SAW9KG0B - Seoul Semiconductor

Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Superior high Flux for High Voltage System
Acrich MJT– 5630 Series
SAW9KG0B (Warm)
MacAdam
3-Step
LM-80
RoHS
Product Brief
Description
Features and Benefits
•
This White Colored surface-mount LED
comes in standard package dimension.
Package Size : 5.6x3.0x0.75mm
•
It has a substrate made up of a molded
plastic reflector sitting on top of a lead
frame.
•
•
•
•
•
•
•
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone.
Super high Flux output and Luminance
Designed for high voltage operation
SMT solderable
High Color Quality with CRI Min. 90
CRI R9>50
Lead free product
RoHS compliant
Key Applications
•
•
•
•
•
The package design coupled with
careful selection of component materials
allow these products to perform with
high reliability.
Interior lighting
General lighting
Indoor and Outdoor displays
Architectural and Decorative lighting
Traffic signals
Table 1. Product Selection Table
CCT
Part Number
SAW9KG0B
Rev2.1, Sep 1, 2015
Color
Min.
Typ.
Max.
Warm White
2600K
3000K
3700K
1
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Performance Characteristics
3
•
Characteristics Graph
5
•
Color Bin Structure
10
•
Mechanical Dimensions
15
•
Emitter Tape & Reel Packaging
16
•
Product Nomenclature
18
•
Recommended Solder Pad
19
•
Reflow Soldering Characteristics
20
•
Handling of Silicone Resin for LEDs
21
•
Precaution For Use
22
•
Company Information
23
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Performance Characteristics
Table 2. Product Selection Guide, IF=20mA, Ta=25ºC, RH30%
Part Number
CCT (K) [1]
RANK
Typ.
Luminous Intensity [2]
IV (cd)
Luminous Flux [3]
ФV (lm)
CRI
Ra
Min
Max
Min
Max
Min.
W5
13.5
14.8
40.5
44.4
90
X8
14.8
16.1
44.4
48.3
90
Y1
16.1
17.4
48.3
52.2
90
Z4
17.4
19.0
52.2
57.0
90
W5
13.5
14.8
40.5
44.4
90
X8
14.8
16.1
44.4
48.3
90
Y1
16.1
17.4
48.3
52.2
90
Z4
17.4
19.0
52.2
57.0
90
W5
13.5
14.8
40.5
44.4
90
X8
14.8
16.1
44.4
48.3
90
Y1
16.1
17.4
48.3
52.2
90
Z4
17.4
19.0
52.2
57.0
90
3500
SAW9KG0B
3000
2700
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005
(2) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements.
The luminous intensity IV was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
(3) The lumen table is only for reference.
Rev2.1, Sep 1, 2015
3
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Performance Characteristics
Table 3. Characteristics, IF=20mA, Ta=25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
20
25
mA
Forward Current
IF
Forward Voltage
VF (20mA)
20.7
22
23
V
Reverse Voltage
VR (IR=10mA)
0.7
-
-
V
Luminous Intensity
(2,600~3,700 K)
Iv (20mA)
-
15.0
(45.0)*
-
cd
(lm)
Ra
90
92
-
-
2Θ1/2
-
115
-
deg.
Power Dissipation
PD
-
-
0.58
W
Junction Temperature
Tj
-
-
125
ºC
Operating Temperature
Topr
- 30
-
+ 85
ºC
Storage Temperature
Tstg
- 40
-
+ 100
ºC
Thermal resistance (J to S) [3]
Rθj-s
-
27
-
℃/W
ESD Sensitivity(HBM)
-
5
-
-
KV
Color Rendering Index
Viewing Angle
[1]
[2]
Notes :
(1) Tolerance is 2.0 on CRI measurements.
(2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity
(3) Thermal resistance: RthJS (Junction to Solder)
•
•
LED’s properties might be different from suggested values like above and below tables if
operation condition will be exceeded our parameter range. Care is to be taken that power
dissipation does not exceed the absolute maximum rating of the product.
All measurements were made under the standardized environment of Seoul Semiconductor.
* The lumen value is only for reference.
