Specification KWT803-S

Z-Power LED
X10490
Technical
Data
Sheet
Specification
KWT803-S
SSC
Drawn
Approval
Customer
Approval
Rev.08
Aug 2011
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Description
2.
Absolute Maximum Ratings
3.
Electro-Optical Characteristics
4.
Optical characteristics
5.
Reliability Test
6.
Color & Binning
7.
Bin Code Description
8.
Outline Dimension
9.
Reel Structure
10. Packing
11. Soldering
12. Precaution for use
13. Handling of Silicone Resin LEDs
Rev.08
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
KWT803-S
1. Description
This surface-mount LED comes in PLCC
standard package dimension. It has a
substrate made up of a molded plastic
reflector sitting on top of a bent lead frame.
The die is attached within the reflector cavity
and the cavity is encapsulated by epoxy
or silicone.
Features
• White colored
SMT package
• InGaN material
• Suitable for all SMT
The package design coupled with careful
selection of component materials allow these
products to perform with high reliability in a
larger temperature range 40℃ to 100℃.
assembly and
soldering methods
• Pb-Free Reflow
soldering application
• RoHS compliant
Applications
• Interior lighting
• General lighting
• Indoor and out door
displays
• Architectural /
Decorative lighting
• White Back-light
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
[1]
Symbol
Value
Unit
Power Dissipation
Pd
111
mW
Forward Current
IF
30
mA
IFM [2]
90
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40~+85
Storage Temperature
Tstg
-40~+100
Junction Temperature
Tj
125
Peak Forward Current
℃
℃
℃
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
[2] IFM was measured at Tw 1 msec of pulse width and D 1/10 of duty ratio.
[3] LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
≤
≤
3. Electro-Optical characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Forward Voltage*
VF
IF=20mA
2.9
3.2
3.4
V
Reverse Current
IR
VF=5V
-
-
10
μA
Luminous Intensity*[1]
Iv
IF=20mA
1,700
-
2,500
Mcd
CCT
IF=20mA
5,300
-
8,900
K
2Θ1/2
IF=20mA
-
115
-
deg.
Ra
IF=20mA
62
68
-
-
1.5k ;100pF
1
-
-
KV
Color Temperature
Viewing Angle
[2]
Color Rendering Index*
ESD (HBM)
Thermal resistance
[3]
RthJS
Ω
IF=20mA
76
ºC/W
[1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package.
[2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[3] Thermal resistance: RthJS (Junction / solder)
* Tolerance : VF :± 0.05V, IV :± 10%, Ra :± 3, x,y :± 0.01
[Note] All measurements were made under the standardized environment of SSC.
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SSC- QP- 7- 07- 24 (Rev.00)
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
(Ta=25 OC )
90
2.0
80
1.8
Relative Luminous Intensity [%]
Forward Current IF [mA]
(Ta=25 OC )
70
60
50
40
30
20
10
0
2.6
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
2.8
3.0
3.2
3.4
3.6
3.8
4.0
0.0
4.2
0
10
Forward Voltage VF (V)
20
30
40
Forward Current IF [mA]
Forward Current Derating Curve
Radiation Diagram
35
0
30
-30
Forward Current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
30
25
20
-60
60
15
10
90
-90
5
0
-25
0
25
50
75
100
O
Ambient temperature Ta( C)
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
Spectrum
Relative Emission Intensity
1.0
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Reliability Test
Item
Reference
Test Conditions
Duration /
Cycle
Number
of
Damaged
Thermal Shock
EIAJ
ED-4701
Ta =-40oC(30min) ~
100oC(30min)
100 Cycle
0/22
High Temperature
Storage
EIAJ
ED-4701
Ta =100oC
1000 Hours
0/22
High Temp. High
Humidity Storage
EIAJ
ED-4701
Ta =60oC, RH=90%
1000 Hours
0/22
Low Temperature
Storage
EIAJ
ED-4701
Ta =-40oC
1000 Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1000 Hours
0/22
High Temperature
High Humidity Life
Test
Internal
Reference
Ta =60oC, RH=90%, IF =20mA
500 Hours
0/22
High Temperature
Life Test
Internal
Reference
Ta =85oC, IF =20mA
500 Hours
0/22
Low Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =20mA
1000 Hours
0/22
MIL-STD883D
1KV at 1.5k ; 100pF
3 Time
0/22
ESD(HBM)
Ω
Criteria for Judging the Damage
Criteria for Judgement
Item
Symbol
Condition
MIN
MAX
Forward Voltage
VF
IF =20mA
-
USL*1 × 1.2
Luminous
Intensity
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.9
515
0.8
520 525
530
535
540
510
545
0.7
550
555
505
560
0.6
565
570
500
575
580
585
590
595
600
CIE Y
0.5
0.4
0.3
0.2
495
610
620
630
830
490
485
480
0.1
0.0
0.0
475
470
460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CIEX
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
5300K
0.38
5600K
g4
g5
0.36
6000K
CIE Y
0.34
6500K
7000K
0.32
7800K
0.30
8900K
g3
f5
f6
f2
f3
e6
e3
0.28
0.26
0.28
g6
g2
f4
f1
e4
e5
e1
e2
g1
0.29
0.30
0.31
0.32
0.33
0.34
0.35
CIE X
