Characteristics Graph

Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Superior high Flux for High Voltage System
Acrich MJT– 5050 Series
SAW0LA0A (Cool, Neutral)
RoHS
Product Brief
Description
Features and Benefits
•
•
The MJT series of LEDs are designed
for AC & DC(High Voltage) operation
and high flux output applications.
•
MJT’s thermal management
performance exceeds other power LED
solutions by incorporating state-of-theart SMD design and use of specialized
thermal emission material.
•
MJT is an ideal light source for general
purpose illumination applications.
•
•
•
Super high Flux output and high
Luminance
31V typical forward voltage @40mA
Dimension : 5.0x5.0x0.65mm
SMT solderable
Key Applications
•
•
•
•
•
•
•
•
Architectural
Retail Display
Commercial
Industrial - High/Low bay
Outdoor area - Street & tunnel light
parking light
Off-grid
Safety & Security
Table 1. Product Selection Table
CCT
Part Number
Color
Min.
Typ.
Max.
Cool White
4700K
5600K
7000K
Neutral White
3700K
4200K
4700K
SAW0LA0A
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Performance Characteristics
3
•
Characteristics Graph
4
•
Color Bin Structure
10
•
Mechanical Dimensions
14
•
Recommended Solder Pad
15
•
Reflow Soldering Characteristics
16
•
Emitter Tape & Reel Packaging
17
•
Product Nomenclature
19
•
Handling of Silicone Resin for LEDs
20
•
Precaution For Use
21
•
Company Information
24
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Product Performance & Characterization Guide
Table 2. Characteristics, IF=40mA , Tj=25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
40
80
mA
Forward Current
IF
Forward Voltage
VF
28.5
31
33.5
V
Luminous Flux [1]
ФV [2]
154
180
-
lm
Correlated Color Temperature [3]
CCT
3,700
-
7,000
K
Ra
70
-
80
-
Viewing Angle
2Θ1/2
-
120
-
deg.
Power Dissipation
PD
-
1.24
2.01
W
Junction Temperature
Tj
-
-
125
ºC
Operating Temperature
Topr
- 40
-
+ 85
ºC
Storage Temperature
Tstg
- 40
-
+ 100
ºC
Thermal resistance (J to S) [5]
RθJ-S
-
6.0
-
℃/W
ESD Sensitivity(HBM)
-
Color Rendering Index
[4]
Class 3A JESD22-A114-E
Notes :
[1] Acrich series maintains a tolerance of 7% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integration sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
*Color coordinate:  0.01, CCT: 5%
[4] Tolerance is 2.0 on CRI measurements.
[5] Thermal resistance: RthJS (Junction to Solder)
•
•
•
LED’s properties might be different from suggested values like above and below tables if
operation condition will be exceeded our parameter range. Care is to be taken that power
dissipation does not exceed the absolute maximum rating of the product.
Thermal resistance can be increased substantially depending on the heat sink design/operating
condition, and the maximum possible driving current will decrease accordingly.
All measurements were made under the standardized environment of Seoul Semiconductor.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Characteristics Graph
Fig 1. Color Spectrum, Tj = 25ºC , IF=40mA
1.0
Relative Spectral Power Distribution
Cool White
Netural White
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength(nm)
Fig 2. Radiant Pattern, Tj = 25ºC , IF=40mA
1.0
Relative Luminous Flux
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
90
Angle [deg.]
