1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT SERIES Single-Phase Full-Wave Motor Driver for Fan Motor TYPE ＢＤ６７２２ＦＳ FEATURES Speed controllable by DC / PWM input Current limit circuit PWM soft switching drive 〇ABSOLUTE MAXIMUM RATINGS Parameter Symbol Limit 20 Supply voltage Vcc 812.5＊ Power dissipation Pd -40～+100 Operating temperature Topr -55～+150 Storage temperature Tstg 34 High side output voltage VOH 34 Low side output voltage VOL 1.5＊＊ Low side output current Iomax 10 Signal output current IFG/IAL 20 Signal output voltage VFG/VAL 8 VREF current ability IVREF 15 VTH input voltage VVTH 150 Junction temperature Tjmax ＊ Reduce by 6.5mW/℃ over Ta=25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) ＊＊ This value is not to exceed Pd. Unit V mW ℃ ℃ V V A mA V mA V ℃ 〇OPERATING CONDITIONS Parameter Operating supply voltage range Hall input voltage range VMIN input voltage range Symbol Vcc VH VVMIN ＊This product is not designed for production against radioactive rays. ＊This document may be strategic data subject to COCOM regulations. REV. D Limit 4.5～17.0 0～Vcc-2.0 0～Vcc-2.0 Unit V V V 2/4 〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=12V) Limit Parameter Symbol Unit Min. Typ. Max. Circuit current Icc 5.0 8.0 11.0 mA Hall input hysteresis VHYS ±5 ±10 ±15 mV High side output current 15 IH 5 10 mA Conditions IHL - - 10 μA VOH=34V Low side output voltage Lock detection ON time Lock detection OFF time VL TON TOFF 0.18 3.6 0.3 0.3 6.0 0.45 0.42 8.4 V s s Io=600mA FG output low voltage VFGL - 0.15 0.3 V IFG=5mA FG output leak current IFGL - - 10 μA VFG=17V AL output low voltage VALL - 0.15 0.3 V IAL=5mA AL output leak current IALL - - 10 μA VAL=17V OSC low voltage OSC high voltage OSC charge current OSC discharge current VOSCL VOSCH ICOSC IDOSC 0.8 2.24 -50 26 1.0 2.44 -32 32 1.2 2.64 -26 50 V V μA μA Output ON duty 1 DUTY1 75 80 85 % Output ON duty 2 DUTY2 45 50 55 % Output ON duty 3 DUTY3 15 20 25 % VREF voltage VREF 2.8 3.0 3.2 V Current limit voltage VTH bias current VMIN bias current VCL IVTH IVMIN 320 - 350 - 380 0.2 0.2 mV μA μA High side output leak current REV. D VTH=VREF*0.429 H side pull up R=1kΩ COSC=470pF VTH=VREF*0.573 H side pull up R=1kΩ COSC=470pF VTH=VREF*0.717 H side pull up R=1kΩ COSC=470pF IVREF=-2mA 3/4 〇PACKAGE OUTLINES 6.6±0.2 9 0.3Min. 6.2±0.3 1.5±0.1 4.4±0.2 0.11 16 BD6722 1 8 0.15±0.1 Lot No. 0.1 0.8 0.36±0.1 SSOP-A16 (UNIT:mm) 〇BLOCK DIAGRAM GND 1 COSC SIGNAL OUTPUT VREF SOFT START COSC 2 SOFT SWITCH VMIN 3 + VTH 4 + - VMIN PWMCOMP AL 16 PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 FG 15 TSD VREF LOCK PROTECTION 14 VTH PWMCOMP H- - 13 CONTROL LOGIC Vcc 5 HALL COMP + - PRE DRIVER CURRENT LIMIT COMP A1H 6 + - A1L 7 RNF 8 〇TERMINAL NAME H+ 12 CS 11 A2H 10 POW POW A2L 9 REV. D Terminal name GND COSC VMIN VTH Vcc A1H A1L RNF A2L A2H CS H+ HVREF FG AL 4/4 〇CAUTIONS ON USE 1) Absolute maximum ratings An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. REV. D Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). 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The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2009 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster @ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix-Rev4.0