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=20mA, Ta=25
e1
e2
e3
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.2885
0.2925
0.2917
0.2855
0.2953
0.2775
0.2917
0.2855
0.2953
0.2775
0.2985
0.2705
0.2997
0.2995
0.3033
0.2915
0.3065
0.2845
0.2965
0.3065
0.2997
0.2995
0.3033
0.2915
e4
e5
e6
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.2965
0.3065
0.2997
0.2995
0.3033
0.2915
0.2997
0.2995
0.3033
0.2915
0.3065
0.2845
0.3077
0.3135
0.3113
0.3055
0.3145
0.2985
0.3045
0.3205
0.3077
0.3135
0.3113
0.3055
f1
f2
f3
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3045
0.3205
0.3077
0.3135
0.3113
0.3055
0.3077
0.3135
0.3113
0.3055
0.3145
0.2985
0.3157
0.3275
0.3193
0.3195
0.3225
0.3125
0.3125
0.3345
0.3157
0.3275
0.3193
0.3195
f4
℃>
f5
f6
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3125
0.3345
0.3157
0.3275
0.3193
0.3195
0.3157
0.3275
0.3193
0.3195
0.3225
0.3125
0.3237
0.3415
0.3273
0.3335
0.3305
0.3265
0.3205
0.3485
0.3237
0.3415
0.3273
0.3335
Rev.08
Aug 2011
* Measurement Uncertainty of the Color Coordinates : ± 0.01
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=20mA, Ta=25
g1
g2
g3
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3205
0.3485
0.3237
0.3415
0.3273
0.3335
0.3237
0.3415
0.3273
0.3335
0.3305
0.3265
0.3317
0.3555
0.3353
0.3475
0.3385
0.3405
0.3285
0.3625
0.3317
0.3555
0.3353
0.3475
g4
℃>
g5
g6
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3285
0.3625
0.3317
0.3555
0.3353
0.3475
0.3317
0.3555
0.3353
0.3475
0.3385
0.3405
0.3397
0.3695
0.3433
0.3615
0.3465
0.3545
0.3365
0.3765
0.3397
0.3695
0.3433
0.3615
Rev.08
Aug 2011
* Measurement Uncertainty of the Color Coordinates : ± 0.01
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. Bin Code Description
Bin Code
Luminous
Intensity
CIE
Forward
Voltage
K0
f1
Z1
Luminous Intensity
(mcd)
@ IF = 20mA
Flux
(lm)
Color Rank
@ IF = 20mA
e~g
Bin
Code
Min.
Max.
Typ
J7
1,700
1,800
4.9
J8
1,800
1,900
5.2
J9
1,900
2,000
5.4
K0
2,000
2,100
5.7
K1
2,100
2,200
5.9
K2
2,200
2,300
6.2
K3
2,300
2,400
6.5
K4
2,400
2,500
6.8
Forward Voltage (V)
@ IF = 20mA
Bin
Code
Min.
Max.
Y
2.9
3.0
Z1
3.0
3.1
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
Available ranks
Not yet available ranks
[Note] All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8. Outline Dimension
Recommended Solder Pattern
( Tolerance:
±0.2, Unit: mm )
9. Reel Structure
( Tolerance:
±0.2, Unit: mm )
(1) Quantity : 3000pcs/ Reel
(2) Cumulative Tolerance : Cumulative Tolerance/ 10 pitches to be ± 0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1- 0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/ N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
a
c
b
245 220 102
7inch
245 220 142
TYPE
1 SIDE
c
TUV
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
MADE IN KOREA
Acriche
1
Semiconductor EcoLight
b
RoHS
a
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. soldering
(1) Lead Solder
Lead Solder
Lead Solder
PrePre-heat
PrePre-heat time
PeakPeak-Temperature
Soldering time
Condition
120~150℃
120 sec. Max.
240℃ Max.
10 sec. Max.
2.5~5 o C / sec.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-free Solder
Lead Free Solder
Pre150~200℃
Pre-heat
120 sec.
PrePre-heat time
Max.
Peak260℃ Max.
Peak-Temperature
Soldering time
Condition
10 sec. Max.
1~5 oC / sec.
1~5 oC / sec.
Pre-heating
150~200 oC
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
(5) It is recommended that the customer use the nitrogen reflow method.
(6) Repairing should not be done after the LEDs have been soldered.
(7) Reflow soldering should not be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 4 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60± 5ºC.
(4) Silver plating might be tarnished in the environment that contains corrosive gases
and materials. Also any product that has tarnished lead might be decreased the
solder-ability and optical-electrical properties compare to normal ones.
Please do not expose the product in the corrosive environment during the storage.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(6) Quick cooling shall be avoided.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products.
(9) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(10) When the LEDs are illuminating, operating current should be decided after considering
the ambient maximum temperature.
(11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and then
store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
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SSC- QP- 7- 07- 24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
13. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
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