Z-Power LED X10490 Technical Data Sheet RoHS Specification ZC-40 (SSC-SBW*5F1A) SBW*5F1A March. 2013 1 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Specification SBW*5F1A Features • Super high Flux output and high Luminance • Designed for high current operation • Lead Free product • RoHS compliant Description The ZC series are High Flux and High Efficacy COB (Chip On Board) series designed for easy to attach to lighting fixture directly without reflow process. ZC series's thermal management perform exceeds other Applications power LED solutions. • Down Light • Street Light • Security Light • Architectural lighting • Decorative / Pathway lighting The Z-Power LED is ideal light sources for general illumination applications, custom designed solutions, and high performance lights. * The appearance and specifications of the product can be changed for improvement without notice. SBW*5F1A March. 2013 3 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Contents 1. Full code of ZC series, SBW*5F1A LED Series 2. Outline dimensions 3. Characteristics of SBW*5F1A LED 4. Characteristic diagrams 5. Color & Binning 6. Bin Code Description 7. Labeling 8. Packing 9. Precaution for use 10. Recommended mechanical connection to heat sink 11. Handling of Silicone resin LEDs SBW*5F1A March. 2013 3 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Full code of ZC series (SBW*5F1A) - Part Number Form : X1X2X3X4X5X6X7X8 X1 Company S SSC X2 Package series B COB W0 Pure White WW Warm White X3 Color X4 X5 Series number 5 ZC series X6 Lens Type F Flat X7 PCB type 1 PCB X8 Revision No. A Rev0 SBW*5F1A March. 2013 4 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Outline dimensions Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ±0.2mm SBW*5F1A March. 2013 5 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3. Characteristics of SBW*5F1A 1. Pure White (SBW05F1A) 1-1 Electro-Optical characteristics @1000mA Value Parameter Symbol Unit Min Typ Max ФV [2] - 4680 - lm Correlated Color Temperature [3] CCT - 5000 - K CRI [4] Ra 70 - - - Forward Current IF - 1000 1200 mA Forward Voltage [5] VF 32.0 36.0 - V Luminous Flux [1] Thermal resistance (J to s) [7] View Angle RθJ-s 0.4 K/W 2Θ ½ 125 deg. 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation PD 48.0 W Forward Current IF 1200 mA Junction Temperature Tj 120 ℃ Operating Temperature [8] Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ ESD Sensitivity (HBM) - ±8 kV *Notes : [1] SSC maintains a tolerance of 7% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : ±0.01 tolerance. [4] Tolerance is 2 on CRI measurements [5] Tolerance is 2.5V on forward voltage measurements [6] A zener diode is included to protect the product from ESD. [7] At thermal Resistance, J to S means junction to COB’s metal pcb bottom. [8] Operating temperature is ambient temperature. SBW*5F1A March. 2013 6 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1-3 Luminous Flux Efficiency Characteristics(SBW05F1A) Forward Current vs. Luminous Flux efficiency [lm/W], Ta=25℃ CCT : 5000K Current [mA] Power Dissipation [W] Luminous Flux efficiency [Lm/W] 500 17.2 152 700 24.5 143 1000 36.1 130 1200 43.8 124 180 Luminous Flux Efficiency [lm/W] 170 160 150 140 130 120 110 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Forward Current [A] Power Dissipation vs. Luminous Flux efficiency [lm/W], Ta=25℃ 180 Luminous Flux Efficiency [lm/W] 170 160 150 140 130 120 110 100 0 5 10 15 20 25 30 35 40 45 LED Power Dissipation [W] SBW*5F1A March. 