NOR MCP Part Numbering System

NOR MCP Part Numbering System
Micron's part numbering system is available at www.micron.com/numbering
Multichip Packages
MT 38W
203
Micron Technology
9
A
B
C
D
xNAND
N/A
xDRAM
16Mb = 2MB
32Mb = 4MB
64Mb = 8MB
128Mb = 16MB
256Mb = 32MB
384Mb = 48MB
512Mb = 64MB
768Mb = 96MB
1Gb = 128MB
1.5Gb = 192MB
2Gb = 256MB
3Gb = 384MB
4Gb = 512MB
1.5Gb = 192MB
1.75Gb = 224MB
2Gb = 256MB
3Gb = 384MB
4Gb = 512MB
Voltage Range (Core I/O)
xDRAM
NOR
1.8–1.8
1.8–1.8
1
2
3.0–3.0
3.0–3.0
1.8–3.0
1.8–3.0
3
3.0–3.0
3.0–3.0
4
Die Count
NOR
1
A
1
B
A
9
0
2
ZQX*
Z
W . XQ5 –ES
Production Status
Product Family
38L = NOR L-series + xNAND + xDRAM
38M = NOR M-series + xNAND + xDRAM
38W = NOR W-series + xNAND + xDRAM
Density
NOR
0
1 32Mb = 4MB
2 64Mb = 8MB
3 128Mb = 16MB
4 256Mb = 32MB
5 512Mb = 64MB
6 768Mb = 96MB
7 1Gb = 128MB
8 1.25Gb = 160MB
3
xDRAM
1
2
Blank = Production
ES = Engineering samples
MS = Mechanical samples
Die Revision Code
Contact factory
Operating Temperature Range
I = Industrial (–40°C to +85°C)
W = Wireless (–25°C to +85°C)
Special Options
Contact factory
Package Code
ZA = VBGA 7.5x5x1 44 F10X4+4 O.5
19Z = VBGA 7.7x9x1 64 F10X6+4 P.5 B.3
ZQ = TFBGA 8X10X1.2 88 F8X10+8 0.8
ZS = VFBGA 8X6X156 10x6-8+4 .5 B.3
3RZ = VFBGA 8X8X1 133 3R14X14+1 0.5
*X = a null character used as a
placeholder.
xDRAM Description
0 = N/A
1 = ASYNC PSRAM
2 = SYNC PSRAM No Mux
3 = SYNC PSRAM AD Mux
4 = SYNC PSRAM AAD Mux
5 = x16 DDR1 1KB Page
6 = x16 DDR1 2KB Page
7 = x16 DDR1 4KB Page
8 = x32 DDR1 4KB Page
NAND Description
0 = N/A
NOR Configuration
Boot
Mux
1
Uniform
NO
2
Uniform
AD
3
Uniform
AD/AAD**
4
Uniform
AAD
5
Bottom
NO
6
Bottom
AD
Bottom
7
AD/AAD**
8
Bottom
AAD
9
Top
NO
A
Top
AD
B
Top
AD/AAD**
C
Top
AAD
**AAD interface configurable through
register.
Rev. 9/12/2012
© 2012 Micron Technology, Inc.
Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates
are estimates only.