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Characteristics Graph
Fig 1. Color Spectrum, IF=20mA, Ta=25℃, RH30%
Relative Emission Intensity
1.00
0.75
0.50
0.25
0.00
300
400
500
600
700
800
Wavelength [nm]
Fig 2. Viewing Angle Distribution, IF=20mA
Normalized P/metrix [lux]
1.0
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
90
Angle [degree]
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current , Ta=25℃
0.025
Forward Current(A)
0.020
0.015
0.010
0.005
0.000
0
5
10
15
20
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, T a=25℃
Relative Luminous Intensity
140
120
100
80
60
40
20
0
5
10
15
20
25
30
35
40
Forward Current IF [mA]
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift, Ta=25℃
0.415
0.414
10mA
CIE y
20mA
0.413
15mA
25mA
5mA
0.412
0.411
0.4392
0.4394
0.4396
0.4398
0.4400
CIE x
Rev2.1, Sep 1, 2015
7
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Characteristics Graph
Fig 6. Relative Light Output vs. Junction Temperature, IF=20mA
1.0
Relative Light Output
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
O
Junction temperature Tj( C)
Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=20mA
Relative Forward Voltage
1.0
0.8
0.6
0.4
0.2
0.0
25
Rev2.1, Sep 1, 2015
50
75
100
O
Junction temperature Tj( C)
8
125
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Characteristics Graph
Fig 8. Chromaticity Coordinate vs. Junction Temperature, IF=20mA
0.420
0.415
CIE y
25
50
0.410
75
100
125
0.405
0.400
0.430
0.435
0.440
0.445
0.450
CIE x
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=125℃, IF=25mA
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Color Bin Structure
Table 4. Bin Code description, IF=20mA
Luminous Intensity IV (cd)
Color
Chromaticity
Coordinate
Part Number
Bin Code
Min.
Max.
W5
13.5
14.8
X8
14.8
16.1
SAW9KG0B
Typical Forward Voltage (Vf)
Bin Code
Min.
Max.
A
20.7
21.5
B
21.5
22.2
C
22.2
23.0
Refer to page.11
Y1
16.1
17.4
Z4
17.4
19.0
Table 5. Intensity rank distribution
CCT
CIE
IV Rank
3200 ~ 3700K
F
W5
X8
Y1
Z4
2900 ~ 3200K
G
W5
X8
Y1
Z4
2600 ~ 2900K
H
W5
X8
Y1
Z4
Available ranks
Notes :
(1) All measurements were made under the standardized environment of Seoul Semiconductor.
(2) Seoul Semiconductor sorts the LED package according to the luminous intensity IV.
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Color Bin Structure
Fig 10. CIE Chromaticity Diagram, Ta=25℃, IF=20mA
0.46
0.44
CIE coord.(Y)
0.42
H
G
0.40
F
0.38
0.36
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
CIE coord.(X)
(1) Energy Star binning applied to all 2600~3700K.
(2) Measurement Uncertainty of the Color Coordinates : ± 0.005
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Color Bin Structure
<IF=20mA, Ta=25℃>
0.42
3200K
3500K
0.41
3700K
CIE Y
0.40
F21
F11
F42
F32
F22
F43
F12
0.39
F41
F31
F33
F23
F44
F13
F34
0.38
F24
F14
0.37
0.39
0.40
0.41
0.42
0.43
CIE X
F11
F21
F31
F41
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3996
0.4015
0.4071
0.4052
0.4146
0.4089
0.4223
0.4127
0.3969
0.3934
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.4261
0.4077
0.4052
0.4146
0.4089
0.4223
0.4127
0.4299
0.4071
F12
F22
F32
0.4165
F42
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3969
0.3934
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.3943
0.3853
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.4223
0.3990
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.4261
0.4077
F13
F23
F33
F43
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3943
0.3853
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.3916
0.3771
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.4185
0.3902
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.4223
0.3990
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3916
0.3771
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.3889
0.3690
0.3953
0.3721
0.4017
0.3751
0.4082
0.3783
0.3953
0.3721
0.4017
0.3751
0.4082
0.3783
0.4147
0.3814
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.4185
0.3902
F14
F24
Rev2.1, Sep 1, 2015
F34
12
F44
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Color Bin Structure
<IF=20mA, Ta=25℃>
0.43
2900K
3000K
3200K
0.42
G41
G31
G21
G11
G42
CIE Y
0.41
G32
G22
G12
G43
0.40
G23
G33
G13
0.39
G14
G24
G44
G34
0.38
0.41
0.42
0.43
0.44
0.45
0.46
CIE X
G11
G21
G31
G41
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4299
0.4165
0.4364
0.4188
0.4430
0.4212
0.4496
0.4236
0.4261
0.4077
0.4324
0.4099
0.4387
0.4122
0.4451
0.4145
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4514
