SPW08F0Z - Seoul Semiconductor

Product Data Sheet
SPW08F0Z – P8 Series White
Applicable for automotive exterior light
P8 Series White
SPW08F0Z
RoHS
AEC-Q101
Product Brief
Description
Features and Benefits
•
It has a substrate made up of a molded
plastic reflector sitting on top of a bent
lead frame(Au Plating).
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone
•
•
•
•
•
•
The high reliability feature is crucial to
automotive front, Interior lamp and
General Lights
Key Applications
•
•
Rev4.1, Sep 2, 2015
Industry Standard SMT package
Low thermal resistance
Lead free product
RoHS Compliant
MSL 2
1
Automotive Exterior Lighting
- Daytime Running Lamp
- Position Lamp
- License Plate Lamp
- Backup Lamp
Automotive Interior Lighting
- Room Lamp
- Map Lamp
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Product Data Sheet
SPW08F0Z – P8 Series White
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Performance Characteristics
3
•
Characteristics Graph
5
•
Color Bin Structure
11
•
Reliability Test
13
•
Mechanical Dimensions
14
•
Material Structure
15
•
Recommended Solder Pad
16
•
Reflow Soldering Characteristics
18
•
Emitter Tape & Reel Packaging
19
•
Product Nomenclature
20
•
Handling of Silicone Resin for LEDs
21
•
Precaution For Use
22
•
Company Information
25
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Product Data Sheet
SPW08F0Z – P8 Series White
Performance Characteristics
Table 1. Electro Optical Characteristics, IF =150mA, Ta = 25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Forward Voltage [1]
VF
Luminous Flux [2] [1]
ΦV
Typ.
Max.
V
32.0
-
54.0
lm
X
0.33
-
Y
0.33
-
Viewing Angle [4]
2θ1/2
120
deg.
Optical Efficiency
ηop
68.75
lm/W
Rth JA
55
℃/W
Rth JS
23
℃/W
Temperature coefficient of VF
25℃ ≤ T ≤ 100 ℃
TCv
-3.37
mV/℃
Temperature coefficient of X
25℃ ≤ T ≤ 100 ℃
TCx
-0.08
10-3/℃
Temperature coefficient of Y
25℃ ≤ T ≤ 100 ℃
TCy
-0.07
10-3/℃
Color Coordinate
[3] [1]
Thermal resistance [5]
Notes :
(1) Tolerance : VF :±0.05V, LF :±7%, x,y :±0.005
(2) The luminous flux was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
(3) Correlated Color is derived from the CIE 1931 Chromaticity diagram.
(4) Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity
(5) Thermal resistance = Rth JA : Junction/ambient , Rth JS : Junction/solder point
PCB design for improved heat dissipation : area of 950 mm2 per LED, Metal core PCB
※ Not applicable for reverse operation
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Product Data Sheet
SPW08F0Z – P8 Series White
Performance Characteristics
Table 2. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Power Dissipation (Ta=25℃)
Pd
1.06
W
Forward Current (Ta=25℃)
IF
250
mA
Operating Temperature
Topr
-40 ~ +125
℃
Storage Temperature
Tstg
-40 ~ +125
℃
Junction Temperature
Tj
150
℃
Soldering Temperature
Tsld
Reflow Soldering : 260 ℃ for 10sec.
Hand Soldering : 315 ℃ for 4sec.
ESD (R=1.5kΩ, C= 100pF) [1]
8
kV
Notes :
(1) A ESD Protection device is included for protection.
•
•
LED’s properties might be different from suggested values like above and below tables if
operation condition will be exceeded our parameter range. Care is to be taken that power
dissipation does not exceed the absolute maximum rating of the product.
All measurements were made under the standardized environment of Seoul Semiconductor.
