Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C HMC258LC3B HMC260LC3B HMC264LC3B HMC292LC3B HMC329LC3B HMC338LC3B HMC341LC3B HMC344LC3 HMC346LC3B HMC347LC3B HMC441LC3B HMC442LC3B HMC447LC3 HMC448LC3B HMC449LC3B HMC451LC3 HMC524LC3B HMC547LC3 HMC553LC3B HMC554LC3B HMC558LC3B HMC573LC3B HMC576LC3B HMC578LC3B HMC594LC3B HMC663LC3 HMC670LC3C HMC671LC3C HMC672LC3C HMC673LC3C HMC674LC3C HMC675LC3C HMC676LC3C HMC678LC3C HMC679LC3C HMC706LC3C HMC720LC3C HMC721LC3C HMC722LC3C HMC723LC3C HMC724LC3C HMC725LC3C HMC726LC3C HMC727LC3C HMC728LC3C HMC729LC3C HMC744LC3C HMC745LC3C HMC746LC3C HMC747LC3C HMC748LC3C HMC749LC3C HMC773LC3B HMC774LC3B HMC787LC3B HMC814LC3B HMC850LC3C HMC851LC3C HMC853LC3C HMC865LC3C HMC866LC3C HMC874LC3C HMC875LC3C HMC876LC3C HMC974LC3C HMC1084LC4 Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C Introduction The Reliability tests summarized in this report are designed to satisfy the reliability requirements designated by Hittite Microwave Corporation. The testing was devised to simulate exposure to environments the product may experience during assembly, test, and life in the end user application. The pass/fail criteria are dependent upon DC and critical RF parameters determined by the appropriate catalog specifications. A complete data sheet for the devices tested can be found at www.hittite.com. The Package Reliability Plan is as follows: Package Reliability QTR: 2014-00376 Package: LC3, LC3B, LC3C Rev: 01 Glossary of Terms & Definitions: 1. Autoclave: A highly accelerated moisture stress test (unbiased). Devices are subjected to 96 hours of 100% relative humidity at a temperature of 121°C and pressure (14.7 PSIG). This test is performed in accordance with JEDEC JESD22-A102. 2. HTSL: High Temperature Storage Life. Devices are subjected to 1000 hours at 150oC. This test is performed in accordance with JEDEC JESD22-A103. 3. MSL Preconditioning: Moisture sensitivity level pre-conditioning is performed in accordance with JEDEC JESD22-A113, lead free, 260°C peak temperature (see Appendix 1 for reflow profile). 4. Physical Dimensions: Devices are inspected to the current package outline drawing to ensure all package dimensions are within specification (see Appendix 2 for applicable outline drawings). 5. Solderability: Devices are subjected to 8 hours of steam age and Method 1 Dip and Look testing in accordance with JEDEC JESD22-B102. 6. Temperature Cycle: Devices are subjected to 500 non-operating temperature cycling from -65°C to 150°C in accordance with JEDEC JESD22-A104. 7. UHAST: Unbiased Highly Accelerated Stress Test. Devices are subjected to 96 hours of 85% relative humidity at a temperature of 130°C and pressure (18.6 PSIG). This test was performed in accordance with JEDEC JESD22A118. 8. X-Ray Analysis: Devices are inspected to the current assembly drawing to ensure devices are assembled correctly and are free of any assembly anomalies. Qualification Sample Selection: All qualification devices used were manufactured and tested on standard production processes and met pre-stress acceptance test requirements. Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C Summary of Qualification Tests: HMC258LC3B (QTR2008-00001) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 174 174 Complete MSL Preconditioning 144 144 Complete MSL Preconditioning Final Test 144 144 Pass Autoclave (Preconditioned) 77 77 Complete Autoclave Final Test 77 77 Pass Temperature Cycle (Preconditioned) 67 67 Complete Temperature Cycle Final Test 67 67 Pass Solderability 15 15 Pass Physical Dimensions 15 15 Pass NOTES Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C HMC814LC3B (QTR2012-00321) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 340 340 Complete HTOL, 1000 hours 77 77 Complete Post HTOL Electrical Test 77 77 Pass HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass MSL Preconditioning 156 156 Complete MSL Preconditioning Final Test 156 156 Pass UHAST (Preconditioned) 78 78 Complete UHAST Final Test 78 78 Pass Temperature Cycle (Preconditioned) 78 78 Complete Temperature Cycle Final Test 78 78 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray 6 6 Pass NOTES Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C Cumulative Summary of All LC3 Package Tests TEST Total Units Total Units Tested Passed Total Units Failed HTSL, 1000 hours 80 80 0 Temperature Cycle (Preconditioned) 145 145 0 Autoclave (Preconditioned) 77 77 0 UHAST (Preconditioned) 78 78 0 Solderability 21 21 0 Physical Dimensions 30 30 0 X-Ray 6 6 0 Comments Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C Appendix 1 Reflow Profile for MSL Preconditioning Temperature (°C) Time (seconds) Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C Appendix 2 LC3 Outline Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C LC3B Outline Rev: 01 QTR: 2014-00376 Package: LC3, LC3B, LC3C LC3C Outline