SZW07A0A

Z-Power LED
X10490
Technical
Data
Sheet
RoHS
Specification
Z7
SSC
Drawn
Approval
Customer
Approval
Z7
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Document number : SSC- QP- 7- 07- 25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
[ Contents ]
1.
Description
------- 3
2.
Full code of Z7 series
------- 4
3.
Outline dimension
------- 5
4.
Characteristics of Z7
------- 6
5.
Characteristic diagrams
------- 8
6.
CIE Chromaticity Diagram
------- 15
7.
Binning Table
------- 17
8.
Labeling
------- 18
9.
Reel Packing
------- 19
8.
Recommended solder pad
------- 20
9.
Soldering profile
------- 21
10. Precaution for Use
------- 22
11. Revision Profile
------- 24
Z7
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Document number : SSC- QP- 7- 07- 25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Z7
Z7
Description
Features
The Z-Power series is designed for high
• Super high Flux output
current operation and high flux output
and high Luminance
applications. It incorporates state of the
• Designed for high
art SMD design and low thermal resistant
current operation
material.
The Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive, large LCD
• SMT solderable
• Lead Free product
• RoHS compliant
backlights and high performance torches.
Applications
• General Torch
• Architectural lighting
• Task lighting
• Decorative / Pathway
lighting
• Remote / Solar
powered lighting
• Street lighting
* The appearance and specifications of the product can be changed
for improvement without notice.
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Z-Power LED
X10490
Technical
Data
Sheet
Full code of Z7 series
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13
X1
Company
S
SSC
X2
Package series
Z
Z-Power
X3
W
Color
Pure White
X4
0
X5
Z-Power series number
7
Z7 series
X6
Lens type
A
Dome-Wide
X7
PCB type
0
Emitter
X8
Revision No.
A
Rev0
X9X10
Luminous flux
-
-
X11X12
Color bin
-
-
X13
Forward Voltage
-
-
2. Sticker Diagram on Reel & Aluminum Vinyl Bag
Rank :
X9X10X11X12X13
QUANTITY : 500
Lot No : # # # # # # # # #
SSC PART NUMBER : X1X2X3X4X5X6X7X8
X1X2X3X4X5X6X7X8
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Z-Power LED
X10490
Technical
Data
Sheet
Outline dimensions
[ INNER CIRCIT DIAGRAM]
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ± 0.2mm
Z7
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Z-Power LED
X10490
Technical
Data
Sheet
Characteristics of Z7 (SZW07A0A)
1. Pure white
1-1 Electro-Optical characteristics at 1400mA
(Ta=25
℃, RH30%)
Value
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
[4]
Thermal resistance (J to S)
[6]
View Angle
Unit
Min
Typ
Max
ФV [2]
440
550
600
lm
CCT
4700
6000
8200
K
Ra
65
70
75
-
VF
-
3.3
4
V
RθJ-S
1.6
K/W
2Θ ½
130
deg.
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
2800 (each chip 700mA)
mA
Reverse Voltage
V
5
V
Power Dissipation
Pd
11
W
Junction Temperature
Tj
135
Operating Temperature
Topr
-40 ~ +85
Storage Temperature
Tstg
-40 ~ +100
-
± 3,000V HBM
ESD Sensitivity
[5]
℃
℃
℃
-
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tolerance.
[4] Tolerance is ±0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
[6] At thermal Resistance, J to S means junction to solder point on metal PCB.
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Z-Power LED
X10490
Technical
Data
Sheet
Characteristics of Z7 (SZWW7A0A)
1. Warm white
1-1 Electro-Optical characteristics at 1400mA
Value
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
CRI
Forward Voltage
[4]
Thermal resistance (J to S)
[6]
View Angle
Unit
Min
Typ
Max
ФV [2]
340
450
500
lm
CCT
2600
3000
3500
K
Ra
-
80
-
-
VF
-
3.3
4
V
RθJ-S
1.6
K/W
2Θ ½
130
deg.
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
2800 (each chip 700mA)
mA
Reverse Voltage
V
5
V
Power Dissipation
Pd
11
W
Junction Temperature
Tj
135
Operating Temperature
Topr
-40 ~ +85
Storage Temperature
Tstg
-40 ~ +100
-
± 3,000V HBM
ESD Sensitivity
[5]
℃
℃
℃
-
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tolerance.
[4] Tolerance is ±0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
[6] At thermal Resistance, J to S means junction to solder point on metal PCB.
