ROHM BU7861KN

Audio Accessory ICs for Mobile Devices
Mixer & Selector IC
with PCM CODEC and 16bit D/A Converter
BU7861KN
No.10087EAT04
●Description
The “In/Output Selector with Built-in PCM Codec 16bit D/A Converter” LSI is ideal for improving the sound quality of and
miniaturizing cellular phone handsets with music playback function, accumulating analog circuits for sound which application
CPUs and bass band LSIs are not ideally able to handle.
●Features
1) Loaded with stereo 16bit audio D/A converter
2) Compatible with stereo and analog interfaces
3) Built-in stereo headphone amp (16Ω)
4) Lowpass correction circuit built into the headphone amp
5) Gain-adjustable volume built in
6) Flexible mixing function built in
●Applications
Portable information communication devices such as cellular phone handsets and PDA (Personal Digital Assistants)
Cellular phone handsets with music playback function
●Absolute maximum ratings
Parameter
Symbol
Ratings
Unit
DVDD
AVDD, PVDD
-0.3 ～ 4.5
V
Pd
500 *1
mW
Operational Temperature Range
TOPR
-25 ～ +80
℃
Storage Temperature Range
TSTG
-55 ～ +125
℃
Supply Voltage
Power Dissipation
*1 When used at over Ta=25℃, lessen by 5.0mW per 1℃ increase.
●Operating conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Digital Supply Voltage
DVDD
2.7
3.0
3.3
V
Analog Supply Voltage
AVDD
2.7
3.0
3.3
V
Power Supply Voltage
PVDD
2.7
3.0
3.3
V
FSYNC
－
8
－
kHz
PLL Synchronous Signal Frequency
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1/13
2010.09 - Rev.A
Technical Note
BU7861KN
●Electrical characteristics (Unless specified, Ta=25℃, DVDD=AVDD=3.0V, PVDD=3.0V, FSYNC=8kHz)
・Complete Block
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Consumed Current 1
IDD1
－
0.1
10
µA
When all power down, FSYNC L fixed
Consumed Current 2
IDD2
－
0.8
1.2
mA
REFON, FSYNC L fixed
Consumed Current 3
IDD3
－
1.7
2.6
mA
REFON+PLLON, FSYNC=8kHz
Consumed Current 4
IDD4
－
1.6
2.4
mA
REFON+MICBON,
Consumed Current 5
IDD5
－
1.0
1.5
mA
REFON+EXTOUT, FSYNC L fixed
Consumed Current 6
IDD6
－
5.9
9.0
mA
Consumed Current 7
IDD7
－
6.4
9.6
mA
Consumed Current 8
IDD8
－
2.2
3.3
mA
REFON+RECON,
Consumed Current 9
IDD9
－
2.9
4.5
mA
REFON+HPON,
Consumed Current 10
IDD10
－
2.2
3.3
mA
REFON+ HPVOLON,
L fixed
Consumed Current 11
IDD11
－
10.0
15.0
mA
DACON,
Consumed Current 12
IDD12
－
18.0
27.0
mA
All power on
FSYNC=8kHz
Digital High Level Input Voltage
VIH
0.8×
DVDD
－
－
V
Digital Low Level Input Voltage
VIL
－
－
0.2×
DVDD
V
Digital High Level Input Current
IIH
－
－
10
µA
VIH=DVDD
Digital Low Level Input Current
IIL
-10
－
－
µA
VIL=0V
VOH
DVDD
-0.5
－
－
V
IOH=-1mA
VOL
－
－
0.5
V
IOL=1mA
Vhys
0.3
0.5
0.7
V
SYSCLK, BCLK, LRCLK, FSYNC,
DSPCLK
Digital High Level Output
Voltage
Digital Low Level Output
Voltage
Schmidt Input Hysteresis Width
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2/13
FSYNC L fixed
REFON+PLLON+VICON,
FSYNC=8kHz
REFON+PLLON+VICON+TONEON,
FSYNC=8kHz
FSYNC L fixed
FSYNC L fixed
FSYNC
SYSCLK=256fs
SYSCLK=256fs
2010.09 - Rev.A
Technical Note
BU7861KN
・Sound Block
Parameter
Limits
Unit
Conditions
Min.
Typ.
Max.
