Minimum Recommended Printed Circuit Board Solder Pad Layouts Notes see second page Version 26.05.2015 SO- © Diotec Semiconductor AG http://www.diotec.com/ 1/2 Minimum Recommended Printed Circuit Board Solder Pad Layouts D²PAK TO-263AB D-PAK TO-252AA Power SMD “TO-277B” 7.0 10.6 4.2 6.6 11.6 17.0 4.7 7.0 8.4 1.5 0.8 2.5 2.0 0.9 1.4 3.8 2.30 2.54 ABS SOD-123FL 1.4 1.5 0.8 4.1 7.25 max 4.1 0.9 Notes 1) All dimensions shown are in [mm] 2) The suggested solder pad dimensions are only for referencing a minimum layout. Actual applications may require pad layouts bigger than the ones shown, in order to achieve lower thermal resistance and thus better heat transfer. Please refer also to the particular device data sheets, where thermal resistances are defined based on certain pad sizes. 3) Please note our disclaimer. 2/2 http://www.diotec.com/ © Diotec Semiconductor AG