TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 2 X 2 Crosspoint Switch for Audio Applications Check for Samples: TS3A26746E FEATURES 1 • • • • • • • • Ultra Low RON for GND Switch (80-mΩ typical) RON for MIC Switch <10-Ω 3.0V to 3.6V V+ Operation Control Input is 1.8-V Logic Compatible 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.5mm) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 500-V Charged-Device Model (C101) ESD Performance (SLEEVE, RING2) – ±8-kV Contact Discharge (IEC 61000-4-2) APPLICATIONS • • • • • Cellular phones PDAs Portable Instrumentation Digital Still Cameras Portable Navigation Devices PINOUT 1 2 A B C DESCRIPTION The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2013, Texas Instruments Incorporated TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TYPICAL APPLICATION BLOCK DIAGRAM MIC BIAS ACCESSORY DATA V+ SLEEVE MIC 100 kW RING2 SEL = H RING1 RIGHT TIP LEFT Figure 1. Standard Headphone Configuration (SEL=H) MIC BIAS ACCESSORY DATA V+ SLEEVE MIC 100 kW RING2 SEL=L RING1 RIGHT TIP LEFT Figure 2. Alternate Headphone Configuration (SEL=L) 2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 PINOUT 2 1 A B C TERMINAL ASSIGNMENTS 1 2 A SEL V+ B MIC SLEEVE C GND RING2 PIN FUNCTIONS BALL # PIN DESCRIPTION NAME TYPE A1 SEL Input Control Input A2 V+ Power Supply Voltage B1 MIC I/O MIC B2 SLEEV E I/O Sleeve Connection on Headphone Jack C1 GND Ground Ground C2 RING2 I/O 2nd Ring Connection on Headphone Jack Table 1. FUNCTION TABLE SEL MIC to SLEEVE, GND to RING2 MIC to RING2, GND to SLEEVE L OFF ON H ON OFF Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E 3 TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V+ Supply voltage range (3) –0.3 4.0 V VMIC VSLEEVE VRING2 Analog voltage range (3) –0.3 4.0 V IK Analog port diode current VI Digital input voltage range –0.3 IIK Digital input clamp current (3) –50 I+ Continuous current through V+ IGND Continuous current through GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) VMIC, VSLEEVE, VRING2 < 0 V –50 VI < 0 V mA 4.0 V mA 100 mA 102 °C/W 150 °C –100 YZP package –65 mA Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. All voltages are with respect to ground, unless otherwise specified. The package thermal impedance is calculated in accordance with JESD 51-7. ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY (1) V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS TA V+ MIN TYP MAX UNIT MIC SWITCH VMIC, VSLEEVE, VRING2 Analog signal range ron ON-state resistance 0 ≤ VSLEEVE or VRING2 ≤ V+, IMIC = –32 mA Switch ON ron(flat) ON-state resistance flatness 0 ≤ VSLEEVE or VRING2 ≤ V+, IMIC = –32 mA Switch ON ISLEEVE(OFF), IRING2(OFF) SLEEVE, RING2 OFF leakage current VSLEEVE or VRING2 = 1 V, VMIC = 3 V, or VSLEEVE or VRING2 = 3 V, VMIC = 1 V Switch OFF IMIC(OFF) MIC OFF leakage VSLEEVE or VRING2 = 3 V, VMIC = 1 V, or current VSLEEVE or VRING2 = 1 V, VMIC = 3 V Switch OFF ISLEEVE(ON), IRING2(ON) SLEEVE, RING2 ON leakage current VSLEEVE or VRING2 = 1 V, VMIC = Open, or VSLEEVE or VRING2 = 3 V, VMIC = Open Switch ON IMIC(ON) MIC ON leakage current VSLEEVE or VRING2 = Open V, VMIC = 1 V, or VSLEEVE or VRING2 = Open, VMIC = 3 V Switch ON 25°C ON-state resistance ISLEEVE or IRING2 = +32 mA, VGND = 0 V, IGND = –32 mA Switch ON 25°C VSLEEVE or VRING2 = 3V and VGND = 0 V Switch OFF 25°C VSLEEVE or VRING2 = 0 to 3.6 V and VGND =0V Switch OFF 0 25°C V+ 3V 5 Full 25°C 3V 1 Full 25°C Full –0.5 3.6 V 3.6 V 25°C Full Full 0.05 –2 0.1 –2 3.6 V 1 2 –2 3.6 V 0.5 –2 0.5 –2 μA μA 2 2 –2 Ω 0.5 2 –1 Ω 2.3 2.5 25°C Full 8 10 V 2 2 μA μA GND SWITCH ron ISLEEVE(OFF), IRING2(OFF) ISLEEVE(PWROFF ), IRING2(PWROFF)) (1) 4 SLEEVE, RING2 OFF leakage current Full Full 3.6 V 25°C Full 0.08 3V 0.11 –0.5 0.05 –1 –1 0V 0.09 –10 0.5 1 0.5 Ω μA 1 10 μA