Frequency Characteristics
-3
－
+3
dB
Reference level (-20dB due to full scale)
f=20Hz～20kHz -3dB band width
DAC Full Scale
1.4
1.8
2.2
VP-P
0.6×VDD
-
-
±1.5
dB
Difference between Lch and Rch levels during
DAC full scale
Distortion (No Bass Boost)
－
－
1
%
DAC input=-0.5dBFS, HP_VOL=-2dB,
HP2_VOL=0dB
Distortion (With Bass Boost)
－
－
10
%
DAC input=-0.5dBFS, HP_VOL=-2dB,
HP2_VOL=0dB
S/N
75
83
－
dB
During full scale
HP_VOL, HP2_VOL=0dB, f=1kHz, A-weighted
Stereo headphone amp included
Crosstalk
70
80
－
dB
Measures the leak from Lch to Rch during
full-scale output. 1kHz BPF
Output Level during Mute
70
80
－
dB
1kHz BPF
Gain Error between Channels
・Driver Amp Block
Limits
Parameter
Microphone Amp
Max.
40
－
－
－
1.0
－
60
66
－
dB
C-Message
12
25
20
35
－
－
dB
0.2VP-P superimposed to supply
COMIN 1.0µF, MICIN no input
26
32
－
Ω
31.25
45
－
mW
RL=32Ω, f=1kHz
S/N
80
90
－
dB
RL=32Ω, C-Message
Offset Voltage
－
5
100
mV
65
60
77
70
－
－
dB
12
16
－
Ω
15
25
－
mW
RL=16Ω, f=1kHz
15
40
26
48
－
－
dB
0.2VP-P superimposed to supply
COMIN 1.0µF, HP_Vol=0dB
0.707
－
－
Vrms RL=10kΩ, f=1kHz
0.707
－
－
Vrms RL=3kΩ, f=1kHz
Gain Configurable Range
(THD≦1%)
Maximum Output Voltage
(THD≦1%)
PSRR
100Hz
1kHz
Load
Maximum Output Power
(THD≦1%）
PSRR
100Hz
1kHz
Load
Stereo
Headphone Amp
SPOUT Terminal
EXTOUT
Terminal
Conditions
Typ.
S/N
Receiver Amp
Unit
Min.
Maximum Output Power
(THD≦1%）
100Hz
PSRR
1kHz
Maximum Output Voltage
(THD≦1%)
Maximum Output Voltage
(THD≦1%)
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3/13
dB
f=100Hz～3.4kHz
Vrms MICO terminal, f=1kHz
0.2VP-P superimposed to supply
COMIN 1.0µF
2010.09 - Rev.A
Technical Note
BU7861KN
・Codec Block
Limits
Parameter
Transmitting Side
Reference Input Level
Receiving Side
Reference Input Level
Pass Gain
Transmitter Signal vs.
General
Power Distortion
MICIN→DSPOUT
Receiver Signal vs.
General
Power Distortion
DSPIN→RECP
Transmitter
Transmission Level
MICIN→DSPOUT
Receiver
Transmission Level
DSPIN→RECP
Transmitter
Transmission Loss
F Special
MICIN→DSPOUT
Receiver
Transmission Loss
F Special
DSPIN→RECP
MICIN→
DSPOUT
EXTIN→
DSPOUT
DSPIN→
RECP
DSPIN→
SPOUT
DSPIN→
EXTOUT
EXTIN→
RECN
EXTIN→
SPOUT
Min.
Typ.
Max.
