CONTENTS
1
INTRODUCTION....................................................................................................... 1
2
SETUP....................................................................................................................... 1
3
BOARD LAYOUT ...................................................................................................... 6
4
SCHEMATIC ............................................................................................................. 9
LIST OF FIGURES
Figure 1: TIger communication board (left) and IC EVM board (right) ............................... 2
Figure 2: GUI : default SPI mode........................................................................................ 3
Figure 3: GUI : advanced SPI mode................................................................................... 4
Figure 4: Sample waveforms .............................................................................................. 5
Figure 5: Top Assembly Layer........................................................................................... 6
Figure 6: Top Layer Routing .............................................................................................. 7
Figure 7: Bottom Layer Routing.......................................................................................... 8
Figure 8: TPIC8101EVM Schematic................................................................................... 9
LIST OF TABLES
Table 1: Device and Package Configurations .................................................................... 1
Table 2: TPIC8101EVM Bill of Materials .......................................................................... 10
1.
Introduction
The Texas Instruments TPIC8101EVM evaluation module set (EVM) helps designers evaluate the operation
and performance of the TPIC8101 dual-channel knock sensor interface IC. The EVM set contains one TI
communication board (TIger), one IC EVM board and TPIC8101 IC (See Table 1).
Table 1: Device and Package Configurations
CONVERTER
U1
2.
IC
TPIC8101DWG4
PACKAGE
DW-20
Setup
This section describes the setup of EVM sets, including EVM set hardware connection and GUI operation.
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TPIC8101EVM User’s Guide
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2.1. EVM set hardware connection.
The TI communication board should be connected to the IC EVM board via a 30-pin connector in the
shipment box. Please connect them if they are not connected yet, as shown in Figure 1.
Figure 1: TIger communication board (left) and IC EVM board (right)
Please insert one end of a USB cable into TIger communication board, the other end to the USB port in a PC.
5V voltage supply
• 5V could be supplied by TI communication board if Jumper 5V is connected (default setting)
• 5V could be also supplied by connecting probe VDD with and external power supply, and
disconnecting Jumper 5V
High frequency oscillation input (e.g., 8MHz)
• High frequency oscillation signal could be supplied by TI communication board if Jumper TLCK is
connected (default setting)
• High frequency oscillation signal could be also supplied by connecting probe XCLK with and
external function generator, and disconnecting Jumper TLCK
Integration window signal (e.g., 5ms)
• Integration window signal could be supplied by TI communication board if Jumper INH/H is
connected (default setting)
• Integration window signal could be also supplied by connecting jumper pin INH/H with and external
function generator, and unplugging Jumper INH/H.
Knock sensor output signal (e.g., 10KHz)
• Knock sensor output signal could be connected at probe CH1 or CH2 (for channel 1 and 2
correspondingly), from a knock sensor, or an external function generator.
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2.2. GUI operation
Software package:
There are 5 files in the zipped software package, please unzip them into one folder and run the executable
file TPIC8101EVM.exe to start the GUI.
The GUI will be shown as Figure 2. By default, the IC will be working on default SPI mode after power up,
which happens after USB cable is plugged into PC. If USB cable is consistently plugged into PC, the IC could
stay in either default SPI mode or advanced SPI mode, depending on the very last operation. If the IC is in
the advanced SPI mode, need to restart the IC to return to default SPI mode.
Operation in default SPI mode:
The SPI is in the default mode on the power up sequence. In this case, the SDO directly equals the SDI
(echo function). In this mode, five commands can be transmitted by the master controller (TI communication
board) to configure the IC. Details setting could be found at page 13 of the datasheet.
In each setting, select a value from the combo boxes, and press Send SPI button. Exact the same SPI
response should be read, if the IC works correctly.
• Set the prescaler and SDO status
• Select the channel
• Set the band-pass center frequency
• Set the gain
• Set the integration time constant
• Enter advanced SPI mode. Once entered the advanced mode, there is no way to return to normal
mode, unless restart the IC.
Figure 2: GUI : default SPI mode
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TPIC8101EVM User’s Guide
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Operation in advanced SPI mode:
The advanced SPI mode has additional features to the default SPI mode. A control byte is written to the SDI
and shifted with the MSB first. The response byte on the SDO is shifted out with the MSB first. The response
byte corresponds to the previous command. Therefore, the SDI shifts in a control byte n and shifts out a
response command byte n−1. Each control/response pair of commands requires two full 8-bit shift cycles to
complete a transmission. The control bytes with the expected response are shown in page 14 of datasheet.
