PowerPoint 프레젠테이션 - Seoul Semiconductor

Product Data Sheet
STW9B12C – Mid-Power LED
Achieving the best system cost in Mid/High Power
Mid-Power LED – 3020 Series
STW9B12C (Neutral, Warm)
RoHS
Product Brief
Description
Features and Benefits
•
This White Colored surface-mount LED
comes in standard package dimension.
Package Size : 3.0x2.0x0.6mm
•
It has a substrate made up of a molded
plastic reflector sitting on top of a lead
frame.
•
•
•
•
•
•
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone.
•
Thermally Enhanced Package Design
Mid Power to High Power up to 0.4W
Max. Driving Current 120mA
Compact Package Size
High Color Quality with CRI Min. 90
Pb-free Reflow Soldering Application
Key Applications
•
•
•
•
The package design coupled with
careful selection of component materials
allow these products to perform with
high reliability.
Interior lighting
General lighting
Indoor and Outdoor displays
Architectural and Decorative lighting
Table 1. Product Selection Table
CCT
Part Number
Color
Min.
Typ.
Max.
STW9B12C
Neutral White
3700K
4000K
4200K
STW9B12C
Warm White
2600K
3000K
3700K
Rev1.0, May 30, 2014
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Product Data Sheet
STW9B12C – Mid-Power LED
Table of Contents
Index
•
Product Brief
•
Table of Contents
•
Performance Characteristics
•
Color Bin Structure
•
Packaging Information
•
Product Nomenclature (Labeling Information)
•
Recommended Solder Pad
•
Reflow Soldering Characteristics
•
Handling of Silicone Resin for LEDs
•
Precaution For Use
•
Company Information
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Product Data Sheet
STW9B12C – Mid-Power LED
Performance Characteristics
Table 2. Product Selection Guide, IF=100mA , Ta = 25ºC, RH30%
Part Number
CCT (K) [1]
RANK
Typ.
4000
3500
Luminous Intensity [2]
IV (cd)
Luminous Flux [3]
ФV (lm)
CRI
Ra
Min
Max
Min
Max
Min.
R0
8.0
8.5
24.0
25.5
90
R5
8.5
9.0
25.5
27.0
90
S0
9.0
9.5
27.0
28.5
90
S5
9.5
10.0
28.5
30.0
90
T0
10.0
10.5
30.0
31.5
90
R0
8.0
8.5
24.0
25.5
90
R5
8.5
9.0
25.5
27.0
90
S0
9.0
9.5
27.0
28.5
90
S5
9.5
10.0
28.5
30.0
90
T0
10.0
10.5
30.0
31.5
90
R0
8.0
8.5
24.0
25.5
90
R5
8.5
9.0
25.5
27.0
90
S0
9.0
9.5
27.0
28.5
90
S5
9.5
10.0
28.5
30.0
90
T0
10.0
10.5
30.0
31.5
90
R0
8.0
8.5
24.0
25.5
90
R5
8.5
9.0
25.5
27.0
90
S0
9.0
9.5
27.0
28.5
90
S5
9.5
10.0
28.5
30.0
90
T0
10.0
10.5
30.0
31.5
90
STW9B12C
3000
2700
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.007
(2) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements.
The luminous intensity IV was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
(3) Calculated performance values are for reference only.
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Product Data Sheet
STW9B12C – Mid-Power LED
Performance Characteristics
Table 3. Characteristics, IF=100mA , Ta = 25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
100
120
mA
3.4
V
-
cd
(lm)
Forward Current
IF
-
Forward Voltage
VF (100mA)
2.9
Luminous Intensity
(2,600~4,200 K)
Iv (100mA)
-
9.1
(27.3lm)
Ra
90
-
Color Rendering Index
Viewing Angle
[1]
[2]
2Θ1/2
-
120
Power Dissipation
Pd
-
408
mW
Junction Temperature
Tj
-
-
125
ºC
Operating Temperature
Topr
- 40
-
+ 85
ºC
Storage Temperature
Tstg
- 40
-
+ 100
ºC
Thermal resistance (J to S) [3]
RθJ-S
-
25
-
℃/W
ESD Sensitivity(HBM) [4]
-
-
-
5000
V
Notes :
(1) Tolerance is 2.0 on CRI measurements.
(2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity
(3) Thermal resistance: RthJS (Junction to Solder)
(4) A zener diode is included to protect the product from ESD.
•
•
LED’s properties might be different from suggested values like above and below tables if
operation condition will be exceeded our parameter range. Care is to be taken that power
dissipation does not exceed the absolute maximum rating of the product.