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Product Data Sheet
SPW08F0Z – P8 Series White
Characteristics Graph
Fig 1. Color Spectrum, IF = 150mA, Ta = 25ºC, RH30%
Relative Luminous Intensity
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
Wavelength [nm]
Fig 2. Viewing Angle Distribution, IF = 150mA
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Product Data Sheet
SPW08F0Z – P8 Series White
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, T a = 25ºC
Forward Current [mA]
250
200
150
100
50
0
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous flux, Ta = 25ºC
60
45
Φv
30
▷
15
0
0
△LF = Φv / Φv(150mA)
Rev4.1, Sep 2, 2015
50
100
150
200
250
Forward Current [mA]
6
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Product Data Sheet
SPW08F0Z – P8 Series White
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift, T a = 25ºC
0.020
CIE Coord. X
CIE Coord. Y
0.015
CIE Coordinate
0.010
0.005
0.000
-0.005
-0.010
0
50
100
150
200
250
Forward Current [mA]
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Product Data Sheet
SPW08F0Z – P8 Series White
Characteristics Graph
Fig 6. Relative Light Output vs. Junction Temperature, IF = 150mA
1.2
Φv
1.1
1.0
▷
0.9
0.8
0.7
0.6
-40
-20
0
20
40
60
80
100
120
140
Junction Temperature [℃]
△LF = Φv / Φv(25℃)
Fig 7. Junction Temperature vs. Forward Voltage Shift, IF = 150mA
0.4
VF
0.2
0.0
▷
-0.2
-0.4
-40
△ VF = VF - VF(25℃)
Rev4.1, Sep 2, 2015
-20
0
20
40
60
80
100
120
140
Junction Temperature [℃]
8
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Product Data Sheet
SPW08F0Z – P8 Series White
Characteristics Graph
Fig 8. Chromaticity Coordinate vs. Junction Temperature, IF = 150mA
0.010
CIE Coord. X
CIE Coord. Y
Cx, Cy
0.005
0.000
▷
-0.005
-0.010
-0.015
-40
-20
0
20
40
60
80
100
120
140
Junction Temperature [℃]
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Product Data Sheet
SPW08F0Z – P8 Series White
Characteristics Graph
Fig 9. Maximum Forward Current vs. Temperature
Maximum Forward Current IF [mA]
Maximum Current [mA]
300
250
200
RthJ-S
RthJ-A
150
100
50
0
0
20
40
60
80
Temperature [℃]
100
120
140
o
Temperature [ C]
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Product Data Sheet
SPW08F0Z – P8 Series White
Color Bin Structure
Table 3. Bin Code description, IF = 150mA
Luminous Flux (lm)
Part Number
Bin
Code
Min.
Max.
Color
Chromaticity
Coordinate
Q0
32.0
41.5
R0
41.5
54.0
Forward Voltage (VF)
Bin
Code
Min.
Max.
A
H
3.00
3.25
B
I
3.25
3.45
SPW08F0Z
Available ranks
*Notes :
(1) All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability, single color rank will not be orderable.
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Product Data Sheet
SPW08F0Z – P8 Series White
Color Bin Structure
CIE Chromaticity Diagram, IF = 150mA, Ta = 25ºC
5300K
0.36
5600K
B1
6000K
B0
B3
6500K
CIE (y)
0.34
A1
7000K
A3
A0
B5
B4
A5
A2
0.32
B2
A7
A4
A6
0.30
0.30
0.32
0.34
CIE (x)
A0
CIE x
0.3028
0.3041
0.3126
0.3115
A1
CIE y
0.3304
0.3240
0.3324
0.3393
CIE x
0.3115
0.3126
0.3210
0.3205
CIE y
0.3240
0.3177
0.3256
0.3324
CIE x
0.3126
0.3136
0.3216
0.3210
CIE y
0.3177
0.3113
0.3187
0.3256
CIE x
0.3136
0.3146
0.3221
0.3216
CIE y
0.3113
0.3046
0.3120
0.3187
CIE x
0.3146
0.3155
0.3225
0.3221
A2
CIE x
0.3041
0.3055
0.3136
0.3126
CIE y
0.3324
0.3256
0.3334
0.3408
CIE x
0.3212
0.3217
0.3293
0.3293
CIE y
0.3256
0.3187
0.3261
0.3334
CIE x
0.3217
0.3222
0.3294
0.3293
B1
CIE y
0.3462
0.3389
0.3461
0.3539
CIE x
0.3292
0.3293
0.3373
0.3376
CIE y
0.3389
0.3316
0.3384
0.3461
CIE x
0.3293
0.3293
0.3369
0.3373
CIE y
0.3316
0.3243
0.3306
0.3384
CIE x
0.3293
0.3294
0.3366
0.3369
B2
A5
A6
CIE x
0.3068
0.3082
0.3155
0.3146
CIE x
0.3207
0.3212
0.3293
0.3292
A3
A4
CIE x
0.3055
0.3068
0.3146
0.3136
B0
CIE y
0.3393
0.3324
0.3408
0.3481
CIE y
0.3539
0.3461
0.3534
0.3616
B3
B4
CIE y
0.3461
0.3384
0.3451
0.3534
B5
CIE y
0.3384
0.3306
0.3369
0.3451
A7
CIE y
0.3187
0.3120
0.3190
0.3261
*Notes :
•Measurement Uncertainty of the Color Coordinates : ± 0.005
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Product Data Sheet
SPW08F0Z – P8 Series White
Reliability Test
Test Item
Standard
Test Method
Test Condition
Duration
/ Cycle
Number
Of Test
External Visual
JESD22 B-101
Visual inspection
-
77
D.P.A
AEC-Q101-004
Random Sample H3TRB,HAST,TC
-
5
ESD
JESD22 A-114
Human-body mode,
R=1.5㏀, C = 100pF
3 times
Negative/
Positive
30
Physical Dimension
JESD22 B-100
Verify physical dimensions against
device mechanical drawing
3 times
30
Temperature cycling
JESD22 A-104
Tc= -55°∼150°C, 30 min. dwell,
5 min transfer, 1000 cycles
1000hrs
77
Power Temperature Cycle
JESD22 A-105
Ta=-40℃~85℃, If =150mA,
20 min dwell / 20 min transition
(1 hour cycle), 2 min ON / 2 min OFF
1000hrs
77
High Humidity
High Temp.