0.44
0.50
0.56
Unit
Vrms
0.119 0.135 0.151 Vrms
0.44
0.50
0.56
Vrms
0.44
0.50
0.56
Vrms
0.44
0.50
0.56
Vrms
2.4
3.2
4.0
dB
2.4
3.2
4.0
dB
-45dBm0
24
－
－
-40dBm0
29
－
－
0, -30dBm0
35
－
－
-45dBm0
24
－
－
-40dBm0
29
－
－
0, -30dBm0
35
－
－
-55dBm0
-0.9
－
0.9
-50dBm0
-0.6
－
0.6
0, -40dBm0
-0.3
－
0.3
-55dBm0
-0.9
－
0.9
-50dBm0
-0.6
－
0.6
0, -40dBm0
-0.3
－
0.3
0.06kHz
24
－
－
0.2kHz
0
－
2.5
0.3～3.0kHz
-0.3
－
0.3
3.4kHz
-0.3
－
0.9
1020Hz, sine wave,
MIC amp gain 0dB
Tx_Vol 0dB, C-MESSAGE
dB
1020Hz, sine wave
Rx_Vol 0dB, C-MESSAGE
dB
1020Hz, -10dBm0 typical
MIC amp gain 0dB
Tx_Vol 0dB, C-MESSAGE
dB
1020Hz, -10dBm0 typical
Rx_Vol 0dB, C-MESSAGE
dB
1020Hz, 0dBm0 at transmission
MIC amp gain 0dB
Tx_Vol 0dB
dB
1020Hz, 0dBm0 at input
Rx_Vol 0dB
3.6kHz
0
－
－
3.78kHz
6.5
－
－
0.3～3.0kHz
-0.3
－
0.5
3.4kHz
-0.3
－
0.9
3.6kHz
0.0
－
－
3.78kHz
6.5
－
－
－
－
-65
dBm0
－
－
-75
dBV
MICIN→
DSPOUT
DSPIN→
REC[P-N]
Crosstalk
(Transmitter→
Receiver)
MICIN→
REC[P-N]
60
70
－
dB
Crosstalk
(Receiver→
Transmitter)
DSPIN→
DSPOUT
63
68
－
dB
Distortion
2nd to 5th time
40
50
－
dB
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4/13
When 1020Hz, sine wave, 0dBm0 transmitting
MIC amp gain 0dB, Tx_Vol 0dB
When 1020Hz, sine wave, 0dBm0 transmitting
Amp gain 11.37dB, Tx_Vol 0dB
At 1020Hz, sine wave, 0dBm0 input
Rx_Vol 0dB
At 1020Hz, sine wave, 0dBm0 input
Rx_Vol 0dB
At 1020Hz, sine wave, 0dBm0 input
Rx_Vol 0dB
EXTIN input, Rx_testline path
Rx_Vol 0dB
EXTIN input, Rx_testline path
SPRX_Vol 0dB
dB
Noise during idle
transmission
Noise during idle
reception
RX Higher Harmonic
Component
Conditions
MIC amp gain 0dB
Tx_Vol 0dB, C-MESSAGE
DSPIN ALL0
Rx_Vol 0dB, C-MESSAGE
1020Hz, 0dBm0 at transmission
MIC amp gain 0dB
DSPIN ALL0 Tx_Vol 0dB
Rx_Vol 0dB
ST_MT OFF
1020Hz, 0dBm0 at input, 2040Hz component
MIC amp gain 30dB
Tx_Vol 0dB
Rx_Vol 0dB
ST_MT ON
1020Hz, sine wave, 0dBm0 at input
Rx_Vol 0dB
2010.09 - Rev.A
Technical Note
BU7861KN
・Pass Switch Block
Parameter
※1
Min.
Limits
Typ.
Max.
70
80
－
Unit
Conditions
dB
Configured at each mute SW
Measured at 1kHz BPF
dB
Configured at each mute SW
Leakage amount to each test line during
normal usage
Measured at 1kHz BPF
Mute Level
※2
70
80
－
Receiving side is muted digitally by VIC_MT and SPVIC_MT.
※1 MIC_SEL, MIC_MT, EXTIN_MT, MEL_MT, VIC_MT, REC_MT, ST_MT, HSJL_MT, HSJR_MT, SPVIC_MT, SPMEL_VOL,
EXTOUT_SEL, TONE_MT, SOUND_MT, DIG_MT, AIN_MT, HP_SMT, SPOUT_SMT, EXTOUT_SMT, REC_SMT, HPR_MT, HPL_MT
※2 Tx_test1, Tx_test2, Rx_test1, Rx_test2, REC_TST, HPR_TST, HPL_TST
・DTMF/TONE Generator Block
Parameter
Output Level
Tone Distortion
Min.
Limits
Typ.
Max.
