WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module WM9800BD Bluetooth Low Energy Module Version 0.1 Date Change Description 24 Sept 2014 Initial release CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 1 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Description WM9800BD is a Bluetooth 4.0 BLE module, which is a high performance, cost effective, low power. The Bluetooth module provides a complete 2.4GHz Bluetooth system based on CSR1010 chip which is a single chip data transfer and baseband IC for Bluetooth 2.4GHz system. This module is fully compliant to Bluetooth v4.0 BLE, Qualified Bluetooth v4.0 system. The WM9800BD is compatible with the latest iOS and Android phones. Bluetooth device develops can now easily build BLE profile compliant devices. Features 128KB memory: 64KB RAM and 64KB ROM. Support for Bluetooth v4.0 specification host stack including ATT, GATT, SMP, L2CAP, GAP RSSI monitoring for proximity applications. 32KHz and 16MHz crystal or system clock. Programmable general purpose PIO controller. UART, SPI interfaces available to various applications. 5 GPIO ports available for user’s application. 3 Analog IO ports available for user’s application. Small footprint: 18×13×2.2mm, half-holes PCB module OS support: iOS, Android. RoHS compliance Application Sports and fitness sensors. Health sensors. Mobile accessories. Smart home. CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 2 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Functional Block Diagram Block Diagram CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 3 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Pin Assignment (Top view) CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 4 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Pin Definition Pin Signal Input /Output Description 1 RF I/O RF Port 2 GND Ground 3 AIO[2] 4 AIO[1] 5 AIO[0] 6 PIO[0]/UART_TX 7 PIO[1]/UART_RX 8 PIO[3] 9 PIO[4] 10 SPI_EN 11 PIO[10] 12 PIO[9] 13 PIO[11] 14 SPI_MISO 15 SPI_MOSI 16 SPI_CSB 17 SPI_CLK Power Bidirectional analogue Bidirectional analogue Bidirectional analogue Bidirectional with programmable strength internal pull-up/down Bidirectional with programmable strength internal pull-up/down Bidirectional with programmable strength internal pull-up/down Bidirectional with programmable strength internal pull-up/down Input with internal pull-down Bidirectional with programmable strength internal pull-up/down Bidirectional with programmable strength internal pull-up/down Bidirectional with programmable strength internal pull-up/down CMOS output, tri-state, with weak internal pull-down CMOS input with weak internal pull-down CMOS input with weak internal pull-up CMOS input with weak internal pull-down Analogue programmable I/O line Analogue programmable I/O line Analogue programmable I/O line Programmable I/O line or UART_TX Programmable I/O line or UART_RX Programmable I/O line Programmable I/O line Selects SPI debug Programmable I/O line Programmable I/O line Programmable I/O line Serial Peripheral Interface data output Serial Peripheral Interface data input Chip select for synchronous Serial Interface active low Serial Peripheral Interface clock CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 5 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module 18 WAKE 19 VDD Input has no internal pull-up or Input to wake the module from hibernate or dormant pull-down, use external pull-down Power 3.3V input CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 6 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Application Circuit CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 7 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Functional Specification Product Description Standard Main Chipset Host Interface Dimension Bluetooth 4.0 Low Energy CSR1010 UART 18mm x 13mm x 2.2mm Half-hole PCB module Package Electrical Specifications 2.4GHz ISM band(2402MHz to 2480MHz) Frequency Range 1Mbps, GFSK, 250KHz deviation Data Rate/Modulation 4dBm (+/- 1dB) TX Output Power RX Sensitivity -90dBm (min) Operational Channel Ch0 to Ch78 Operating Voltage 3.3V Temperature Limit Ratings Parameter Storage Temperature Operating Temperature Min. -40 0 Max. +85 +70 Units o C o C Rating -0.4 to 3.6 Unit V Absolute Maximum Ratings Symbol VDD Parameter Supply Voltage Recommended Operating Range Symbol VDD Parameter Supply Voltage Min 1.8 Typ 3.3 Max Units 3.6 V CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 8 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module RF Characteristics Min Output Max 4 Min -20 Peak to Average Carrier drift Fn Drift rate Max Drift Modulation Characteristic ‘F1avg’,’F1max’ 225 ‘F2avg’,’F2max’ F1/F2 ratio Receiver Sensitivity (-90dBm) Frame Error Rate PER Integrity (-30dBm) Frame Error Rate 50 Maximum Input Level (-10dBm) Frame Error Rate Type Max BLE SPEC Unit 0.58 < 10.0 >-20.0 < 3.0 dBm dBm dB 2 -7.7 -6 <= +/-150 <= +/-20 <= +/-50 KHz KHz/50us KHz 225<= <=275 >= 185 >= 0.8 KHz KHz <= 30.8 % 50<= % 275 213 0.88 23 65.4 0 <=65.4 <= 30.8 % CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 9 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Power Consumption Characteristics VDD=3.3V Description RX/TX mode @ peak current Deep Sleep mode Performance TYP 16 5 UNITS mA uA CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 10 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Module Dimensions All dimensions are in millimeters. Tolerance: +- 0.1mm CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 11 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Layout Design Guide The recommended layout pads for WM9800BD module are shown below. (module top view) Do not route any digital or analog signal traces between the RF traces and reference ground. don’t put any metal shielding in the surrounding area of module and try to leave the module placed in the corner of chassis board as close as possible. All dimensions are in millimeters. Tolerance: +- 0.1mm CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 12 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Package Information TBD All dimensions are in millimeters. CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 13 WIESON WM9800BD TYPE OF PRODUCT INTERNATIONAL CO., LTD. SPECIFICATION Bluetooth Module Reference Temperature Reflow Chart Note: 1. If the system PCBA is double side design please reflow the side without this module first. 2. Don’t let the solder machine temperature over 250℃ or follow solder paste vender’s recommended temperature. 3. The Ramp-up temperature speed is 1~4 oC per second, the Ramp-down temperature speed is 1~4 oC per second. 4. This temperature reflow chart is for reference only, it depends on the manufaturing machine’s characters requirement. CONFIDENTIAL No part of the information shown of this document may be used in any way without office stamp or written consent of WIESON INTERNATIONAL CO., LTD. 14