Product Data Sheet ZC6 – Chip on Board Enable High Flux and Cost Efficient System Z Power Chip on board – ZC series, ZC6 SDW01F1C, SDW81F1C, SDW91F1C LM-80 MacAdam 3-Step RoH S Product Brief Description Features and Benefits • The ZC series are LED arrays which provide High Flux and High Efficacy. • It is especially designed for easy assembly of Lighting fixtures by eliminating reflow soldering process. • It‘s thermal management is excellent than other power LED solutions with wider Metal area. • • • • • • • • ZC series are ideal light sources for General Lighting applications including Replacement Lamps, Industrial & Commercial Lightings and other high Lumen required applications. High Efficacy typ. 135lm/W Flux range from 600 ~ 1395lm Power dissipation 6.5 ~ 12.0W Wide CCT range with CRI 70~90 MacAdam 3-step binning Uniformed Shadow Excellent Thermal management Key Applications • • • • • Bulb - Replacement Lamps Down Lighting – Commercial Lighting High Bay - Industrial Lighting Architectural Lighting Decorative / Pathway Lighting Table 1. Product Selection Table CCT Part Number SDW01F1C Color Min. Typ. Max. Cool White 4700K - 6000K Neutral White 3700K - 4200K Warm White 2600K - 3200K Neutral White 3700K - 4200K Warm White 2600K - 3700K SDW81F1C SDW91F1C Rev3.0, March 28, 2014 1 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Table of Contents Index • Product Brief • Table of Contents • Performance Characteristics • Color Bin Structure • Mechanical Dimensions • Packaging Specification • Product Nomenclature (Labeling Information) • Handling of Silicone Resin for LEDs • Precaution For Use • Company Information Rev3.0, March 28, 2014 2 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Performance Characteristics Table 2. Product Selection Guide, Tc = 25ºC, RH30% CCT (K) [1] Part Number SDW01F1C SDW81F1C Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (Vf) [4] CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 180mA 320mA* 180mA 320mA* Min. Typ. 5000 875 1395 36 37.5 70 120 4000 775 1235 36 37.5 80 120 3000 745 1190 36 37.5 80 120 2700 710 1130 36 37.5 80 120 4000 680 1085 36 37.5 90 120 3500 645 1025 36 37.5 90 120 3000 635 1015 36 37.5 90 120 2700 600 955 36 37.5 90 120 SDW91F1C Notes : 1. Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : ±0.01, CCT ±5% tolerance. 2. Seoul Semiconductor maintains a tolerance of ±7% on flux and power measurements. 3. ФV is the total luminous flux output as measured with an integrating sphere. 4. Tolerance is ±2.5V on forward voltage measurements. 5. Tolerance is ±2 on CRI measurements. Rev3.0, March 28, 2014 3 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Performance Characteristics Table 3. Characteristics, Tc = 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.18 0.32 A Power Dissipation Pd - 6.5 12.0 W Junction Temperature Tj - - 125 ºC Operating Temperature Topr -40 - 85 ºC Storage Temperature Tstg -40 - 100 ºC Thermal resistance (J to S) [1] RθJ-S - 1.4 - K/W ESD Sensitivity(HBM) [2] - - - ±8 kV Notes : 1. Thermal Resistance : RθJ-S (Junction to COB’s metal PCB) 2. A zener diode is included to protect the product from ESD. Rev3.0, March 28, 2014 4 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Relative Spectral Distribution Fig 1. Color Spectrum, Tc = 25℃, IF = 180mA, RH30% Cool white Neutral white Warm white CRI80 Warm white CRI90 Relative Radiant Power [%] 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] Rev3.0, March 28, 2014 5 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Luminous Flux Characteristics Fig 2. Radiant pattern, IF = 180mA 1.1 1.0 Relative Intensity [%] 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement [degrees] Rev3.0, March 28, 2014 6 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Forward Current Characteristics Fig 3. Forward Voltage vs. Forward Current , Tc=25℃ 0.4 Forward Current [A] 0.3 0.2 0.1 0.0 10 15 20 25 30 35 40 Forward Volatage [V] Fig 4. Forward Current vs. Relative Luminous Flux, Tc=25℃ 200 Relative luminous flux [%] 180 160 140 120 100 80 60 40 20 00 50 100 150 200 250 300 350 400 Forward Current [mA] Rev3.0, March 28, 2014 7 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Forward Current Characteristics Fig 5. Forward Current vs. CIE X, Y Shift , Tc=25℃ (Warm white) 0.02 CIE(X) CIE(Y) Relative variation 0.01 0.00 -0.01 -0.02 0 