Product Data Sheet SDW91F1C – Chip on Board Enable High Flux and Cost Efficient System Z Power Chip on board – ZC series SDW91F1C (CRI90) LM-80 MacAdam 3-Step RoHS Product Brief Description Features and Benefits • The ZC series are LED arrays which provide High Flux and High Efficacy. • It is especially designed for easy assembly of lighting fixtures by eliminating reflow soldering process. • It‘s thermal management is better than other power LED solutions with wide Metal area. • • • • • • • • ZC series are ideal light sources for General Lighting applications including Replacement Lamps, Industrial & Commercial Lightings and other high Lumen required applications. High Efficacy typ. 95 ~ 108lm/W Flux range from 600 ~ 1470lm Power dissipation 5.8 ~ 18.4W Wide CCT range with CRI90 MacAdam 3-step binning Uniformed Shadow Excellent Thermal management Key Applications • • • • • Bulb - Replacement Lamps Down Lighting – Commercial Lighting High Bay - Industrial Lighting Architectural Lighting Decorative / Pathway Lighting Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. Neutral White 3,700K - 4,200K Warm White 2,600K - 3,700K SDW91F1C 1 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Table of Contents Index • Product Brief • Table of Contents • Performance Characteristics • Product Nomenclature (Labeling Information) • Color Bin Structure • Mechanical Dimensions • Packaging Specification • Handling of Silicone Resin for LEDs • Precaution For Use • Company Information 2 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Performance Characteristics Table 2. Electro Optical Characteristics, TS=25ºC CCT (K) [1] Part Number Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (Vf) [4] CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 180mA 460mA* 180mA 460mA* Min. Typ. 4,000 680 1470 35 37.8 90 120 3,500 645 1393 35 37.8 90 120 3,000 635 1371 35 37.8 90 120 2,700 600 1294 35 37.8 90 120 SDW91F1C Table 3. Electro Optical Characteristics, Tj=85ºC CCT (K) [1] Part Number Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (Vf) [4] Typ. 180mA 460mA* 180mA 460mA* 4,000 592 1279 33.25 35.9 3,500 561 1212 33.25 35.9 3,000 552 1193 33.25 35.9 2,700 522 1126 33.25 35.9 SDW91F1C Notes : (1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.01, CCT 5% tolerance. (2) Seoul Semiconductor maintains a tolerance of ±7% on flux and power measurements. (3) ФV is the total luminous flux output as measured with an integrating sphere. (4) Tolerance is ±2.5V on forward voltage measurements. (5) Tolerance is ±2 on CRI measurements. * No values are provided by real measurement. Only for reference purpose. 3 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Performance Characteristics Table 4. Absolute Maximum Characteristics, T S = 25ºC Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.18 0.46 A Power Dissipation Pd - 6.3 18.4 W Junction Temperature Tj - - 125 ºC Operating Temperature Topr -40 - 85 ºC Surface Temperature TS - - 100 ºC Storage Temperature Tstg -40 - 100 ºC Thermal resistance (J to S) [1] RθJ-S - 1.4 - K/W ESD Sensitivity(HBM) [2] - - - ±8 kV Notes : (1) Thermal Resistance : RthJ-S (Junction to COB’s metal PCB) 4 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Relative Spectral Distribution Fig 1. Color Spectrum, TS=25℃, IF=180mA (4000K) Relative Intensity[a.u.] 1.0 CRI90 4000K 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 700 800 Wavelength (nm) Fig 2. Color Spectrum, TS=25℃, IF=180mA (2700K) Relative Intensity[a.u.] 1.0 CRI90 2700K 0.8 0.6 0.4 0.2 0.0 300 400 500 600 Wavelength (nm) 5 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Relative Spectral Distribution Fig 3. Radiant pattern, IF=180mA Relative Intensity [a.u.] 1.00 0.75 0.50 0.25 0.00 -90 -60 -30 0 30 60 90 o Angle [ ] 6 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Forward Current Characteristics Fig 4. Forward Voltage vs. Forward Current, T S=25℃ Current (A) 0.4 0.2 0.0 10 20 30 40 Voltage (V) Fig 5. Forward Current vs. Relative Luminous Flux, TS=25℃ Relative Luminous Flux[a.u.] 