The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY(1) (continued) V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS TA V+ MIN TYP MAX UNIT DIGITAL CONTROL INPUTS (SEL) VIH Input logic high Full 3.6 V 1.2 3.6 V VIL Input logic low Full 3.6 V 0 0.4 V IIH Input logic high leakage current VI = V+ 25°C 3.6 V –1 IIL Input logic low leakage current VI = 0 V tON Turn-on time VMIC = V+, RL = 50 Ω CL = 35 pF tOFF Turn-off time VMIC = V+, RL = 50 Ω CL = 35 pF tBBM Break-beforemake time VMIC = V+ CMIC MIC capacitance Full 25°C 0.05 –2 3.6 V Full –38 1 2 –36 –45 –34 –30 μA μA DYNAMIC CSLEEVE SLEEVE / RING2 capacitance CI Digital input capacitance THD Total harmonic distortion 25°C 3.3 V Full 3 V to 3.6 V 25°C 3.3 V Full 3 V to 3.6 V 150 200 250 5 10 15 330 ns 25°C 3.3 V Full 3 V to 3.6 V SEL=High 25°C 3.3 V 100 140 pF SEL=Low 25°C 3.3 V 100 140 pF SEL=High 25°C 3.3 V 100 140 pF SEL=Low 25°C 3.3 V 100 140 pF VI = V+ or 0 V 25°C 3.3 V 4.0 RL = 1k Ω, V = 30 mVPP f = 20 Hz to 20 kHz 3.3 V 0.01% 25°C 70 ns ns 330 pF SUPPLY V+ Power Supply Voltage 3.0 25°C VI = V+ I+ 3.6 V 3.3 3.6 0.01 1 Full Positive supply current 25°C VI = 0 V Full 5 40 41 50 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E V μA μA 5 TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com OPERATIONAL CHARACTERISTICS 6 5 SLEEVE-MIC Ron - Ω 4 3 RING2-MIC 2 1 0 0 0.5 1.0 Figure 3. RON 1.5 2.0 2.5 Vin - V vs VIN (MIC Switch) 3.0 PARAMETER MEASRUMENT INFORMATION Figure 4. Turn-On (tON) and Turn-Off Time (tOFF) 6 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 PARAMETER MEASRUMENT INFORMATION (continued) Figure 5. Break-Before-Make Time (tBBM) Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E 7 TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision B (November 2011) to Revision C • 8 Page Replaced 1 page preview with full document. ...................................................................................................................... 1 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TS3A26746E PACKAGE OPTION ADDENDUM www.ti.com 23-May-2013 PACKAGING INFORMATION Orderable Device Status (1) TS3A26746EYZPR ACTIVE Package Type Package Pins Package Drawing Qty DSBGA YZP 6 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Device Marking (3) SNAGCU Level-1-260C-UNLIM (4/5) -40 to 85 7N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 17-Jun-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3A26746EYZPR Package Package Pins Type Drawing SPQ DSBGA 3000 YZP 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 1.02 B0 (mm) K0 (mm) P1 (mm) 1.52 0.63 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Jun-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3A26746EYZPR DSBGA YZP 6 3000 182.0 182.0 20.0 Pack Materials-Page 2 PACKAGE OUTLINE YZP0006 DSBGA - 0.5 mm max height SCALE 9.000 DIE SIZE BALL GRID ARRAY B A E BALL A1 CORNER D C 0.5 MAX SEATING PLANE 0.19 0.15 BALL TYP 0.05 C 0.5 TYP C SYMM 1 TYP B 0.5 TYP D: Max = 1.338 mm, Min =1.277 mm E: Max = 0.838 mm, Min =0.777 mm A 6X 0.015 0.25 0.21 C A B 1 2 SYMM 4219524/A 06/2014 NanoFree Is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. TM 3. NanoFree package configuration. www.ti.com EXAMPLE BOARD LAYOUT YZP0006 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 6X ( 0.225) 1 2 A (0.5) TYP SYMM B C SYMM LAND PATTERN EXAMPLE SCALE:40X ( 0.225) METAL 0.05 MAX METAL UNDER MASK 0.05 MIN ( 0.225) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4219524/A 06/2014 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017). www.ti.com EXAMPLE STENCIL DESIGN YZP0006 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 6X ( 0.25) (R0.05) TYP 2 1 A (0.5) TYP SYMM B METAL TYP C SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4219524/A 06/2014 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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