2013 7 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3. Characteristics of SBW*5F1A 2. Warm White (SBWW5F1A) 1-1 Electro-Optical characteristics @1000mA Value Parameter Symbol Unit Min Luminous Flux [1] Typ ФV [2] 4000K CRI [4] Max 4140 lm Ra 75 - - - - 3890 - lm Luminous Flux [1] 3000K ФV [2] Luminous Flux [1] 2700K ФV [2] 3670 lm CRI [4] Ra 80 - - - Forward Current IF - 1000 1200 mA Forward Voltage [5] VF 32.0 36.0 - V Thermal resistance (J to s) [7] View Angle RθJ-s 0.4 K/W 2Θ ½ 115 deg. 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation PD 48.0 W Forward Current IF 1200 mA Junction Temperature Tj 120 ℃ Operating Temperature [8] Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ ESD Sensitivity (HBM) - ±8 kV *Notes : [1] SSC maintains a tolerance of 7% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : ±0.01 tolerance. [4] Tolerance is 2 on CRI measurements [5] Tolerance is 2.5V on forward voltage measurements [6] A zener diode is included to protect the product from ESD. [7] At thermal Resistance, J to S means junction to COB’s metal pcb bottom. [8] Operating temperature is ambient temperature. SBW*5F1A March. 2013 8 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1-3 Luminous Flux Efficiency Characteristics(SBWW5F1A) Forward Current vs. Luminous Flux efficiency [lm/W], Ta=25℃ CCT : 3000K Current [mA] Power Dissipation [W] Luminous Flux efficiency [Lm/W] 500 17.2 120 700 24.5 113 1000 36.1 108 1200 43.8 95 Luminous Flux Efficiency [lm/W] 150 140 130 120 110 100 90 80 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Forward Current [A] Power Dissipation vs. Luminous Flux efficiency [lm/W], Ta=25℃ Luminous Flux Efficiency [lm/W] 150 140 130 120 110 100 90 80 0 5 10 15 20 25 30 LED Power Dissipation [W] 35 40 45 SBW*5F1A March. 2013 9 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Characteristic diagrams Color Spectrum IF=1000mA, Ta=25℃, RH30% Cool Warm Relative spectral power spectrum 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] SBW*5F1A March. 2013 10 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics Forward Current vs. Luminous Flux, Ta=25℃, RH30% 120 Relative luminous flux [%] 100 80 60 40 20 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Forward Current [A] Forward Voltage vs. Forward Current , Ta=25℃, RH30% 1.4 Forward Current [A] 1.2 1.0 0.8 0.6 0.4 0.2 0.0 10 15 20 25 30 35 40 Forward Volatage [V] SBW*5F1A March. 2013 11 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics Forward Current vs. CIE , Ta=25℃, RH30% 1. Pure White (SBW05F1A) CCT : 5000K 0.020 CIE X CIE Y 0.015 0.010 △ CIE X,Y 0.005 0.000 -0.005 -0.010 -0.015 -0.020 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Forward Current [A] 2. Warm White (SBWW5F1A) CCT : 2700K 0.020 CIE X CIE Y 0.015 0.010 △CIE X,Y 0.005 0.000 -0.005 -0.010 -0.015 -0.020 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Forward Current [A] SBW*5F1A March. 2013 12 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics Junction Temperature vs. Relative Light Output at IF=1000mA, Ta=25℃, RH30% 110 Relative Luminous Output [%] Cool Warm 100 90 80 70 60 50 0 20 40 60 80 100 120 140 o Junction Temperature [ C] SBW*5F1A March. 2013 13 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics Junction Temperature vs. VF at IF=1000mA, Ta=25℃, RH30% 1 Cool Warm Forward Voltage Shift [V] 0 -1 -2 -3 -4 -5 -6 0 20 40 60 80 100 120 140 o Junction Temperature [ C] SBW*5F1A March. 2013 14 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics CCT vs. Junction Temperature at IF=1000mA, Ta=25℃, RH30% 6500 Cool Warm 6000 5500 CCT [K] 5000 4500 4000 3500 3000 2500 2000 0 20 40 60 80 100 120 140 o Junction Temperature[ C] SBW*5F1A March. 2013 15 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet Maximum Forward Current vs. Ambient Temperature Tjmax = 120℃, at 1200mA 1400 Maximum Current [mA] 1200 1000 800 600 RjaT = 1.6℃/W RjaT = 1.2℃/W RjaT = 0.8℃/W 400 200 00 20 40 60 80 100 120 Ambient Temperature [? ] Radiation pattern IF=1000mA, Ta=25℃, RH30% 1.1 Cool Warm 1.0 Relative Intensity [a.u.] 