0.4168
0.4189
0.4430
0.4212
0.4496
0.4236
0.4562
0.4365
G12
G22
G32
0.4260
G42
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4261
0.4077
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4223
0.3990
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4468
0.4077
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4515
0.4168
G13
G23
G33
G43
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4223
0.3990
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4185
0.3902
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4420
0.3985
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4468
0.4077
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4243
0.3922
0.4302
0.3943
0.4302
0.3943
0.4361
0.3964
0.4203
0.3834
0.4259
0.3853
0.4259
0.3853
0.4316
0.3873
0.4147
0.3814
0.4203
0.3834
0.4316
0.3873
0.4373
0.3893
0.4185
0.3902
0.4243
0.3922
0.4361
0.3964
0.4420
0.3985
G14
G24
Rev2.1, Sep 1, 2015
G34
13
G44
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Color Bin Structure
<IF=20mA, Ta=25℃>
0.44
0.43
2900K
CIE Y
H21
H11
0.42
H13
H24 H34
H41
H31
H42
H43
H33
H23
0.40
H14
H32
H22
H12
0.41
2600K
2700K
H44
0.39
0.38
0.43
0.44
0.45
0.46
0.47
0.48
CIE X
H11
H21
H31
H41
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4562
0.4260
0.4625
0.4275
0.4687
0.4289
0.4750
0.4304
0.4515
0.4168
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4758
0.4225
0.4275
0.4687
0.4289
0.4750
0.4304
0.4810
0.4625
H12
H22
H32
0.4319
H42
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4515
0.4168
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4468
0.4077
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4703
0.4132
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4758
0.4225
H13
H23
H33
H43
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4468
0.4077
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4420
0.3985
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4648
0.4038
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4703
0.4132
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4420
0.3985
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4373
0.3893
0.4428
0.3906
0.4483
0.3919
0.4538
0.3932
0.4428
0.3906
0.4483
0.3919
0.4538
0.3932
0.4593
0.3944
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4648
0.4038
H14
H24
Rev2.1, Sep 1, 2015
H34
14
H44
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Mechanical Dimensions
Top View
N.C
Bottom View
A
N.C
C
Slug : Anode
Cathode Mark
Side View
Circuit
Cathode
1
Anode
2
ESD Protection Device
[Note] Package Forward Current is 20mA
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Emitter Tape & Reel Packaging
15.4±1.0
180
13±0.3
60
2
22
13
( Tolerance: ±0.2, Unit: mm )
(1) Quantity : Max 3,500pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape
Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of
10˚ to the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package.
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Product Nomenclature
Table 6. Part Numbering System : X1X2X3X4X5X6X7X8
Part Number Code
Description
Part Number
Value
X1
Company
S
SSC
X2
Acrich LED series
A
X3X4
Color Specification
W9
CRI 90
X5
Package series
K
K series
X6
Voltage
G
X7
PCB type
0
Emitter
X8
Revision
B
rev1
Table 7. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17
Lot Number Code
Description
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
Rev2.1, Sep 1, 2015
Lot Number
18
Value
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Recommended Solder Pad
[Recommended Solder Pattern]
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only
(4) Undefined tolerance is ±0.1mm
Rev2.1, Sep 1, 2015
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant .
The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant
changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or shredded in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products when
chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for
storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy.
The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of fixtures
can help prevent these issues.
(14) Attaching LEDs, do not use adhesives that outgas organic vapor.
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
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Product Data Sheet
SAW9KG0B – Acrich MJT 5630
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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