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.1 0.2 0.3 0.4 0.5 Foward Current [A] 7 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Forward Current Characteristics Fig 6. Forward Current vs. CIE X, Y Shift, T S=25℃ (4000K) 0.02 CIE X CIE Y Relative Variation 0.01 0.00 -0.01 -0.02 0.0 0.1 0.2 0.3 0.4 0.5 Foward Current[A] Fig 7. Forward Current vs. CIE X, Y Shift, T S=25℃ (2700K) 0.02 CIE X CIE Y Relative Variation 0.01 0.00 -0.01 -0.02 0.0 0.1 0.2 0.3 0.4 0.5 Foward Current[A] 8 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Junction Temperature Characteristics Fig 8. Junction Temperature vs. Relative Light Output, IF=180mA 120 Relative luminous flux [%] 100 80 60 40 20 025 40 60 80 100 120 o Junction Temperature [ C] Fig 9. Junction Temperature vs. Forward Voltage, IF=180mA 0.0 Foward Voltage (V) -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 40 60 80 100 120 o Junction Temperature( C) 9 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Junction Temperature Characteristics Fig 10. Junction Temperature vs. CIE X, Y Shift, IF=180mA (4000K) 0.03 CIE X CIE Y Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 40 60 80 100 120 o Junction Temperature[ C] Fig 11. Junction Temperature vs. CIE X, Y Shift, IF=180mA (3000K) 0.03 CIE X CIE Y Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 40 60 80 100 120 o Junction Temperature[ C] 10 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Ambient Temperature Characteristics Fig 12. Surface Temperature vs. Maximum Forward Current, T j(max)=125℃ 0.5 Maximum Current[A] 0.4 0.3 Rth(j-s)=2.6℃/W 0.2 Rth(j-s)=4.0℃/W 0.1 0.0 20 30 40 50 60 70 80 90 100 110 o Ts[ C] 11 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Product Nomenclature Table 5. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Part Number Code Description Part Number Value X1 Company S X2 Package series D X3X4 Color Specification W0 White W8 CRI 80 W9 CRI 90 X5 Series number 1 X6 Lens type F Flat X7 PCB type 1 PCB X8 Revision number C COB type Table 6. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13 Lot Number Code Description Y1Y2 Year Y3Y4 Month Y5Y6 Day Y7Y8Y9Y10 Mass order Y11Y12Y13 Tray No. Lot Number 12 Value www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram 0.45 Y 0.42 0.39 0.36 0.36 0.39 0.42 0.45 0.48 X 13 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, TS=25℃, IF=180mA 3200K 0.42 3500K 3700K 4000K 0.40 F21 E22 Y 4200K F22 F11 F10 E21 E11 F24 0.38 E10 F23 E24 E23 ANSI MacAdam 4-STEP MacAdam 3-STEP 0.36 0.36 0.38 0.40 0.42 0.44 X 3-STEP 4-STEP E10 F10 E11 F11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3764 0.3713 0.4006 0.3829 0.3746 0.3689 0.3981 0.3800 0.3793 0.3828 0.4051 0.3954 0.3784 0.3841 0.4040 0.3966 0.3890 0.3887 0.4159 0.4007 0.3914 0.3922 0.4186 0.4037 0.3854 0.3768 0.4108 0.3878 0.3865 0.3762 0.4116 0.3865 ANSI E21 E22 E23 E24 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3703 0.3726 0.3890 0.3842 0.3670 0.3578 0.3784 0.3647 0.3736 0.3874 0.3914 0.3922 0.3703 0.3726 0.3806 0.3725 0.3871 0.3959 0.3849 0.3881 0.3765 0.3765 0.3865 0.3762 0.3849 0.3881 0.3871 0.3959 0.3746 0.3689 0.3890 0.3842 0.3784 0.3841 0.4006 0.4044 0.3806 0.3725 0.3952 0.3880 0.3765 0.3765 0.3952 0.3880 0.3784 0.3647 0.3898 0.3716 F21 F22 F23 F24 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4148 0.4090 0.4013 0.3887 0.4223 0.3990 0.4299 0.4165 0.3996 0.4015 0.3943 0.3853 0.4153 0.3955 0.4148 0.4090 0.3943 0.3853 0.3889 0.3690 0.4116 0.3865 0.4113 0.4002 0.4013 0.3887 0.4018 0.3752 0.4049 0.3833 0.4186 0.4037 0.4040 