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Directional angle [deg.] SBW*5F1A March. 2013 16 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Color & binning Color Rank at IF=1000mA, Ta=25℃, RH30% 1. Pure White (SBW05F1A) 0.38 ANSI 4700K 5000K 0.37 C1 5300K C0 CIE Y 0.36 5600K 0.35 C3 B1 C2 6000K 0.34 B0 B3 B2 B5 C5 C4 B4 0.33 0.32 0.31 0.32 0.33 0.34 0.35 0.36 CIE X 2. Warm White (SBWW5F1A) 0.45 4-step (3000K) 4-step (2700K) 2900K 2700K 3000K 0.42 3200K CIE Y G0 3700K 4000K 0.39 E1 4200K E0 E2 G4 H0 2600K H1 G1 H10H3 H2 G3 G10 G2 H5 H4 G5 E3 E5 E4 0.36 0.35 0.40 0.45 0.50 CIE X *Notes : In the case of the warm white(2700k, 3000k), It is possible to order ANSI BIN(G0~5, H0~5) and 4-step BIN(G10, H10) SBW*5F1A March. 2013 17 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Bin code description 1. Luminous Flux Bins - Luminous flux bin structure for pure white, warm white · Example BIN CODE : K2C3D Luminous Flux bin Bin Code Luminous Flux [lm] J2 3400 ~ 3900 K1 3900 ~ 4500 K2 4500 ~ 5100 L1 5100 ~ 5800 Tolerance : 7% of Luminous flux value 2. Pure/Warm White CIE Pure white product tested and binned by x,y coordinates and CCT · Example BIN CODE : K2C3D Color bin 3. Voltage Bins · Example BIN CODE : K2C3D Voltage bin Bin Code Voltage [V] D 32.0 ~ 36.0 E 36.0 ~ 40.0 SBW*5F1A March. 2013 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Labeling X1X2X3X4X5X6X7X8 12 Full code form : X 1X 2X 3X 4X 5X 6X 7X 8 - X1 : Company - X2 : Type of package series - X3 : Color - X4 : Color - X5 : Series number - X6 : Lens type - X7 : PCB type - X8 : Revision number SBW*5F1A March. 2013 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Packing ● Tray Packing Structure * Notes : [1] The number of loaded products in the tray is 12ea [2] All dimensions are in millimeters (tolerance : ±0.2) [3] Scale none SBW*5F1A March. 2013 20 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Packing (Bag and box) *1,2 1. Moisture-proof bag X9 X10 X11X12X13 X1 X2 X3 X4 X5 X6 X7X8 - Desiccant - Humidity Indicator 2. Outer Box Structure 1 SIDE X9 X10 X11X12X13 1 X1 X2 X3 X4 X5 X6 X7X8 * Notice 1. Heat Sealed after packing (Use Zipper Bag) 2. Quantity : Max 3 Trays/Bag : Max 2 Bag/Box(ⓒ80), Max 4 Bag/Box(ⓒ142) SBW*5F1A March. 2013 21 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. Recommended mechanical connection to heat sink < Top View > 5.5 < M3 screw > < Side View > GREASE HEATSINK • Notes - Please use M3 screw necessarily. - Do not release screw while LED is operating. - Use two screws. - Fix LED package on heat sink tightly. SBW*5F1A March. 2013 22 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week or the color of the desiccant changes. (3) For manual soldering SSC recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C c. Before proceeding the next step, product temperature must be stabilized at room temperature. (4) Components should not be mounted on warped (non coplanar) portion of PCB. (5) Radioactive exposure is not considered for the products listed here in. (6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (8) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with vacuum atmosphere should be used for storage. (10) The appearance and specifications of the product may be modified for improvement without notice. (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (14) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. SBW*5F1A March. 2013 23 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts. SBW*5F1A March. 2013 24 www.seoulsemicon.com 서식번호 : QP-7-07-18 (Rev.00)