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(IF=350mA, Ta=25
2.5
Relative Spectral Power Spectrum
Z-Power LED
X10490
Technical
Data
Sheet
Color Spectrum
℃, RH 30%)
Pure
Warm
2.0
1.5
1.0
0.5
0.0
300
400
500
600
700
800
900
Wavelength [nm]
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℃
Forward Voltage vs. Forward Current, Ta=25
2800
Forward Current [mA]
2400
2000
1600
1200
800
400
0
-400
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Forward Voltage [V]
Forward Current vs. Normalized Relative Luminous Flux, Ta=25
℃
2.0
Relative Luminous Flux (X100,%)
Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
400
800
1200
1600
2000
Forward Current (mA)
2400
2800
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0.009
Chromaticity Coordinate
℃
Pure x-axis
Pure y-axis
Warm x-axis
Warm y-axis
0.012
0.006
0.003
0.000
-0.003
-0.006
0
400
800
1200
1600
2000
2400
2800
Current [mA]
℃
CCT vs. Forward Current, Ta=25
7000
Pure
Warm
6000
CCT [K]
Z-Power LED
X10490
Technical
Data
Sheet
Chromaticity Coordinate vs. Forward Current, Ta=25
5000
4000
3000
0
500
1000
1500
Current [mA]
2000
2500
3000
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Relative Light Output vs. Junction Temperature at IF=1400mA
Relative Luminous Output [%]
100
80
60
40
20
0
25
50
75
100
125
150
Junction Temperature [Celcius]
VF vs. Junction Temperature at IF=350mA
0.0
Forward Voltage Shift [V]
Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature Characteristics
-0.2
-0.4
-0.6
-0.8
-1.0
25
50
75
100
Junction Temperature [Celcius]
125
150
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0.015
Chromaticity Coordinate
0.012
0.009
Pure x-axis
Pure y-axis
Warm x-axis
Warm y-axis
0.006
0.003
0.000
-0.003
-0.006
-0.009
-0.012
-0.015
25
50
75
100
125
150
Junction Temperature [Celcius]
CCT vs. Junction Temperature at IF=350mA
8000
7000
Pure
Warm
6000
CCT [K]
Z-Power LED
X10490
Technical
Data
Sheet
Chromaticity Coordinate vs. Junction Temperature at IF=350mA
5000
4000
3000
25
50
75
100
Junction Temperature [Celcius]
125
150
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1600
Fordward Current(mA)
1400
1200
1000
℃
Rj-a=15℃/W
Rj-a=20℃/W
Rj-a=10 /W
800
600
400
200
0
0
20
40
60
80
100
Ambient Temperature(C)
Ambient Temperature vs. Allowable Forward Current
@2800mA
3000
2500
Forward Current(mA)
Z-Power LED
X10490
Technical
Data
Sheet
Ambient Temperature vs. Allowable Forward Current
@1400mA
2000
1500
℃
Rj-a=10℃/W
Rj-a=12℃/W
Rj-a=8 /W
1000
500
0
0
20
40
60
Ambient Temperature(C)
80
100
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1.0
Relative Luminous Intensity
Z-Power LED
X10490
Technical
Data
Sheet
Radiation pattern @1400mA
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
90
Angle [degree]
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Z-Power LED
X10490
Technical
Data
Sheet
CIE Chromaticity Diagram (Pure)
IF=1400mA, Ta=25℃
Z7
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Z-Power LED
X10490
Technical
Data
Sheet
CIE Chromaticity Diagram (Warm)
IF=1400mA, Ta=25℃
Z7
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Z-Power LED
X10490
Technical
Data
Sheet
Binning Table
Bin Code
Luminous Flux (lm)
@ IF = 1400mA
Color Chromaticity Coordinate
@ IF = 1400mA
Forward Voltage (V)
@ IF = 1400mA
V2
C2
H
Luminous Flux (lm)
@ IF = 1400mA
Bin
Code
Min.
Max.
Z1
340
390
Z2
390
440
Color Chromaticity Coordinate
@ IF = 1400mA
Bin
Code
Min.
Max.
Ref. 15, 16 pages
A1
440
490
A2
490
540
B1
540
590
B2
590
640
Forward Voltage (V)
@ IF = 1400mA
Bin
Code
Min.
Max.
G
2.75
3.00
H
3.0
3.25
I
3.25
3.5
J
3.5
3.75
K
3.6
3.8
Available ranks
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Z-Power LED
X10490
Technical
Data
Sheet
Label
Rank :
X9X10X11X12X13
QUANTITY : 500
Lot No : # # # # # # # # #
SSC PART NUMBER :: SZDW7A0A
SZW07A0A
SZDW7A0A
Full code form :
X1X2X3X4X5X6X7X8
- X1 : Company
- X2 : Z-Power LED series number
- X3X4 : Color
- X5 : Series number
- X6 : Lens type
- X7 : PCB type
- X8 : Revision number
Rank
X9X10X11X12X13
- X9X10 : Luminous Flux : LF [lm]
- X11X12 : Color Coordinates : x, y
- X13 : Forward Voltage : VF [V]
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Z-Power LED
X10490
Technical
Data
Sheet
Emitter Carrier & Reel Packaging
CATHODE MARK
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Z-Power LED
X10490
Technical
Data
Sheet
Recommended solder pad
Solder Pad
Isolation
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] This drawing without tolerances are for reference only
[4] Recommended solder paste height : ≥ 30um
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Z-Power LED
X10490
Technical
Data
Sheet
Reflow Soldering Conditions / Profile
IPC/JEDEC J-STD-020C
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215
260
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
℃
℃
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
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Z-Power LED
X10490
Technical
Data
Sheet
Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum
humidity of 50%.
• Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Soldering should be done immediately after opening the package (within 24Hrs).
b. Required conditions after opening the package
- Sealing
- Temperature : 5 ~ 40
℃
Humidity : less than 30%
c. If the package has been opened more than 1 week or the color of the desiccant changes,
±
components should be dried for 10-12hr at 60 5
℃
• Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
• Do not rapidly cool device after soldering.
• Components should not be mounted on warped (non coplanar) portion of PCB.
• Radioactive exposure is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
• When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is isolated from anode electrically.
Therefore, we recommend that you don’t isolate the heat sink.
• Attaching LEDs, do not use adhesives that outgas organic vapor.
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Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone resin LEDs
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.
Notes for handling:
• Avoid touching silicone resin parts especially with sharp tools such as Pincette
(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Silicone resin will attract dust so use covered containers for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that excessive mechanical
pressure on the surface of the resin must be prevented.
• It is not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
• Especially, if a reverse voltage is continuously applied to the product, such operation can
cause the electro-migration resulting in LED damage.
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