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC
0.08
0.07
Forward Current [A]
0.06
0.05
0.04
0.03
0.02
0.01
0.00
0
5
10
15
20
25
30
35
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC
1.8
Relative Luminous Flux
1.5
1.2
0.9
0.6
0.3
0.0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
Forward Current (A)
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Characteristics Graph
Fig 5. Forward Current vs. CIE x, y Shift, Ta=25℃
0.358
0.356
0.354
CIE y
10mA
20mA
0.352
40mA
0.350
60mA
80mA
0.348
0.346
0.344
0.338
0.339
0.340
0.341
0.342
0.343
CIE x
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Characteristics Graph
Fig 6. Junction Temperature vs. Relative Light Output, IF=40mA
Relative Luminous Intensity
1.0
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
o
Junction Temperature [ C]
Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=40mA
0
Forward Voltage Shift [V]
-2
-4
-6
-8
-10
-12
-14
25
50
75
100
125
o
Junction Temperature [ C]
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Characteristics Graph
Fig 8. Junction Temperature vs. CIE x, y shift, IF=40mA
0.35
0.34
25℃
CIE y
55℃
85℃
0.33
105℃
125℃
0.32
0.31
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
CIE x
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Characteristics Graph
Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃
0.08
0.07
Max. Current [A]
0.06
0.05
o
RjaT=40 C/W
0.04
o
RjaT=30 C/W
o
0.03
RjaT=20 C/W
0.02
0.01
0.00
0
25
50
75
100
125
o
Ambient Temperature [ C]
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Color Bin Structure
Table 3. Bin Code description, Tj=25℃, IF=40mA
Luminous Flux
(lm)
Part Number
SAW0LA0A
Bin Code
Min.
Max.
W1
154
177
W2
177
200
X1
200
230
Forward Voltage
(Vf)
Color
Chromaticity
Coordinate
Bin Code
Min.
Max.
A
28.5
30.0
B
30.0
31.5
C
31.5
33.5
Refer to page.11
Table 4. Luminous Flux rank distribution
CCT
CIE
Flux Rank
7000 ~ 6000K
A
W1
W2
X1
6000 ~ 5300K
B
W1
W2
X1
5300 ~ 4700K
C
W1
W2
X1
4700 ~ 4200K
D
W1
W2
X1
4200 ~ 3700K
E
W1
W2
X1
Available ranks
Not yet available ranks
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=40mA
0.44
0.42
3700K
4000K
4200K
0.40
4500K
4700K
5000K
5300K
CIE y
0.38
C
6000K
6500K
0.34
D
5600K
0.36
E
B
7000K
A
0.32
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
CIE x
*Notes :
• Measurement Uncertainty of the Color Coordinates : ± 0.01
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tj=25℃, IF=40mA
4700K
0.38
5000K
C1
5300K
0.36
C0
5600K
B1
C2
B0
B3
C4
B2
B5
CIE y
6000K
6500K
0.34
7000K
A0
A2
0.32
A1
A3
C3
C5
B4
A5
A4
0.30
0.30
0.32
0.34
0.36
CIE x
A0
CIE x
0.3028
0.3041
0.3126
0.3115
A1
CIE y
0.3304
0.3240
0.3324
0.3393
CIE x
0.3115
0.3126
0.3210
0.3205
CIE y
0.3324
0.3256
0.3334
0.3408
CIE x
0.3055
0.3068
0.3146
0.3136
CIE y
0.3462
0.3389
0.3461
0.3539
CIE x
0.3292
0.3293
0.3373
0.3376
CIE y
0.3461
0.3384
0.3451
0.3534
CIE x
0.3217
0.3222
0.3294
0.3293
CIE y
0.3616
0.3534
0.3601
0.3687
CIE x
0.3463
0.3456
0.3539
0.3552
CIE y
0.3601
0.3514
0.3578
0.3669
CIE x
0.3369
0.3366
0.3440
0.3448
A3
CIE x
0.3126
0.3136
0.3216
0.3210
Rev1.0, July 1, 2015
CIE y
0.3539
0.3461
0.3534
0.3616
CIE x
0.3212
0.3217
0.3293
0.3293
CIE y
0.3316
0.3243
0.3306
0.3384
CIE x
0.3293
0.3294
0.3366
0.3369
CIE y
0.3687
0.3601
0.3669
0.3760
CIE x
0.3373
0.3369
0.3448
0.3456
CIE y
0.3451
0.3369
0.3428
0.3514
CIE x
0.3448
0.3440
0.3514
0.3526
CIE y
0.3256
0.3187
0.3261
0.3334
B2
CIE y
0.3389
0.3316
0.3384
0.3461
B5
CIE y
0.3384
0.3306
0.3369
0.3451
C2
C4
12
CIE y
0.3240
0.3177
0.3256
0.3324
A5
C1
C3
CIE x
0.3456
0.3448
0.3526
0.3539
CIE x
0.3136
0.3146
0.3221
0.3216