VDTMF_L
-15.3
-14.3
-13.3
dBV
VDTMF_H
-12.8
-11.8
-10.8
dBV
VTONE_L
-15.3
-14.3
-13.3
dBV
VTONE_H
-12.8
-11.8
-10.8
dBV
SDTN
－
－
-38
dB
Symbol
Unit
Conditions
f:DTMF_L
TONE→RECP
MEL_Vol 0dB
Rx_Vol 0dB
f:DTMF_H
TONE→RECP
MEL_Vol 0dB
Rx_Vol 0dB
f: designated TONE, low band TONE→RECP
MEL_Vol 0dB
Rx_Vol 0dB
f: designated TONE, high band TONE→RECP
MEL_Vol 0dB
Rx_Vol 0dB
f=1kHz ( designated TONE) TONE→REC[P-N]
MEL_Vol 0dB
Rx_Vol 0dB C-Message
・Microphone Bias Block
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Output Voltage
VO
1.8
2.0
2.2
V
Maximum
Output Current
IO
2
－
－
mA
ΔVO1
－
14.0
30
mV
Io=100µA～2mA
N
－
-109
-90
dBV
C-Message Io=500µA
Load Stability
Output Noise Voltage
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5/13
Io=500µA
2010.09 - Rev.A
Technical Note
BU7861KN
●Reference data
1.0
2.0
19
0.8
17
Vdd=3.0V
16
Vdd=2.6V
15
0.6
1.5
0.4
Vdd=3.4V
1.0
Gain [dB]
Circuit Current[mA]
Stand-by Current [uA]
Vdd=3.4V
18
Vdd=3.0V
50
Temperature[℃]
Lch
-60
LEVEL [dBV]
Rch
-70
-80
-40
-20
-20
-20
-40
-40
-60
-80
-120
-120
-140
0
5000
DAC Output Lev el [dBFS]
0
2dB
6dB
-6
8dB
-8
10dB
-10
100
1000
10000
Frequency [Hz]
8dB
0
10dB
-10
4dB
2dB
-4
12dB
-6
14dB
-8
Fig.7 Bus Boost Frequency
Characteristics
-20
-30
100
1000
10000
Frequency [Hz]
-60
100000
0
0
0
-10
-10
-20
-20
-30
-30
THD+N [dB]
-6
THD+N [dB]
0
-40
-50
-60
-10
-70
-70
-12
-80
2000
3000
Frequency [Hz]
4000
Fig.10 Voice CODEC
RX Frequency Characteristics
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© 2010 ROHM Co., Ltd. All rights reserved.
0
10
20
30
40
Output Power [mW]
50
Fig.11 Headphone Amp
Output Characteristics @ vdd=3.0V, 1kHz
6/13
4000
-50
-60
1000
2000
3000
Frequency [Hz]
-40
-8
0
1000
Fig.9 Voice CODEC
TX Frequency Characteristics
Fig.8 Bus Boost + High Pass Emphasis
Frequency Characteristics
2
-4
20000
-50
-16
10
-2
10000
15000
Frequency [Hz]
-40
-14
100000
5000
10
-12
14dB
-14
0
Fig.6 16bit D/A Converter
FFT @ 0FS
-10
12dB
-12
20000
6dB
-2
Bass Boost Gain [dB]
Bass Boost Gain [dB]
4dB
-4
10000
15000
Frequency [Hz]
Fig.5 16bit D/A Converter
FFT @ 0dBFS, 1kHz
Fig.4 16bit D/A Converter
Distortion @ 1kHz
2
20000
-80
-100
0
10000
15000
Frequency [Hz]
-60
-100
2
5000
Fig.3 16bit D/A Converter
Frequency characteristics@ 0dBFS
0
0
-2
0
0
-140
-90
-60
-16
10
100
TX Gain [dB]
THD+N [dB]
0
50
Temperature [℃]
Fig.2 Static Consumed Current
