SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching TECHNICAL DATA SHEET PE71S6091 The PE71S6091 is an SMT SINGLE POLE DOUBLE THROW RELAY SWITCH that operates from DC TO 3 GHz. The Switch has a 24 VDC LATCHING ACTUATOR. The Switch is SMT and operates from -40 Deg C to +85 Deg C. Features • • • • Single Pole Double Throw SMT Relay Switch DC to 3 GHz Frequency Range 2M Operating Life 175 Watt Avg Power • -40 to +85 Deg C Operating Temperature • Insertion Loss 0.3 dB Max • VSWR 1.35:1 Max Applications • High Performance Relay Switch • Military Communications • Communications Systems • Test & Measurement Electrical Specifications Frequency Range DC to 3 GHz Impedance 50 Ohms ActuatorLatching Coil Resistance 865 Ω Typ Actuating Current 32 mA Control Voltage 24 Volts Marking Contacts 1,800 µs Typ 4,000 µs Max Breaking Contacts 500 µs Typ 1,000 µs Max RF Input Power (Max CW) 400 Watts RF Characteristic Description Band 1 Band 2 Frequency Range DC to 1 1 to 2 Band 3 Band 4 Band 5 2 to 3 Units GHz VSWR, Max 1.1:1 1.2:1 1.35:1 Insertion Loss, Max 0.1 0.2 0.3 dB Isolation, Min 504540 dB Average Power @25 °C 400 280 175 Watts . Mechanical Specifications Connector Type Operating Life SMT 2,000,000 Environmental Specifications Temperature Operating Range Storage Range -40 to +85 deg C -55 to +85 deg C . Click the following link (or enter part number in “SEARCH” on website) to obtain additional part information including price, inventory and certifications: SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching PE71S6091 PE71S6091 REV 1.0 1 SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching TECHNICAL DATA SHEET PE71S6091 Weight 0.004 lbs [1.81 g] Compliance Certifications (visit www.Pasternack.com for current document) RoHS Compliant Plotted and Other Data Notes: • Values at +25 °C, sea level • ESD Sensitive Material, Transport material in Approved ESD bags. Handle only in approved ESD Workstation SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching from Pasternack Enterprises has same day shipment for domestic and International orders. Our RF, microwave and millimeter wave products maintain a 99% availability and are part of the broadest selection in the industry. Click the following link (or enter part number in “SEARCH” on website) to obtain additional part information including price, inventory and certifications: SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching PE71S6091 URL: http://www.pasternack.com/smt-spdt-electromechanical-relay-switch-3-ghz-latching-pe71s6091-p.aspx PE71S6091 REV 1.0 2 PE71S6091 CAD Drawing SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching A – Soldering procedure using automatic pick and place equipment 1-Solder paste: R596 series are « Lead Free », and Lead Free Sn-Ag3.5Cu0.7 solder cream may be used as well as standard Sn63– Pb35–Ag2. It is recommended using a « no clean - low residue » solder cream (5% solid residue of flux quantity) that will permit the elimination of the cleaning operation step after soldering. Note: Due to the gold plating of the switch PCB interface, it is important to use a paste made with silver. This will help in avoiding formation of intermetallics as part of the solder joint. RECOMMENDED SOLDERING PROCEDURE 2-Solder paste deposition: Solder cream may be applied on the board with screen printing or dispenser technologies. For either method, the solder paste must be coated to appropriate thickness and shapes to achieve good solder wetting. Please optically verify that the edges of the zone are clean and without contaminates, and that the PCB zoned areas have not oxydated. The design of the mounting pads and the stenciling area are given on page 7, for a thickness of the silk-screen printing of 0.15 mm (0.006 ‘’). 5-Cleaning procedure: On miniature relays, high frequency cleaning may cause the contacts to stick. If cleaning is needed, please avoid ultrasonic cleaning and use alcohol based cleaning solutions. In-line cleaning process, spraying, immersion, especially under temperature, may cause a risk of degradation of internal contacts. 6-Quality check: Verify by visual inspection that the component is centered on the mounting pads. Solder joints: verify by visual inspection that the formations of meniscus on the pads are proper, and have a capillarity amount upper the third of the height. B – Soldering procedure by manual operation 1-Solder paste and flux deposition: Refer to procedure A – 1 Deposite a thin layer of flux on mounting zone. Allow the flux to evaporate a few seconds before applying the solder paste, in order to avoid dilution of the paste. 3-Placement of the component: For small lightweight components such as chip components, a self-alignment effect can be expected if small placement errors exist. However, this effect is not as expected for relays components and they require a accurate positioning on their soldering pads, typically +/- 0.1mm (+/-0.004’’). Place the relay onto the PCB with automatic pick and place equipment. Various types of suction can be used. We do not recommend using adhesive agents on the component or on the PCB. 4-Soldering: infra-red process Please follow the recommended temperature profile for infrared reflow or forced air convection: 2-Solder paste deposition: We recommends depositing a small amount of solder paste on the mounting zone area by syringe. Be careful, not to apply solder paste outside of the zone area. 3-Placement of the component: During manipulation, avoid contaminating gold surfaces by contact with fingers. Place the component on the mounting zone by pressing on the top of the relay lid. 4-Hand soldering: Iron wattage 30 to 60 W. Tip temperature 280 to 300°C for max. 5 seconds To keep good RF characteristics above 3GHz, it is important to solder RF ports first, and apply pressure on the relay lid during all the soldering stage, so as to reduce the air gap between the PC board and the relay. 5-Cleaning procedure: Refer to procedure A – 5. 6-Quality check: Verify by visual inspection that component is centered on the mounting pads. Solder joints: verify by visual inspection that the formations of meniscus on the RF pads are proper, and have a capillarity amount higher than one third of the height. Higher temperature (>260°C) and longer process duration would damage permanently the switches PE71S6091 REV 1.0 3 PE71S6091 CAD Drawing SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching PE71S6091 REV 1.0 4 PE71S6091 CAD Drawing SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching PE71S6091 REV 1.0 5 PE71S6091 CAD Drawing SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Latching PE71S6091 REV 1.0 6