B4
C0
CIE x
0.3376
0.3373
0.3456
0.3463
CIE y
0.3177
0.3113
0.3187
0.3256
B1
B3
CIE x
0.3293
0.3293
0.3369
0.3373
CIE x
0.3041
0.3055
0.3136
0.3126
A4
B0
CIE x
0.3207
0.3212
0.3293
0.3292
A2
CIE y
0.3393
0.3324
0.3408
0.3481
CIE y
0.3534
0.3451
0.3514
0.3601
C5
CIE y
0.3514
0.3428
0.3487
0.3578
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Color Bin Structure
CIE Chromaticity Diagram (Neutral white), Tj=25℃, IF=40mA
0.42
3700K
4000K
0.40
4200K
CIE y
4500K
4700K
0.38
D1
D0
D2
0.36
E1
E0
D3
E2
E3
E5
E4
D5
D4
0.34
0.32
0.34
0.36
0.38
0.40
0.42
CIE x
D0
CIE x
0.3548
0.3536
0.3625
0.3641
D1
CIE y
0.3736
0.3646
0.3711
0.3804
CIE x
0.3641
0.3625
0.3714
0.3736
CIE y
0.3711
0.3616
0.3677
0.3775
CIE x
0.3524
0.3512
0.3590
0.3608
CIE y
0.3874
0.3775
0.3855
0.3958
CIE x
0.3869
0.3842
0.3970
0.4006
CIE y
0.3855
0.3751
0.3825
0.3935
CIE x
0.3692
0.3670
0.3783
0.3813
D3
CIE x
0.3625
0.3608
0.3692
0.3714
Rev1.0, July 1, 2015
CIE y
0.3555
0.3465
0.3521
0.3616
CIE x
0.3608
0.3590
0.3670
0.3692
CIE y
0.3958
0.3855
0.3935
0.4044
CIE x
0.3714
0.3692
0.3813
0.3842
CIE y
0.3677
0.3578
0.3646
0.3751
CIE x
0.3813
0.3783
0.3898
0.3934
CIE y
0.3616
0.3521
0.3578
0.3677
E2
E4
13
CIE y
0.3646
0.3555
0.3616
0.3711
D5
E1
E3
CIE x
0.3842
0.3813
0.3934
0.3970
CIE x
0.3536
0.3524
0.3608
0.3625
D4
E0
CIE x
0.3736
0.3714
0.3842
0.3869
D2
CIE y
0.3804
0.3711
0.3775
0.3874
CIE y
0.3775
0.3677
0.3751
0.3855
E5
CIE y
0.3751
0.3646
0.3716
0.3825
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Mechanical Dimensions
< Top View >
< Bottom View >
Cathode
< Side view>
Cathode
Anode
< Inner Circuit Diagram>
Anode
Cathode
ESD Protection Device
Notes :
(1)
(2)
(3)
(4)
All dimensions are in millimeters.
Scale : none
Undefined tolerance is ±0.1mm
The appearance and specifications of the product may be changed for improvement without notice.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Recommended Solder Pad
Notes :
(1)
(2)
(3)
(4)
All dimensions are in millimeters.
Scale : none
Undefined tolerance is ±0.1mm
The appearance and specifications of the product may be changed for improvement without notice.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 5.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Emitter Tape & Reel Packaging
Notes :
(1) Quantity : 7 inch reel type ( 1,800 pcs / Reel )
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Emitter Tape & Reel Packaging
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Product Nomenclature
Table 6. Part Numbering System : X1X2X3X4X5X6X7X8
Part Number Code
Description
Part Number
Value
X1
Company
S
SSC
X2
Acrich LED series
A
X3X4
Color Specification
W0
CRI70
X5
Package series
L
L series
X6
Chip
A
X7
PCB type
0
Emitter
X8
Revision
A
rev0
Table 7. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17
Lot Number Code
Description
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
Rev1.0, July 1, 2015
Lot Number
19
Value
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The
recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere
should be used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Precaution for Use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy.
The result can be a significant loss of light output from the fixture. Knowledge of the properties of the
materials selected to be used in the construction of fixtures can help prevent these issues.
(14) The slug is electrically isolated.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
SAW0LA0A - Acrich MJT 5050
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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