-40
-50
-1.0
-50
100
Fig.1 Operational Current
(All On)
RX Gain [dB]
-0.8
LEVEL [dBV]
0
Rch
-0.6
0.0
-50
0.0
-0.2
-0.4
0.5
Vdd=2.6V
14
Lch
0.2
-80
0
20
40
60
80
Output Power [mW]
100
Fig.12 Receiver Amp
Output Characteristics @ vdd=3.0V, 1kHz
2010.09 - Rev.A
Technical Note
BU7861KN
MICO
MICIN_C
MICIN_1
MICIN_2
MIC BIAS
MIC_BIAS
VDD/VSS
CPOP
SMUTE
PVSS
DVSS
PVDD
AVSS
VREF/COMMON
CPU I/F
DVDD
AVDD
COMIN
PVCOM
TXCOM
RXCOM
AUDRXD
AUDTXD
AUDCS
RSTB
MICB_1
MICB_2
AUDCLK
●Block diagrams
POP
SMUTE
100kΩ
MIC_MT
100kΩ
16step
+
MIC_SEL
+
TX_TEST1
A/D
TX_VOL
27kΩ
BPF
+6～-8dB
DSPCLK
RX_TEST1
EXTIN
EXTIN_MT
DSPIN
Tx_testline
EXTGND
330kΩ
DSPOUT
DSP
I/F
Rx_testline
EXTOUT
8step
EXTOUT
TX_TEST2
ST_VOL
60kΩ
EXTOUT_SMT
ST_MT
-18～-42dB
60kΩ
100kΩ
RX_VOL
+
RECN
Gain=3.2dB
32step
100kΩ REC_MT
+
D/A
41.7kΩ VIC_MT
32step
+6～-54dB
100kΩ REC_TST
100kΩ
PLL
MEL_VOL
40kΩ
40kΩ
60kΩ MEL_MT
+
RECP
LPF
RX_TEST2
0～-30dB
100kΩ
60kΩ
41.7kΩ
SPVIC_MT
60kΩ
SPMEL_MT
16step
+6～-8dB
32step
SPOUT
+
SPRX_VOL
FSYNC
DTMF/
TONE
TONE_MT
+
Gain=3.2dB
REC_SMT
PLLLPF
SPMEL_VOL
16step
0～-28dB
SPOUT_SMT 0～-30dB
SOUND_MT
80kΩ
200kΩ
HP_RI
HPL_MT
8step
+14～0dB
Gain=+3dB
70.8kΩ
100kΩ
+
-
100kΩ
SYSCLK
HP_VOL
HSJR_MT
25kΩ
25kΩ
DIG_MT
50kΩ
+
HP2_VOL
HPR_MT
8step
+14～0dB
100kΩ
200kΩ
+
HP2_VOL
SDI
Digital I/F
HP_R
100kΩ
50kΩ
50kΩ
32step
0～-45dB
+
AIN_L
80kΩ
HSJL_MT
AIN_VOL
Digital Bass Boost
200kΩ
+
HP_SMT
+
-
HP_L
Gain=+3dB
70.8kΩ
100kΩ
AIN_MT
16bit DAC
HPL_TST
200kΩ 100kΩ
HP_LI
AIN_R
50kΩ
HPR_TST
LRCLK
BCLK
25kΩ
25kΩ
CSTEP
DACLO
DACRO
TEST
PVDD
HP_RI
HP_R
HP_L
HP_LI
PVSS
AUDRXD
AUDTXD
AUDCS
AUDCLK
PLLLPF
FSYNC
Fig.13 BU7861KN Block Diagram
36
35
34
33
32
31
30
29
28
27
26
25
24 DSPIN
RECN 37
38
23 DSPOUT
CSTEP 39
22 DSPCLK
CPOP 40
21 DVSS
SMUTE 41
20 DVDD
RECP
RXCOM 42
19 SYSCLK
BU7861KN
TXCOM 43
18 BCLK
17 SDI
PVCOM 44
16 LRCLK
COMIN 45
6
7
8
9
10
11
12
DACLO
5
AIN_R
4
AIN_L
3
SPOUT
2
AVSS
MICO
1
AVDD
13 DACRO
EXTIN
MICB_2 48
EXTGND
14 TEST
MICIN_2
MICB_1 47
MICIN_1
15 RSTB
MICIN_C
EXTOUT 46
Fig.14 BU7861KN Pin Placement Diagram
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7/13
2010.09 - Rev.A
Technical Note
BU7861KN
●Lowpass correction circuit
The headphone output terminal (either HP_X or HPX_OUT) has a built-in “lowpass correction circuit” to correct lowpass
decay, comprised of output coupling capacity and headphone impedance.