Operating Life
JESD22 A-101
85℃/85% RH, @ 150mA
1hr ON/1hr OFF
1000hrs
77
High Temperature
Operating Life
JESD22 A-108C
Ta= 85°C, If =150mA
1000hrs
77
Solderability
JESD22B-102
Bake : 150 ℃
Dipping terminal to 245 ℃
-
10
Resistance solder heat
JESD22 A-111
Preconditioned at MSL 2
Bake : 125 ℃,
Soak : 60 ℃, 60 % R.H.
Full body immersion to 260 ℃.
-
10
Thermal Resistance
JESD24
Measure TR to assure
specification compliance
-
10
Wire bond strength
MIL-STD-750
Pull test to assure
specification compliance
-
10
Bond shear
AEC-Q101-003
Shear test to assure
specification compliance
-
10
Die shear
MIL-STD-750
Shear test to assure
specification compliance
-
10
Low Temperature
Operating Life
SSC
(Internal standard)
Ta=-40℃, IF=150mA
1000hrs
77
Criteria for Judging the Damage
Criteria for Judgment
Item
Symbol
Condition
MIN
MAX
Forward Voltage
VF
IF =150mA
-
Initial × 1.1
Luminous Intensity
IV
IF =150mA
Initial × 0.8
-
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Product Data Sheet
SPW08F0Z – P8 Series White
Mechanical Dimensions
< CirCuit Diagram >
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.1mm
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Product Data Sheet
SPW08F0Z – P8 Series White
Material Structure
③
④
②
⑤
①
Parts No.
Name
Description
Materials
①
Substrate
Metal
Ceramic
Copper Alloy
(Gold Plated)
②
Chip Source
Blue LED
GaN on Sapphire
③
Wire
Metal
Gold Wire
④
Encapsulation
Silicone
+Phosphor
⑤
ESD Protection Device
Si
-
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Product Data Sheet
SPW08F0Z – P8 Series White
Recommended Solder Pad
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only.
(4) Undefined tolerance is ±0.1mm.
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Product Data Sheet
SPW08F0Z – P8 Series White
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
SPW08F0Z – P8 Series White
1.75±0.1
Emitter Tape & Reel Packaging
4±0.1
0.25±0.05
5.30±0.1
8.0±0.1
4.80±0.1
12.0±0.2
(4.75)
5.5±0.05
2±0.05
1.30±0.1
Package
Marking
15.4±1.0
180
13±0.3
60
2
22
13
(1) All dimensions are in millimeters.
(2) Undefined tolerance is ±0.2mm
(3) Quantity : 1,500pcs/Reel
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned
off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
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Product Data Sheet
SPW08F0Z – P8 Series White
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
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Product Data Sheet
SPW08F0Z – P8 Series White
Product Nomenclature
Table 4. Part Numbering System : X1X2X3X4X5X6X7X8
Part Number Code
Description
Part Number
Value
X1
Company
S
SSC Code
X2
Power LED Series number
P
Power
X3X4
Color Specification
W0
Pure white
X5
PKG Series
8
P8 Series
X6
Lens Type
F
Flat
X7
PCB Type
0
Emitter
X8
Revision
Z
-
Table 5. Lot Numbering System : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8
Lot Number Code
Description
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
Rev4.1, Sep 2, 2015
Lot Number
20
Value
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Product Data Sheet
SPW08F0Z – P8 Series White
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to
LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing. In
cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are
used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic
cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.
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Product Data Sheet
SPW08F0Z – P8 Series White
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing P8 Series LEDs in a dry box with a
desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere
should be used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
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Product Data Sheet
SPW08F0Z – P8 Series White
Precaution for Use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy.
The result can be a significant loss of light output from the fixture. Knowledge of the properties of the
materials selected to be used in the construction of fixtures can help prevent these issues.
(14) The slug is electrically isolated.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
SPW08F0Z – P8 Series White
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
SPW08F0Z – P8 Series White
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
Rev4.1, Sep 2, 2015
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