0.3966 0.4049 0.3833 0.4018 0.3752 0.4153 0.3955 0.4113 0.4002 0.3981 0.3800 0.4147 0.3814 0.4223 0.3990 14 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, TS=25℃, IF=180mA 0.44 2600K 2700K 2900K 3000K 0.42 3200K H22 H21 G22 G21 G11 H11 H10 Y G10 0.40 H24 H23 G23 G24 ANSI MacAdam 4-STEP MacAdam 3-STEP 0.38 0.42 0.44 0.46 0.48 X 3-STEP 4-STEP G10 H10 G11 H11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4267 0.3946 0.4502 0.4020 0.4243 0.3922 0.4477 0.3998 0.4328 0.4079 0.4576 0.4158 0.4324 0.4100 0.4575 0.4182 0.4422 0.4113 0.4667 0.4180 0.4451 0.4145 0.4697 0.4211 0.4355 0.3977 0.4588 0.4041 0.4361 0.3964 0.4591 0.4025 ANSI G21 G22 G23 G24 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4223 0.3990 0.4406 0.4055 0.4147 0.3814 0.4259 0.3853 0.4299 0.4165 0.4451 0.4145 0.4223 0.3990 0.4302 0.3943 0.4430 0.4212 0.4387 0.4122 0.4284 0.4011 0.4361 0.3964 0.4387 0.4122 0.4430 0.4212 0.4243 0.3922 0.4406 0.4055 0.4324 0.4100 0.4562 0.4260 0.4302 0.3943 0.4468 0.4077 0.4284 0.4011 0.4468 0.4077 0.4259 0.3853 0.4373 0.3893 H21 H22 H23 H24 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4468 0.4077 0.4644 0.4118 0.4373 0.3893 0.4483 0.3919 0.4562 0.4260 0.4697 0.4211 0.4468 0.4077 0.4534 0.4012 0.4687 0.4289 0.4636 0.4197 0.4526 0.4090 0.4591 0.4025 0.4636 0.4197 0.4687 0.4289 0.4477 0.3998 0.4644 0.4118 0.4575 0.4182 0.4810 0.4319 0.4534 0.4012 0.4703 0.4132 0.4526 0.4090 0.4703 0.4132 0.4483 0.3919 0.4593 0.3944 15 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Color Bin Structure Table 7. Bin Code description Luminous Flux (lm) @ IF = 180mA Part Number SDW91F1C Bin Code Min. Max. B1 570 635 B2 635 700 C 700 800 Color Chromaticity Coordinate @ IF = 180mA Typical Forward Voltage (Vf) Bin Code Min. Max. D 32 34 E 34 38 F 38 40 Refer to page. 13 -15 Available ranks Table 8. Ordering Information(Bin Code) Part Number CCT CIE LF rank VF rank 3700~4200K E B1 B2 C D E F 3200~3700K F B1 B2 C D E F 2900~3700K G B1 B2 C D E F 2600~2900K H B1 B2 C D E F SDW91F1C 16 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Mechanical Dimensions Circuit Cathode X 12 S1 Ts X 12 Anode Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm 17 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Packaging Specification Notes : (1) Quantity : 30pcs/Tray (2) All dimensions are in millimeters (tolerance : ±0.3) (3) Scale none 18 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Packaging Specification Notes : (1) Heat Sealed after packing (Use Zipper Bag) (2) Quantity : 3Tray(90pcs) /Bag 19 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) Avoid leaving fingerprints on silicone resin parts. 20 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week or the color of the desiccant changes. (3) For manual soldering Seoul Semiconductor recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C. c. Before proceeding the next step, product temperature must be stabilized at room temperature. (4) Components should not be mounted on warped (non coplanar) portion of PCB. (5) Radioactive exposure is not considered for the products listed here in. (6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (8) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from Seoul Semiconductor, a sealed container with vacuum atmosphere should be used for storage. (10) The appearance and specifications of the product may be modified for improvement without notice. 21 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Precaution for Use (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (14) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) 22 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device 23 www.seoulsemicon.com Product Data Sheet SDW91F1C – Chip on Board Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. 24 www.seoulsemicon.com