200kΩ
CCHPx
HP_XI
or
HPX_FB
200kΩ
100kΩ
CL
+
+
HP_X
or
HPX_OUT
OUTPUT
RL
Fig.15 Headphone Output Section Equivalent Circuit
Lowpass Cut-off Frequency
Lowpass Boost Frequency
Boost Gain
fC= 1/(2･π･CL･RL)
fBOOST = 1/(2･π･CCHPx･200kΩ)
ABOOST = 20･log((200 kΩ+1/(2･π･f･CCHPx))/100 kΩ)
(Maximum lowpass boost is 6dB.)
The constant configuration calculates the lowpass cut-off frequency fC after confirming the output coupling capacity CL and
headphone impedance RL used. CCHPx is determined in order for the lowpass cut-off frequency fC and lowpass boost
frequency fBOOST to roughly correspond. The recommended constants are CL = 100µF, when RL = 16Ω and CCHPx =
6800pF.
The chart below shows the frequency characteristics (calculated values) during recommended constant use.
10
5
Amp Output
0
-5
After correction
Gain [dB]
-10
Before correction
-15
-20
-25
-30
-35
-40
1
10
100
1000
10000
100000
Frequency [Hz]
Fig.16 Low pass Correction Circuit Frequency Characteristics
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8/13
2010.09 - Rev.A
Technical Note
BU7861KN
●Recommended circuits
PVSS
DVSS
PVDD
AVSS
DVDD
COMIN
PVCOM
1µ
CPOP
0.1µ
1µ
1µ
1µ
+
+
SMUTE
AUDRXD
+
+
1µ
AUDCLK
AUDTXD
RSTB
AUDCS
TXCOM
RXCOM
AVDD
CPU
MICB_1
MICB_2
MIC_BIAS
MIC BIAS
VREF/COMMON
CPU I/F
VDD/VSS
SMUTE
POP
MICO
MICIN_C
MICIN_1
MICIN_2
16step
MIC_MT
+
+
MIC_SEL
TX_TEST1
TX_VOL
BPF
A/D
+6～-8dB
EXTIN
EXTIN_MT
DSPCLK
DSPIN
RX_TEST1
Tx_testline
Rx_testline
EXTOUT
TX_TEST2
ST_VOL
ST_MT
REC_MT
-18～-42dB
Gain=3.2dB
32step
D/A
+
RX_VOL
+
VIC_MT
0～-30dB
32Ω
PLLLPF
0.01µ
PLL
MEL_VOL
FSYNC
MEL_MT
+
Gain=3.2dB
SPVIC_MT
32step
+
SPRX_VOL
+
TONE_MT
SPMEL_VOL
SPMEL_MT
16step
0～-28dB
0～-30dB
HPR_TST
AIN_MT
HPL_TST
8step HPL_MT
+14～0dB
HSJR_MT
+
-
HP_RI
HP2_VOL
+
-
SDI
+
DIG_MT
HP_VOL
+
HP2_VOL
8step
HPR_MT
+14～0dB
Digital I/F
+
100µ
+
6800pF
16Ω
+
Sound
Source
IC
AIN_L
SYSCLK
32step
0～-45dB
6800pF
+
AIN_VOL
HSJL_MT
HP_LI
100µ HP_L
HP_R
AIN_R
SOUND_MT
Digital Bass Boost
SPOUT
SP amp
16step
+6～-8dB
DTMF/
TONE
16bit DAC
RECP
16Ω
LPF
RX_TEST2
32step
+6～-54dB
REC_TST
8Ω
DSP
I/F
8step
EXTOUT
RECN
CPU
DSPOUT
LRCLK
DSP
BCLK
0.1µ
CSTEP
DACLO
DACRO
TEST
Fig.17 Recommended Circuit
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© 2010 ROHM Co., Ltd. All rights reserved.
