Z-Power LED X10490 Technical Data Sheet Specification C9WT821 SSC Drawn Approval CUSTOMER Approval Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet C9WT821 1. Description C9WT821 Features • White & Warm colored SMT package. TOP VIEW LED is designed for high current operation and high flux output applications. • High CRI PKG • Pb-free Reflow Soldering Application • Furthermore, its thermal management characteristic assembly methods ; Suitable for all soldering is better than other LED solutions by package SMD design and good thermal emission material. According to these advantages, it enables to apply Suitable for all SMT methods • RoHS Compliant • MSL LEVEL 2a various lighting applications and design solution, automotive lighting etc. Applications • Interior lighting • General lighting • Indoor and out door displays • Architectural / Decorative lighting Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter [1] Symbol Value Unit Power Dissipation Pd 324 mW Forward Current IF 90 mA IFM [2] 100 mA Reverse Voltage (per die) VR 5 V Operating Temperature Topr -40~+85 ℃ Storage Temperature Tstg -40~+100 ℃ Junction Temperature Tj 125 ℃ Peak Forward Current (per die) [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio. 3. Electric & Optical characteristics Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage (per die) * VF IF=20mA 3.0 3.3 3.8 V Reverse Current (per die) IR VF=5V - - 10 μA Iv IF=60mA 4.0 4.5 - cd Color Temperature CCT IF=60mA 2,600 - 7,000 K Optical Temperature Ŋelc IF=60mA - 71 - lm/W 2Θ1/2 IF=60mA - 120 - deg. Ra IF=60mA - 92 - - 1.5kΩ;100pF 1 - - KV Luminous Intensity* Viewing Angle [1] [2] Color Rendering Index* ESD (HBM) [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. * Tolerance : VF :±0.05V, IV :±10%, ΦV:±10%, Ra :±3, x,y :±0.01 [Note] All measurements were made under the standardized environment of SSC. Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Forward Voltage vs. Forward Current (Per die) Forward Current vs. Relative Luminous Intensity Ta=25℃ Ta=25℃ 90 1.4 80 1.2 Relative Luminous Intensity Forward Current IF [mA] 70 60 50 40 30 20 10 1.0 0.8 0.6 0.4 0.2 0 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 0.0 4.2 0 Forward Voltage VF [V] 10 20 30 40 50 60 70 80 90 Forward Current IF [mA] Ambient Temperature vs. Maximum Forward Current (per die) Directivity 35 30 Ta=25℃ Forward Current IF[mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 0 25 -30 30 20 15 -60 60 10 5 -90 90 0 -25 0 25 50 75 100 O Ambient temperature Ta( C) Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Spectrum Ta=25℃ 2600~3700K 3700~4700K 4700~7000K Relative Emission Intensity 1.0 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Item Reference Test Conditions Duration / Cycle Number of Damaged Thermal Shock EIAJ ED-4701 Ta =-40oC(30min) ~ 100oC(30min) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1000 Hours 0/22 High Temp. High Humidity Storage EIAJ ED-4701 Ta =60oC, RH=90% 1000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =60mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =60oC, RH=90%, IF =60mA 500 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =60mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =60mA 1000 Hours 0/22 MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 ESD(HBM) □ CRITERIA FOR JUDGING THE DAMAGE Item Symbol Condition Forward Voltage VF Luminous Intensity IV Criteria for Judgment MIN MAX IF =60mA (20mA per die) - USL*1 × 1.2 IF =60mA (20mA per die) LSL*2 × 0.5 - Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.9 520 515 525 530 0.8 535 540 510 545 0.7 550 555 505 560 0.6 565 570 575 580 585 590 595 600 CIE (y) 500 0.5 0.4 0.3 0.2 495 610 620 630 830 490 485 480 0.1 0.0 0.0 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CI E(x) Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.44 ENERGY STAR RANK (7000K~2600K) 0.42 0.40 CIE Y 0.38 0.36 0.34 0.32 2700K 2600K 2900K 3000K 3200K H1 H3 G3 3500K G1 3700K F3 H4 4000K G4 H2 F1 4200K G2 E3 F4 4500K E1 F2 4700K E4 D3 5000K D1 E2 5300K C3 D4 5600K C1 D2 6000K B3 C4 C2 B1 6500K B4 A3 B2 7000K A1 A4 A2 0.30 0.28 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 CIE X Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=60mA, Ta=25℃> 7000 ~ 6500 K A1 6500 ~ 6000 K A2 A3 A4 