In the advanced SPI mode, only a power-down condition may reset the SPI mode to the default state on the
subsequent power-up cycle.
Figure 3: GUI : advanced SPI mode
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TPIC8101EVM User’s Guide
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Clock and integration window settings:
TI communication board could generate 2 square wave forms, a high frequency one which could be used as
an external clock frequency signal, such as 8Mhz; and a low frequency one which could be used as a
integration window, such as 5ms.
To use the external clock, check the enable box and enter a desired frequency in the edit box. Press the
Update Osc button once the settings has been updated.
To use the integration window, check the enable box and enter a 4 digit hex number in the edit box. Hex
0000 is the fastest square waveform the TI communication board could produce, and hex FFFF corresponds
to the slowest waveform. It is generated by the a GPIO of the micro controller, therefore the frequency is
approximate. E.g, hex 012A could generate a 100Hz square waveform, which could be used to serve as a
5ms integration window.
Sample waveforms of knock sensor output, integration window and IC analog output are shown in Figure 4.
Knock sensor
output
Integration
Window
IC analog
Output
Figure 4: Sample waveforms
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TPIC8101EVM User’s Guide
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3.
Board Layout
Figure 5, Figure 6 and Figure 7 show the board layout for the TPIC8101EVM PWB. The board layout and the
PWB for TIger communication board are not provided.
Figure 5: Top Assembly Layer
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Figure 6: Top Layer Routing
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Figure 7: Bottom Layer Routing
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4.
Schematic
Figure 8: TPIC8101EVM Schematic
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Table 2: TPIC8101EVM Bill of Materials
COUNT
2
REF DES
C1, C2
3
1
1
C3, C5, C6
C4
C7
1
J1
3
5V, INH/H,
TCLK
5V, INH/H,
TCLK
R1, R2, R3,
R4
R5
R6
R7
CH1, CH1FB,
CH1N, CH2,
CH2FB,
CH2N, CS/,
GND (x3),
OUT, SCLK,
SDI, SDO,
TEST, VIN,
VREF, XCLK
U1
-
3
4
1
1
1
19
1
1
10
DESCRIPTION
Capacitor, ceramic, 3300pF, 50V,
10%
Capacitor, ceramic, 0.1uF, 50V, 10%
Capacitor, ceramic, 4.7uF, 16V, 10%
Capacitor, ceramic, 470pF, 50V,
10%
Dual row header right angle, 30-pin,
100-mil spacing, (80-pin strip)
Header, 2-pin, 100-mil spacing, (36pin strip)
Connector jumper, shorting, 100-mil
spacing
Resistor, chip, 30.1 kΩ, 1/10W, 1%
Resistor, chip, 1 kΩ, 1/10W, 1%
Resistor, chip, 1 MΩ, 1/10W, 1%
Resistor, chip, 0 Ω, 1/10W, 1%
Test point, 52-mil
IC, TPIC8101DW
PCB, 1.6-inch x 1.9-inch x 0.062
TPIC8101EVM User’s Guide
SIZE
603
MFR
muRata
PART NUMBER
603
1206
603
muRata
muRata
muRata
0.100 x
15
0.100 x 2
Tyco
Sullins
PEC02SAAN
0.1
Sullins
SPC02SYAN
603
Panasonic
603
603
603
0.052
Panasonic
Panasonic
Panasonic
Kobiconn
ERJ-3EKF3012V
ERJ-3EKF1001V
ERJ-3EKF1004V
ERJ-3GEY0R00V
151-103-RC
TI
Any
TPIC8101DW
TPIC8101, REV B
GRM188R71H332KA01D
GRM188R71H104KA93D
GRM31CR61C475KA01L
GRM188R71H471KA01D
9-146308-0
July 2009
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general customer use. It generates, uses, and can radiate
radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause
interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required
to correct this interference.
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EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of -0.3 V to 48 V and the output voltage range of 0.9 V to 18 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning
the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please
consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a
TI field representative.
During normal operation, some circuit components may have case temperatures greater than 85° C. The EVM is designed to operate properly
with certain components above 60° C as long as the input and output ranges are maintained. These components include but are not limited to
linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM
schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that
these devices may be very warm to the touch.
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