9/13
2010.09 - Rev.A
Technical Note
BU7861KN
●Input/output equivalent circuit figure
Terminal
Analog/
No
I/O
name
Digital
1
MICO
O
2
MICIN_C
3
MICIN_1
Terminal function
Power
source
Circuit
figure
Analog
MIC output
AVDD
E
O
Analog
MIC Selection output
AVDD
E
I
Analog
MIC1 input
AVDD
E
4
MICIN_2
I
Analog
MIC2 input
AVDD
E
5
EXTGND
O
Analog
External ground
AVDD
E
6
EXTIN
I
Analog
External input
-
H
7
AVDD
-
Analog
Power source for analog
8
AVSS
-
Analog
9
SPOUT
O
Analog
10
AIN_L
I
Analog
11
AIN_R
I
Analog
-
I
GND for analog
AVDD
I
Speaker output
AVDD
E
Melody input terminal Lch
AVDD
D
Melody input terminal Rch
AVDD
D
12
DACLO
I
Analog
DAC Lch LPF Condenser connected terminal
AVDD
F
13
DACRO
I
Analog
DAC Rch LPF Condenser connected terminal
AVDD
F
14
TEST
I
Digital
Please connect to DVSS
DVDD
A
15
RSTB
I
Digital
L:Reset input
DVDD
A
16
LRCLK
I
Digital
LRCLK terminal 44.1kHz(fs) for DAC
DVDD
B
17
SDI
I
Digital
SDI terminal for DAC
DVDD
A
18
BCLK
I
Digital
BCLK terminal
DVDD
B
19
SYSCLK
I
Digital
SYSCLK terminal 11.2896MHz(256fs) for DAC
DVDD
B
20
DVDD
-
Digital
The power source for digital
-
I
21
DVSS
-
Digital
GND for digital
DVDD
I
2.8224MHz(64fs) for DAC
22
DSPCLK
I
Digital
PCMClock input for PCM signal
DVDD
B
23
DSPOUT
O
Digital
PCMsignal input
DVDD
C
24
DSPIN
I
Digital
PCM signal input
DVDD
A
25
FSYNC
I
Digital
8kHz The reference clock for PLL
DVDD
B
26
PLLLPF
O
Analog
Condenser connected terminal for PLL
DVDD
F
27
AUDCLK
I
Digital
A
AUDCS
I
Digital
CPU I/F clock input terminal
The chip selection terminal for CPU I/F (H active)
DVDD
28
DVDD
A
29
AUDTXD
I
Digital
CPU I/FData input terminal
DVDD
A
30
AUDRXD
O
Digital
CPU I/FData output terminal
DVDD
C
31
PVSS
-
Analog
GND for Headphone and receiver
PVDD
I
32
HP_LI
I
Analog
Lch head phone amplifier revision terminal in low limits
PVDD
F
33
HP_L
O
Analog
Lch Head phone amplifier output terminal
PVDD
E
34
HP_R
O
Analog
Rch Head phone amplifier output terminal
PVDD
E
35
HP_RI
I
Analog
Rch head phone amplifier revision terminal in low limits
PVDD
F
36
PVDD
-
Analog
Power source for Headphone and receiver
-
I
37
RECN
O
Analog
Receiver output
PVDD
E
38
RECP
O
Analog
Receiver output
PVDD
E
39
CSTEP
O
Analog
Step noise decrease terminal when volume is variable
AVDD
F
40
CPOP
O
Analog
Pop sound decrease terminal
AVDD
F
41
SMUTE
O
Analog
Constant terminal when soft mute
AVDD
F
42
RXCOM
O
Analog
Receiving standard voltage output
AVDD
E
43
TXCOM
O
Analog
Transmit standard voltage output
AVDD
E
44
PVCOM
O
Analog
PATH standard voltage output
AVDD
E
45
COMIN
I
Analog
Standard voltage input terminal
AVDD
G
46
EXTOUT
O
Analog
External output
-
H
47
MICB_1
O
Analog
MIC BIAS output1
AVDD
E
48
MICB_2
O
Analog
MIC BIAS output2
AVDD
E
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© 2010 ROHM Co., Ltd. All rights reserved.
10/13
2010.09 - Rev.A
Technical Note
BU7861KN
PAD
PAD
A
PAD
C
B
PAD
D
F
E
PAD
PAD
PAD
G
PAD
PAD
I
H
Fig.18 Terminal equivalent circuit figure
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© 2010 ROHM Co., Ltd. All rights reserved.
11/13
2010.09 - Rev.A
Technical Note
BU7861KN
●Notes for use
1) Absolute maximum ratings
When applied voltage (VDD and VIN), and the operating temperature range (Topr) and the like it exceeds absolute
maximum rating, there is a possibility of destroying, Because it cannot specify destructive mode such as short circuit or
opening, when special mode which exceeds absolute maximum rating is supposed, that physical safety measure such as
a fuse should be implemented.
