Micron Solutions Guide for Networking and Communications Infrastructure Applications The unique requirements of networking and communications networking needs. This guide outlines the various networking infrastructure applications demand high-performance memory solutions—from DRAM components and modules, to NOR and with low latency, rigorous thermal specifications, pristine signal NAND Flash, to solid state drives (SSDs) —so you can select the integrity, and ECC data protection. We design and manufacture right solution for your specific application. a broad portfolio of solutions to meet your mission-critical Why Micron for Networking? Typical Applications Your applications require an unprecedented combination of • Mobile infrastructure equipment advanced features, high performance, and high reliability—all • Enterprise and service provider routers and switches while balancing design requirements and cost. Our solutions go • Storage area networking beyond meeting these requirements to deliver even more benefits • Optical delivery for your design. • Satellite headend • Security appliances • Content delivery • Picocell and femtocell • Branch routers • WAN optimization • Digital subscriber line access multiplexer (DSLAM) • Internet protocol (IP) telephony Worldwide technical support • Proven product longevity • Application-specific memory solutions • Form factor flexibility • High-density modules • Low-latency, high-bandwidth DRAM • Industrial temperature support • Broad memory portfolio • Consistent supply • Innovation leadership • Quality in product and support • Note: Several of these applications are covered in Advanced Telecommunications Computing Architecture (ATCA) specifications. Micron Networking Products DRAM Key DRAM networking products Product Benefits Ideal Applications Why Micron? RLDRAM® 2 Memory RLDRAM 3 Memory • SRAM performance levels at DRAM densities • Ultra-low bus turnaround time enables higher sustainable bandwidth • Low-latency, high-speed network infrastructure equipment • Packet buffering and inspections • SRAM replacement in highspeed systems DRAM IT-grade components • Extended operating temperature range • Network infrastructure equipment that resides in harsh environments • Support for all DRAM types • Primary supplier of legacy IT components DDR3 1866 and 2133 components • 1866 and 2133 MT/s DDR3 operation • High-speed network infrastructure equipment • Full lineup of high-speed components, including IT Mini-DIMM and SORDIMM Modules • Small form factors • ECC-enabled • High densities • No compromise on reliability or performance • Networking ATCA and other size-constrained systems that require ECC modules • Manufactured by a leading DRAM company • More than 60% of our DRAM is shipped on modules • Full control of entire design process and supply chain DRAM Components and Modules • Complete portfolio of SDR, DDR, DDR2, DDR3, and DDR4 components and modules • Networking systems that require dynamic memory • Long-term support • Broad product portfolio • One supplier for all your memory needs • Lower-cost alternative to SRAM • Best-in-class, low-latency performance Solid State Drives (SSDs) Product Benefits Ideal Applications Client SSDs • Good performance and features at an affordable price point • Primary storage • Boot drives Enterprise SATA SSDs • Application-centric, read-specific drives for cost and utilization effectiveness • Boot drives • Enhanced endurance boot drives • Logging applications • Archiving applications Enterprise PCIe SSDs • High availability • Transactional and write-caching • High performance – P320h is one applications • I/O acceleration of the fastest PCIe drives in the • DRAM backup industry Why Micron? • NAND technology expertise • End-to-end quality • Drives optimized for our NAND components inside Micron Networking Products (Continued) NOR/NAND Flash Product Benefits Ideal Applications Parallel NOR • Standard, high-performance products up to 250 MB/s reads • Typical high densities (64Mb to 2Gb) • Low pin count A/D MUX options (decreases ball count by >50%) • Full voltage range • Boot code for more complex networking infrastructure equipment (e.g., high-end routers) SPI NOR • Standard products up to 166 MB/s reads • Typical medium densities (1Mb to 1Gb) • Broadest SPI NOR portfolio in the market • Full voltage range • Industry-standard packaging • Extended temperature range • Boot code for less complex networking infrastructure equipment SLC NAND • Up to 100,000 P/E cycle endurance • Fastest throughput of the various NAND technologies (MLC, TLC) • Compatibility with the ONFI synchronous interface MLC NAND • Solid performance and endurance • Less ECC complexity • 2X the density of SLC NAND at a lower cost/bit • Compatibility with the ONFI synchronous interface • Custom, SSD-like storage format for networking infrastructure or data center core equipment that require lowest cost/bit and SSD-like capacities Managed NAND • Simpler solutions to design in • NAND management (e.g., ECC and bad block management) handled by the device like in eUSB and e·MMC memory solutions • Low-capacity storage for networking infrastructure equipment that requires better performance and reliability than HDDs Why Micron? • Long-term support • Operating system and configuration • Broad product portfolio • One supplier for all your tables for networking infrastructure equipment (xPON or router) that memory needs requires higher density than NOR and higher endurance than MLC Partner Ecosystem More Information We are reinforcing and expanding current relationships with preferred partners and key enablers in the networking industry. Find out how you can benefit from these partnerships on our Partner Ecosystem page. View more information about networking and communications infrastructure solutions, and find a sales representative or authorized distributor at micron.com. micron.com Products are warranted only to meet Micron’s production data sheet specifications. Products and specifications are subject to change without notice. ©2013 Micron Technology, Inc., Micron, the Micron logo, and RLDRAM are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. All rights reserved. 3/15