±0.1 ●テーピング仕様/Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ● USP-8 Power Dissipation Power dissipation data for the USP-8 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 1200 480 Thermal Resistance(℃/W) 83.33 Power Dissipation Pd(mW) Pd vs Ta 1400 1200 1000 800 600 400 200 0 25 45 65 85 105 Ambient Temperature Ta（℃） 125 USP-8構造図 USP-8 Perspective RoHS対応品 RoHS Compliance ①封止樹脂 Resin ⑤シリコンチップ Silicon chip ④ボンディングワイヤ Bonding wire ②リードパッド Lead pad ③ダイアタッチ Die attach ① ② ③ ④ 項 目 材 料 備考 item material Note 封止樹脂 エポキシ樹脂 難燃グレード/Flammability rating Resin Epoxy resin UL94V-0 リードパッド ニッケル Lead pad Nickel 端子処理 Auメッキ 端子側面は除く Outer pad plating Gold plating Except the side of the terminals. ダイアタッチ エポキシ Die attach Epoxy ボンディングワイヤ Au Bonding wire ⑤ シリコンチップ Si Silicon chip 捺印表示 レーザー marking laser marking Ver.06