2) Recommendation operating range
If it is this range, it is the range which almost can obtain the quality of according to expectation. Concerning electric
quality ，being something which is guaranteed under condition of each item. Even inside the recommendation operating
range, voltage, temperature characteristic is shown.
3) About the opposite connection of the power source connector
There is a possibility of destroying LSI with the opposite connection to the power source connector. Please administer the
measure such as the diode is inserted between power source and the power source terminal of LSI outside as the
protection for opposite connection destruction.
4) About the power source line
At the time of designing the baseplate pattern, as for wiring of the power source/GND line, please make sure to become
low impedance. At that time, even digital type power source and analog type power source being the same electric
potential, please separate digital type power source pattern and analog type power source pattern, control the turning of
digital noise to the analog power source due to the common impedance of wiring pattern. Concerning the GND line, please
consider the similar pattern design. In addition, concerning all power source terminals of LSI, the condenser is inserted
between power source and the GND terminal, in the case of electrolysis condenser use, please decide constant with
sufficient verification in regard to the fact of without being problem in qualities of the condenser which is used, such as the
capacity pulling out happens in low temperature.
5) About GND voltage
As for electric potential of the GND terminal regarding what ever working condition, please make sure to become lowest
electric potential. In addition, please really verify that does not have the terminal which becomes electric potential below
GND include transient phenomenon
6) About the short circuit between the terminal and error installing
The occasion where you install in the set baseplate, please pay attention to the direction and the position gap of LSI
sufficiently. when you install with mistake, there is a possibility of LSI destroying. In addition, there is a possibility of
destruction concerning when it short-circuits e.g. due to the foreign material enters between the terminal and between
terminal and power source and GND.
7) About the operation in the strong electromagnetic field
As for the use in the strong electromagnetic field, being to be a possibility of doing the malfunction, please note.
8) About the testing with the set baseplate
When inspecting with the set baseplate, the condenser is connected to the LSI terminal whose impedance is low, because
there is a possibility of stress depending on LSI, please be sure to do discharge in every process. In addition, when
installing and removing the tool in inspection process, by all means with power source as off to connect, to inspect, to
remove. Furthermore, As a static electricity measure, please note to administer the earth and the conveyance and
preservation in the case of assemble process sufficiently.
9) About each input terminal
With respect to the structure of LSI, the parasitic element is formed inevitably by the relationship of electric potential. It
causes the interference of circuit operation due to the fact that the parasitic element operates, the malfunction, even can
become cause of destruction. Therefore, e.g., the voltage which is lower than GND in the input terminal is impressed,
please note sufficiently not to do the method where the parasitic element operates. In addition, When not impress power
supply voltage in LSI, please do not impress voltage in the input terminal. Furthermore, when power supply voltage is
impressed even, as for each input terminal, please make voltage below power supply voltage or within guaranteed
performance of electric quality.
10) About GND wiring pattern
When there are both small signal GND and a heavy-current GND, it separates small signal GND pattern from
heavy-current GND pattern, in order that the pattern wiring and the voltage change caused by large current do not change
the voltage of small-signal GND, it is recommended to carry out the one-point grounding at the reference point of set..
Please be careful of not to fluctuate the GND wiring pattern of external parts
11) When in the external condenser, the ceramic condenser is used, please decide the constant on the consideration of the
nominal capacity decrease caused by direct current bias and the change of the capacity due to temperature etc.
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© 2010 ROHM Co., Ltd. All rights reserved.
12/13
2010.09 - Rev.A
Technical Note
BU7861KN
●Ordering part number
B
D
7
Part No.
8
6
1
K
Part No.
N
-
E
Package
KN: UQFN48
2
Packaging and forming specification
E2: Embossed tape and reel
UQFN48
7.0±0.1
Tape
Embossed carrier tape (with dry pack)
24
Quantity
2500pcs
13
Direction
of feed
25
36
7.2±0.1
<Tape and Reel information>
7.2 ± 0.1
7.0 ± 0.1
37
48
1
12
0.2 ± 0.05
0.22±0.05
+0.03
0.02 -0.02
0.05
+0.1
0.6 -0.3
0.05
M
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.95MAX
(1.4)
5
.5
(0
)
5
.4
(0
3(0
.2
)
)
0.4
Notice :
Do not use the dotted line area
for soldering
1pin
Reel
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
13/13
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.09 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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R1010A