Z-Power LED X10490 Technical Data Sheet W49180 W49180 Features • Super high flux output Z-Power series is designed for 사진 and high luminance high current operation and • Designed for high current operation high flux output applications. • Low thermal resistance • SMT solderable Z-Power LED's thermal performance • Lead free product exceeds other power LED solutions. • RoHS compliant It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general illumination applications, custom designed solutions, automotive and large LCD backlights. Applications • Mobile phone flash • Automotive interior / Exterior lighting • Automotive signal lighting • Automotive forward lighting • Torch • Architectural lighting • LCD TV / Monitor backlight • Projector light source • Traffic signals • Task lighting • Decorative / Pathway lighting • Remote / Solar powered lighting • Household appliances *The appearance and specifications of the product may be changed for improvement without notice. Rev. 02 May. 2010 1 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Full Code of Z-Power LED Series Full code form : X1 X2 X3 X4 X5 X6 – X7 X8 – X9 X10 X11 X12X13 1. Part Number - X1 : Color - X2 : Z-Power LED series number - X3 : LENS type - X4 : Chip quantity (or Power Dissipation) - X5 : Package outline size - X6 : Type of PCB 2. Internal Number - X7 X8 : Grade of characteristic code 3. Code Labeling - X9 : Luminous flux (or Radiant flux for royal blue) - X10 X11 X12 : Dominant wavelength (or x,y coordinates rank code) - X13 : Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag PART NO. : X1 X2 X3 X4 X5 X6 – X7 X8 QUANTITY : ### LOT NUMBER : ########## BIN CODE : X9 X10 X11 X12 X13 For more information about binning and labeling, refer to the Application Note -1 Rev. 02 May. 2010 2 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Outline Dimension 1. Dome Type SLUG Cathode Mark Lens Body Lead Cathode Notes : 1. All dimensions are in millimeters. (tolerance : ±0.2 ) 2. Scale : none 3. Slug of package is connected to anode. *The appearance and specifications of the product may be changed for improvement without notice. Rev. 02 May. 2010 3 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Characteristics for Z-Power LED 1. Pure White (W49180) 1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC Parameter Luminous Flux Symbol [1] Max 91 113 118.5 lm 118.5 - - lm CCT - 6300 - K Ra - 73 - - VF 3.0 3.3 4 V V rank [2] ФV CRI Forward Voltage Typ ФV [2] [3] [4] View Angle Unit Min U rank Correlated Color Temperature Value 2Θ ½ 95 deg. Thermal resistance [5] RθJ-B 10.1 ºC /W Thermal resistance [6] RθJ-C 8.5 ºC /W 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 800 mA Power Dissipation Pd 3.28 W Junction Temperature Tj 145 ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC - ±10,000V HBM - ESD Sensitivity [7] *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance. [4] A tolerance of ±0.06V on forward voltage measurements [5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) RθJ-C is measured with only emitter.(25 ºC ≤TJ ≤ 110 ºC) [7] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink. Rev. 02 May. 2010 4 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) 1.0 W 49180-07 Standard eye response curve Distribution 0.8 Relative Spectral Power Z-Power LED X10490 Technical Data Sheet Color Spectrum, TA=25ºC 0.6 0.4 0.2 0.0 300 400 500 600 700 800 900 W avelength (nm ) Rev. 02 May. 2010 5 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Relative Light Output vs. Junction Temperature at IF=350mA 120 Relative Light Output(%) 100 80 60 40 20 W49180-07 0 25 50 75 100 125 O Junction Temperature( C) 2. Forward Voltage Shift vs. Junction Temperature at IF=350mA 0.0 Forward Voltage Shift[V] Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics -0.2 -0.4 -0.6 -0.8 W49180-07 -1.0 25 50 75 100 125 O Junction Temperature [ C] Rev. 02 May. 2010 6 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Forward Voltage vs. Forward Current , TA=25 ºc Average Forward Current [mA] 800 W49180-07 600 400 200 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Forward Voltage [V] 2. Forward Current vs. Normalized Relative Luminous Flux, TA=25 ºc 2.5 Relative Lumious Flux(a.U) Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics W49180-07 2.0 1.5 1.0 0.5 0.0 0 200 400 Forward Current [mA] 600 800 Rev. 02 May. 2010 7 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. T JMAX = 145 ºC, @350mA 400 350 Current [mA] 300 250 o RjaT = 60 C/W 200 o RjaT = 50 C/W o 150 RjaT = 40 C/W 100 RjaT = 30 C/W o 50 0 0 25 50 75 100 125 150 o Ambient Temperature [ C] 2. T JMAX = 145 ºC, @700mA 800 700 600 Current [mA] Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs Allowable Forward Current 500 o RjaT = 40 C/W 400 o RjaT = 30 C/W o 300 RjaT = 20 C/W 200 100 0 0 25 50 75 100 Ambient Temperature 125 150 o [ C] Rev. 02 May. 2010 8 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) 0 1.0 30 W49180-07 0.8 Relative luminous flux Z-Power LED X10490 Technical Data Sheet Typical Dome Type Radiation pattern 0.6 60 0.4 0.2 0.0 -90 -75 -60 -45 -30 -15 0 90 Angle(deg.) Rev. 02 May. 2010 9 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Recommended Solder pad 1. Solder pad 2. Solder paste pattern Note : 1. All dimensions are in millimeters (tolerance : ±0.2 ) 2. Scale none *The appearance and specifications of the product may be changed for improvement without notice. Rev. 02 May. 2010 10 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 ~ Z-Power LED X10490 Technical Data Sheet 3. Reflow Soldering Conditions / Profile Pre-heating Cooling -5 °C/sec Rising 5 °C/sec 150 0 Time [Hr] 4. Hand Soldering conditions Lead : Not more than 3 seconds @MAX280℃ Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. Rev. 02 May. 2010 11 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Emitter Type Reel Packaging 7.00 Note : 1. The number of loaded products in the reel is 500ea 2. All dimensions are in millimeters (tolerance : ±0.2 ) 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice. Rev. 02 May. 2010 12 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Packaging Structure Aluminum Vinyl Bag PART NO. : ######-## QUANTITY : *** LOT NUMBER : #######-####### BIN CODE : ####### Outer Box TYPE c SIZE(mm) a c b 350 350 370 ZLED PART : W49180-** PO CODE : ## Q'YT : ###### LOT NO : YMDD-##### DATE : ###### ZLED b SEOUL SEMICONDUCTOR CO.,LTD a Note : 1. 6~10 reels are loaded in box 2. Scale none 3. For more information about binning and labeling, refer to the Application Note - 1 Rev. 02 May. 2010 13 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet precaution for use • Storage To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box (or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30 degrees Centigrade. Humidity 50% maximum. • Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40℃ Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60±5℃ • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp after soldering. • Please avoid rapid cooling after soldering. • Components should not be mounted on warped direction of PCB. • Anti radioactive ray design is not considered for the products listed here in. • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. • When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. • LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. • The appearance and specifications of the product may be modified for improvement without notice. • Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. • The slug is connected to the anode. Therefore, we recommend to isolate the heat sink. • Attaching LEDs, don’t use adhesives to generate organic vapor. Rev. 02 May. 2010 14 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Handling of Silicone resin LEDs Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs • Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers) • Avoid leaving fingerprints on silicone resin parts. • Dust sensitivity silicone resin need containers having cover for storage. • When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. • Please do not force over 2000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product • Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc) Rev. 02 May. 2010 15 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00)