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3048 0.3131 0.3117 0.3304 0.3209 0.3290 0.3393 0.3048 0.3068 0.3145 0.3131 0.3209 0.3113 0.3187 0.3290 0.3117 0.3131 0.3213 0.3205 0.3393 0.3290 0.3371 0.3481 0.3131 0.3145 0.3221 0.3213 0.3290 0.3187 0.3261 0.3371 6000 ~ 5600 K B1 CIE X 0.3207 0.3215 0.3293 0.3292 5600 ~ 5300 K B2 CIE Y 0.3462 0.3353 0.3423 0.3539 CIE X 0.3215 0.3222 0.3294 0.3293 B3 CIE Y 0.3353 0.3243 0.3306 0.3423 CIE X 0.3292 0.3293 0.3371 0.3376 5300 ~ 5000 K C1 CIE X 0.3376 0.3371 0.3451 0.3463 CIE X 0.3371 0.3366 0.344 0.3451 CIE X 0.3293 0.3294 0.3366 0.3371 CIE Y 0.3423 0.3306 0.3369 0.3493 5000 ~ 4700 K C2 CIE Y 0.3616 0.349 0.3554 0.3687 B4 CIE Y 0.3539 0.3423 0.3493 0.3616 C3 CIE Y 0.349 0.3369 0.3428 0.3554 CIE X 0.3463 0.3451 0.3533 0.3551 C4 CIE Y 0.3687 0.3554 0.362 0.376 CIE X 0.3451 0.344 0.3515 0.3533 CIE Y 0.3554 0.3428 0.3487 0.362 ● A~C -> CCT 4700 ~ 7000 K Rev. 02 March 2010 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK <IF=60mA, Ta=25℃> 4700 ~ 4500 K D1 D2 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3529 0.3615 0.3641 0.3641 0.3615 0.3702 0.3736 0.3804 0.3659 0.3722 0.3874 0.3615 0.359 0.367 0.3702 0.3659 0.3521 0.3578 0.3722 0.3736 0.3597 0.3659 0.3804 0.3529 0.3512 0.359 0.3615 0.3597 0.3465 0.3521 0.3659 4500 ~ 4200 K D3 4200 ~4000 K E1 4000 ~ 3700 k E2 CIE X 0.3736 0.3702 0.3825 0.3869 CIE Y 0.3874 0.3722 0.3798 0.3958 CIE X 0.3702 0.367 0.3783 0.3825 E3 CIE Y 0.3722 0.3578 0.3646 0.3798 CIE X 0.3869 0.3825 0.395 0.4006 E4 CIE Y 0.3958 0.3798 0.3875 0.4044 3700 ~ 3500 K F1 D4 CIE X 0.3825 0.3783 0.3898 0.395 CIE Y 0.3798 0.3646 0.3716 0.3875 3500 ~ 3200 K F2 F3 F4 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3996 0.3941 0.408 0.4146 0.4015 0.3848 0.3916 0.4089 0.3941 0.3889 0.4017 0.408 0.3848 0.369 0.3751 0.3916 0.4146 0.408 0.4221 0.4299 0.4089 0.3916 0.3984 0.4165 0.408 0.4017 0.4147 0.4221 0.3916 0.3751 0.3814 0.3984 3200 ~3000 K G1 CIE X 0.4299 0.4221 0.4342 0.443 3000 ~ 2900 k G2 CIE Y 0.4165 0.3984 0.4028 0.4212 CIE X 0.4221 0.4147 0.4259 0.4342 G3 CIE Y 0.3984 0.3814 0.3853 0.4028 CIE X 0.443 0.4342 0.4465 0.4562 G4 CIE Y 0.4212 0.4028 0.4071 0.426 CIE X 0.4342 0.4259 0.4373 0.4465 CIE Y 0.4028 0.3853 0.3893 0.4071 2900 ~ 2700 K H1 H2 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4562 0.4465 0.4582 0.4687 0.4687 0.4582 0.47 0.4813 0.4289 0.4099 0.4126 0.4319 0.4582 0.4483 0.4593 0.47 0.4099 0.3919 0.3944 0.4126 0.426 0.4071 0.4099 0.4289 0.4465 0.4373 0.4483 0.4582 0.4071 0.3893 0.3919 0.4099 2700 ~ 2600 K H3 ● D~H -> CCT 2600 ~ 4700 K H4 Rev. 02 March 2010 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Bin Code Description Bin Code Luminous Intensity [mcd] Color Rank Forward Voltage [V] M0 A1 Z1 4,700K ~ 7,000K Luminous Intensity [mcd] @ IF = 60mA Color Rank @ IF = 60mA Average for Total Forward Voltage [V] @ IF = 60mA RANK Min. Max. A1 A3 M0 4,000 4,500 A2 A4 RANK Min. Max. M5 4,500 5,000 B1 B3 Z1 3.0 3.1 N0 5,000 5,500 B2 B4 Z2 3.1 3.2 N5 5,500 6,000 C1 C3 Z3 3.2 3.3 C2 C4 A1 3.3 3.45 A2 3.45 3.6 2,600K ~ 4,700K Color Rank @ IF = 60mA D1 D3 D2 D4 E1 E3 E2 E4 F1 F3 F2 F4 G1 G3 G2 G4 H1 H3 H2 H4 Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) 2.80 1.9 0.75 3 Anode 1 0.80 4 0.85 1.50 3.20 2.40 4 2 3 Cathode Cathode Cathode <Circuit diagram> 1 0.50 2 0.15 ( Tolerance: ±0.2, Unit: mm ) Packing Mark (Anode) ATTENTION MARKING ON LED IS ANODE(+) 9. Reel Structure 1.55 ± 0.05 4.0±0.1 1.75±0.1 2.0±0.05 0.22±0.05 3.83±0.1 5° 3.5±0.1 8±0.1 1.0±0.1 8° 3.1±0.1 2.22±0.1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 13 ±0.2 30° 10 60 Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension 22 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. MADE IN KOREA Acriche 1 Semiconductor EcoLight b RoHS a Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. [Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Precaution for use 1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% 3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. 4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 5) Quick cooling shall be avoided. 6) Components shall not be mounted on warped direction of PCB. 7) Anti radioactive ray design is not considered for the products. 8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 02 March 2010 www.acriche.com SSC-QP-7-07-24 (Rev.00)