All measurements were made under the standardized environment of Seoul Semiconductor.
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Product Data Sheet
STW9B12C – Mid-Power LED
Relative Spectral Distribution
Fig 1. Color Spectrum, Ta = 25℃, RH30%
IF=100mA
Relative Emission Intensity
1.0
0.5
0.0
400
500
600
700
800
Wavelength [nm]
Fig 2. Viewing Angle Distribution
IF=100mA
0
1.01.0
30
0.80.8
0.60.6
60
0.40.4
0.20.2
0.00.0
-90
90
-60
0
-30
0.2
0.4
0.6
0.8
1.0
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Product Data Sheet
STW9B12C – Mid-Power LED
Forward Current Characteristics
Fig 3. Forward Voltage vs. Forward Current , Ta=25℃
400
Forward Current(mA)
350
300
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, Ta=25℃
1.4
Relative Luminous Intensity
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
160
Forward Current IF [mA]
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Product Data Sheet
STW9B12C – Mid-Power LED
Forward Current Characteristics
Fig 5. Forward Current vs. CIE X, Y Shift , Ta=25℃
(2600K~4200K)
0.410
0.408
20mA
CIE Y
0.406
60mA
100mA
0.404
150mA
180mA
0.402
0.400
0.439
0.440
0.441
0.442
0.443
CIE X
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Product Data Sheet
STW9B12C – Mid-Power LED
Junction Temperature Characteristics
Fig 6. Relative Light Output vs. Junction Temperature
IF=100mA
Relative Luminous Intensity
1.0
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Junction temperature Tj( C)
Fig 7. Junction Temperature vs. Relative Forward Voltage
IF=100mA
Relative Forward Voltage
1.0
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Junction temperature Tj( C)
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Product Data Sheet
STW9B12C – Mid-Power LED
Junction Temperature Characteristics
Fig 8. Chromaticity Coordinate vs. Junction Temperature
IF=100mA
(2600K~4200K)
0.405
0.400
25
y
40
60
0.395
80
100
120
0.390
0.385
0.437
0.438
0.439
0.440
0.441
0.442
x
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Product Data Sheet
STW9B12C – Mid-Power LED
Ambient Temperature Characteristics
Fig 9. Maximum Forward Current vs. Ambient Temperature
120
Forward Current IF [mA]
o
RthJ-A = 100 C/W
90
60
30
0
-40
-20
0
20
40
60
80
100
o
Ambient Temperature Ta [ C]
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Product Data Sheet
STW9B12C – Mid-Power LED
Color Bin Structure
Table 4. Bin Code description
Part Number
STW9B12C
Luminous Intensity (cd)
@ IF = 100mA
Bin Code
Min.
Max.
R0
8.0
R5
Color
Chromaticity
Coordinate
@ IF = 100mA
Typical Forward
Voltage (VF) @ IF = 100mA
Bin Code
Min.
Max.
8.5
Y3
2.9
3.0
8.5
9.0
Z1
3.0
3.1
S0
9.0
9.5
Z2
3.1
3.2
S5
9.5
10.0
Z3
3.2
3.3
T0
10.0
10.5
A1
3.3
3.4
Refer to page.14
Available Ranks
Table 5. Intensity rank distribution
CCT
CIE
IV Rank
3700~4200 K
E
R0
R5
S0
S5
T0
3200~3700 K
F
R0
R5
S0
S5
T0
2900~3200 K
G
R0
R5
S0
S5
T0
2600~2900 K
H
R0
R5
S0
S5
T0
Notes :
(1) All measurements were made under the standardized environment of Seoul Semiconductor.
(2) Seoul Semiconductor sorts the LED package according to the luminous intensity IV.
(3) The lumen table is only for reference.
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Product Data Sheet
STW9B12C – Mid-Power LED
Color Bin Structure
Fig 10. CIE Chromaticity Diagram Ta=25℃, IF=100mA
0.46
0.44
2700K
2600K
2900K
3000K
0.42
3500K
CIE Y
0.40
0.38
F0
E1
G3
H4
F3
H5
G5
G4
F2
E0
H3
H2
F1
G2
4000K
4200K
G1
G0
3700K
H1
H0
3200K
F5
E3
F4
E2
E5
E4
0.36
0.34
0.32
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
CIE X
(1) Energy Star binning applied to all 2600~4200K.