50 100 150 200 250 300 350 Forward Current [mA] Rev3.0, March 28, 2014 8 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Junction Temperature Characteristics Fig 6. Relative Light Output vs. Junction Temperature, IF=180mA Relative luminous flux [%] 120 100 80 60 40 20 025 40 60 80 100 120 o Junction Temperature [ C] Fig 7. Junction Temp. vs. CIE X, Y Shift, IF=180mA (Warm white) 0.02 CIE(X) CIE(Y) Relative variation 0.01 0.00 -0.01 -0.02 25 50 75 100 125 150 Junction Temperature [oC] Rev3.0, March 28, 2014 9 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Junction Temperature Characteristics Fig 8. Forward Voltage vs. Junction Temperature, IF=180mA 39 Foward voltage [V] 38 37 36 35 34 33 3225 40 60 80 100 120 o Junction Temperature [ C] Rev3.0, March 28, 2014 10 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Ambient Temperature Characteristics Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.) = 125℃, IF=0.32A 400 Maximum Current [mA] 350 300 250 Rth(j-a)=2.6K/W 200 Rth(j-a)=4.0K/W 150 Rth(j-a)=5.4K/W 100 50 00 20 40 60 80 100 120 Ambient Temperature [oC] Rev3.0, March 28, 2014 11 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Color Bin Structure Table 4. Bin Code description Luminous Flux (lm) @ IF = 180mA Part Number Bin Code Min. Max. C 700 800 D 800 900 E 900 B2 SDW01F1C SDW81F1C SDW91F1C Rev3.0, March 28, 2014 Color Chromaticity Coordinate @ IF = 180mA Typical Forward Voltage (Vf) Bin Code Min. Max. D 32.0 36.0 1100 E 36.0 40.0 635 700 D 32.0 36.0 C 700 800 D 800 900 E 36.0 40.0 B1 570 635 D 32.0 36.0 B2 635 700 C 700 800 E 36.0 40.0 Refer to page.13 Refer to page.14 Refer to page.14 12 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Color Bin Structure CIE Chromaticity Diagram (Cool white), Tc=25℃, IF=180mA ANSI 0.38 4700K 5000K 0.37 C1 5300K CIE Y 0.36 0.35 5600K C0 B1 C2 6000K 0.34 B0 B3 B2 B5 C3 C5 C4 B4 0.33 0.32 0.31 0.32 0.33 0.34 0.35 0.36 CIE X B0 B1 B2 B3 B4 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3222 0.3243 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 0.3294 0.3306 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 B5 B6 B7 B8 B9 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3200 0.3572 0.3290 0.3656 0.3294 0.3306 0.3226 0.3178 0.3295 0.3234 0.3207 0.3462 0.3292 0.3539 0.3366 0.3369 0.3295 0.3234 0.3364 0.3288 0.3292 0.3539 0.3376 0.3616 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3290 0.3656 0.3381 0.3740 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3366 0.3369 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 0.3440 0.3428 0.3687 0.3552 0.3760 0.3456 0.3601 0.3539 0.3669 0.3448 C0 0.3463 C1 C5 C2 C6 C3 C7 C4 C8 0.3514 C9 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3448 0.3514 0.3366 0.3369 0.3440 0.3428 0.3381 0.3740 0.3470 0.3810 0.3440 0.3428 0.3364 0.3288 0.3433 0.3345 0.3376 0.3616 0.3463 0.3687 0.3514 0.3487 0.3433 0.3345 0.3500 0.3400 0.3463 0.3687 0.3552 0.3760 0.3526 0.3578 0.3440 0.3428 0.3514 0.3487 0.3470 0.3810 0.3572 0.3891 Rev3.0, March 28, 2014 13 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Color Bin Structure CIE Chromaticity Diagram (Warm white), Tc=25℃, IF=180mA ANSI MacAdam 4-step MacAdam 3-step 0.44 3000K 0.42 F22 CIE Y F11 0.38 H24 G23 E11 E10 E24 H23 G24 F10 E21 H11 H10 G11 G10 4000K E22 F21 4200K G22 G21 3500K 3700K H22 H21 3200K 0.40 2600K 2700K 2900K F24 F23 E23 0.36 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 CIE X 3-STEP E10 CIE x F10 CIE y CIE x CIE y 4-STEP G10 CIE x H10 CIE y CIE x E11 CIE y CIE x F11 CIE y CIE x CIE y G11 CIE x H11 CIE y CIE x CIE y 0.3764 0.3713 0.4006 0.3829 0.4267 0.3946 0.4502 0.4020 0.3744 0.3685 0.3981 0.3800 0.4242 0.3919 0.4475 0.3994 0.3793 0.3828 0.4051 0.3954 0.4328 0.4079 0.4576 0.4158 0.3782 0.3837 0.4040 0.3966 0.4322 0.4096 0.4573 0.4178 0.3890 0.3887 0.4159 0.4007 0.4422 0.4113 0.4667 0.4180 0.3912 0.3917 0.4186 0.4037 0.4449 0.4141 0.4695 0.4207 0.3854 0.3768 0.4108 0.3878 0.4355 0.3977 0.4588 0.4041 0.3863 0.3758 0.4116 0.3865 0.4359 0.396 0.4589 0.4021 ANSI E21 CIE x 0.3703 0.3736 0.3871 0.3849 0.3784 0.3765 E22 CIE y 0.3726 0.3874 0.3959 0.3881 0.3841 0.3765 CIE x 0.3890 0.3914 0.3849 0.3871 0.4006 0.3952 CIE y 0.4090 0.4015 0.3853 0.3887 0.3966 0.4002 CIE x 0.4013 0.3943 0.3889 0.4018 0.4049 0.3981 CIE y 0.3990 0.4165 0.4212 0.4122 0.4100 0.4011 CIE x 0.4406 0.4451 0.4387 