SNOA549c. - Texas Instruments

Application Report
SNOA549C – February 2010 – Revised February 2010
Absolute Maximum Ratings for Soldering
.....................................................................................................................................................
ABSTRACT
The specifications contained herein apply only to National Semiconductor products whose
datasheets refer to this document and specifically exclude those products that use the package
families listed in the tables in this section.
1
2
Contents
Scope .........................................................................................................................
Infrared and Convection ....................................................................................................
2.1
Pb-FREE SMT PACKAGES ......................................................................................
2.2
SnPb SMT PACKAGES ...........................................................................................
2
2
2
2
List of Tables
......................................................................................
..........................................................................................
1
Pb-Free Peak Body Temperatures
2
2
SnPb Peak Body Temperatures
3
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SNOA549C – February 2010 – Revised February 2010
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Absolute Maximum Ratings for Soldering
Copyright © 2010, Texas Instruments Incorporated
1
Scope
1
www.ti.com
Scope
The specifications contained herein apply only to National Semiconductor products whose
datasheets refer to this document and specifically exclude those products that use the package
families listed in the tables in this section.
NOT applicable to the following Pb-free package families:
LAMINATE CSP
LCC
LTCC
NOT applicable to the following SnPb package families:
LLP
PLCC
SSOP
PQFP-208 pins
SOIC WIDE
TEPBGA
All specifications in this document are to be interpreted as Absolute Maximum Ratings. Absolute Maximum
Ratings indicate limits beyond which damage to the device may occur, including inoperability and
degradation of device reliability and/or performance. Functional operation of the device and/or nondegradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating
Ratings or Operating Conditions is not implied. The Operating Ratings or Operating Conditions indicate
conditions at which the device is functional and the device should not be operated beyond such
conditions.
2
Infrared and Convection
2.1
Pb-FREE SMT PACKAGES
These specifications meet IPC/JEDEC J-STD-020.
Table 1. Pb-Free Peak Body Temperatures
Package Thickness
Package Volume
< 350 mm3
Package Volume
350 – 2000 mm3
Package Volume
>2000 mm3
<1.6 mm
260°C
260°C
260°C
1.6 mm –
2.5 mm
260°C
250°C
245°C
> 2.5 mm
250°C
245°C
245°C
Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
Dwell time max within 5°C of peak temperature: 30 sec
2.2
SnPb SMT PACKAGES
The specifications in Table 1 apply for SnPb package families not listed below. Table 1 exceeds J-STD020 requirements for SnPb packages.
For the families listed below, specifications in Table 2 apply. These specifications meet J-STD-020.
2
EQUAD
SOIC NARROW
TO-252
FBGA
PBGA
TO-263
FCBGA
TBGA
CERPACK
LBGA
TFBGA
Absolute Maximum Ratings for Soldering
SNOA549C – February 2010 – Revised February 2010
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Copyright © 2010, Texas Instruments Incorporated
Infrared and Convection
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Table 2. SnPb Peak Body Temperatures
Package Volume
<350 mm3
Package Thickness
Package Volume
≥350 mm3
<2.5 mm
235°C
220°C
≥ 2.5 mm
220°C
220°C
Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
Dwell time max within 5°C of peak temperature:
SNOA549C – February 2010 – Revised February 2010
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20 sec
Absolute Maximum Ratings for Soldering
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