(2) Measurement Uncertainty of the Color Coordinates : ± 0.007
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Product Data Sheet
STW9B12C – Mid-Power LED
Color Bin Structure
<IF=100mA, Ta=25℃>
3200K
0.42
3500K
3700K
F1
CIE Y
4000K
4200K
0.39
E0
E2
F0
E1
F3
F2
F5
E3
F4
E5
E4
0.36
0.36
0.39
0.42
CIE X
E0
E1
E2
E3
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3736
0.3874
0.3869
0.3958
0.3714
0.3775
0.3842
0.3855
0.3714
0.3775
0.3842
0.3855
0.3692
0.3677
0.3813
0.3751
0.3842
0.3855
0.397
0.3935
0.3813
0.3751
0.3934
0.3825
0.3869
0.3958
0.4006
0.4044
0.3842
0.3855
0.397
0.3935
E4
E5
F0
F1
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3692
0.3677
0.3813
0.3751
0.3996
0.4015
0.4146
0.4089
0.367
0.3578
0.3783
0.3646
0.396
0.3907
0.4104
0.3978
0.3783
0.3646
0.3898
0.3716
0.4104
0.3978
0.4248
0.4048
0.3813
0.3751
0.3934
0.3825
0.4146
0.4089
0.4299
0.4165
F2
F3
F4
F5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.396
0.3907
0.4104
0.3978
0.3925
0.3798
0.4062
0.3865
0.3925
0.3798
0.4062
0.3865
0.3889
0.369
0.4017
0.3751
0.4062
0.3865
0.4198
0.3931
0.4017
0.3751
0.4147
0.3814
0.4104
0.3978
0.4248
0.4048
0.4062
0.3865
0.4198
0.3931
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Product Data Sheet
STW9B12C – Mid-Power LED
Color Bin Structure
<IF=100mA, Ta=25℃>
2700K
2600K
2900K
3000K
H1
3200K
0.42
H0
G1
G0
H3
H2
CIE Y
G3
G2
H4
H5
G5
0.39
G4
0.42
0.45
0.48
CIE X
G0
G1
G2
G3
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4299
0.4165
0.443
0.4212
0.4248
0.4048
0.4374
0.4093
0.4248
0.4048
0.4374
0.4093
0.4198
0.3931
0.4317
0.3973
0.4374
0.4093
0.4499
0.4138
0.4317
0.3973
0.4436
0.4015
0.443
0.4212
0.4562
0.426
0.4374
0.4093
0.4499
0.4138
G4
G5
H0
H1
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4198
0.3931
0.4317
0.3973
0.4562
0.426
0.4687
0.4289
0.4147
0.3814
0.4259
0.3853
0.4499
0.4138
0.462
0.4166
0.4259
0.3853
0.4373
0.3893
0.462
0.4166
0.474
0.4194
0.4317
0.3973
0.4436
0.4015
0.4687
0.4289
0.481
0.4319
H2
H3
H4
H5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4499
0.4138
0.462
0.4166
0.4436
0.4015
0.4551
0.4042
0.4436
0.4015
0.4551
0.4042
0.4373
0.3893
0.4483
0.3919
0.4551
0.4042
0.4666
0.4069
0.4483
0.3919
0.4593
0.3944
0.462
0.4166
0.474
0.4194
0.4551
0.4042
0.4666
0.4069
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Product Data Sheet
STW9B12C – Mid-Power LED
Mechanical Dimensions
Package
Marking
Side View
Top View
Bottom View
Circuit
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
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Product Data Sheet
STW9B12C – Mid-Power LED
Reel Packaging
( Tolerance: ±0.2, Unit: mm )
(1) Quantity : Max 4,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape
Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of
10˚ to the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package.
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Product Data Sheet
STW9B12C – Mid-Power LED
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
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Product Data Sheet
STW9B12C – Mid-Power LED
Emitter Tape & Reel Packaging
Table 6. Part Numbering System : X1X2X3X4X5X6X7
Part Number Code
Description
Part Number
Value
X1
Company
S
X2
Top View LED series
T
X3
Color Specification
W9
CRI 90
X4
Package series
B
B series
X5X6
Characteristic code
12
X7
Revision
C
Table 7. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17
Lot Number Code
Description
Lot Number
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
18
Value
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Product Data Sheet
STW9B12C – Mid-Power LED
Recommended Solder Pad
[Recommended Solder Pattern]
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only
(4) Undefined tolerance is ±0.1mm
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Product Data Sheet
STW9B12C – Mid-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 8.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
STW9B12C – Mid-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
STW9B12C – Mid-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant .
The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant
changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or shredded in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products when
chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for
storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy.
The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of fixtures
can help prevent these issues.
(14) Attaching LEDs, do not use adhesives that outgas organic vapor.
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
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Product Data Sheet
STW9B12C – Mid-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
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