0.4430 0.4562 0.4468 CIE y 0.4077 0.4260 0.4289 0.4197 0.4182 2014 0.4090 CIE x 0.4644 0.4697 0.4636 0.4687 0.4810 0.4703 F21 CIE x 0.4148 0.3996 0.3943 0.4013 0.4040 0.4113 28, CIE y 0.3887 0.3853 0.3690 0.3752 0.3833 0.3800 CIE x 0.4223 0.4153 0.4116 0.4049 0.4018 0.4147 CIE y 0.4055 0.4145 0.4122 0.4212 0.4260 0.4077 CIE x 0.4147 0.4223 0.4284 0.4243 0.4302 0.4259 CIE y 0.4118 0.4211 0.4197 0.4289 0.4319 0.4132 CIE x 0.4373 0.4468 0.4526 0.4477 0.4534 0.4483 E24 CIE y 0.3578 0.3726 0.3765 0.3689 0.3725 0.3647 CIE x 0.3784 0.3806 0.3865 0.3890 0.3952 0.3898 CIE y 0.3990 0.3955 0.3865 0.3833 0.3752 0.3814 CIE x 0.4299 0.4148 0.4113 0.4186 0.4153 0.4223 CIE y 0.3814 0.3990 0.4011 0.3922 0.3943 0.3853 CIE x 0.4259 0.4302 0.4361 0.4406 0.4468 0.4373 CIE y 0.3893 0.4077 0.4090 0.3998 0.4012 0.3919 CIE x CIE y 0.4483 0.3919 0.4534 0.4012 0.4591 0.4025 0.4644 0.4118 0.4703 0.4132 www.seoulsemicon.com 0.4593 0.3944 F23 G22 H21 CIE x 0.4468 0.4562 0.4687 0.4636 0.4575 Rev3.0, March 0.4526 CIE x 0.3670 0.3703 0.3765 0.3746 0.3806 0.3784 F22 G21 CIE x 0.4223 0.4299 0.4430 0.4387 0.4324 0.4284 E23 CIE y 0.3842 0.3922 0.3881 0.3959 0.4044 0.3880 F24 G23 H22 CIE y 0.4165 0.4090 0.4002 0.4037 0.3955 0.3990 G24 H23 14 CIE y 0.3647 0.3725 0.3762 0.3842 0.3880 0.3716 CIE y 0.3853 0.3943 0.3964 0.4055 0.4077 0.3893 H24 Product Data Sheet ZC6 – Chip on Board Mechanical Dimensions Circuit Cathode X 12 X 12 Anode Notes : 1. 2. 3. All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.2mm Rev3.0, March 28, 2014 15 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Packaging Specification Notes : 1. 2. 3. Quantity : 30pcs/Tray All dimensions are in millimeters (tolerance : ±0.3) Scale none Rev3.0, March 28, 2014 16 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Packaging Specification Notes : (1) Heat Sealed after packing (Use Zipper Bag) (2) Quantity : 3Tray(90pcs) /Bag Rev3.0, March 28, 2014 17 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Product Nomenclature Table 5. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Part Number Code Description Part Number Value X1 Company S X2 Package series D X3X4 Color Specification W0 White W8 CRI 80 W9 CRI 90 X5 Series number 1 X6 Lens type F Flat X7 PCB type 1 PCB X8 Revision number C New COB type Table 6. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13 Lot Number Code Description Y1Y2 Year Y3Y4 Month Y5Y6 Day Y7Y8Y9Y10 Mass order Y11Y12Y13 Tray No. Rev3.0, March 28, 2014 Lot Number 18 Value www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) Avoid leaving fingerprints on silicone resin parts. Rev3.0, March 28, 2014 19 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week or the color of the desiccant changes. (3) For manual soldering Seoul Semiconductor recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C. c. Before proceeding the next step, product temperature must be stabilized at room temperature. (4) Components should not be mounted on warped (non coplanar) portion of PCB. (5) Radioactive exposure is not considered for the products listed here in. (6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (8) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from Seoul Semiconductor, a sealed container with vacuum atmosphere should be used for storage. (10) The appearance and specifications of the product may be modified for improvement without notice. Rev3.0, March 28, 2014 20 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Precaution for Use (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (14) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev3.0, March 28, 2014 21 www.seoulsemicon.com Product Data Sheet ZC6 – Chip on Board Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev3.0, March 28, 2014 22 www.seoulsemicon.com 또는 제출 한번 Product Data Sheet ZC6 – Chip on Board Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich, high-brightness LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors. The company is vertically integrated from epitaxial growth and chip manufacture in it’s fully owned subsidiary, Seoul Viosys, through packaged LEDs and LED modules in three Seoul Semiconductor manufacturing facilities. Seoul Viosys also manufactures a wide range of unique deep-UV wavelength devices. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev3.0, March 28, 2014 23 www.seoulsemicon.com