Hollow Slider Momentary Type SPEG Series942KB

SPEG
Hollow Slider Momentary Type
Hollow type supporting designs such as LED illumination
Detector
■ Typical Specifications
Items
Specifications
1mA 5V DC / 50BA 3V DC
Contact resistance(Initial/After operating life)
200mΩ max. / 500mΩ max.
Operating forces
2.16N
Without load
30,000 cycles
With load
30,000 cycles(1mA 5V DC)
Poles
1.1
1
Minimum order unit(pcs.)
Ground terminal
Without
Export
1,200
4,800
Product No.
SPEG110100
SPEG120100
Power
With
Japan
Rotary
Product Line
Push
Operating life
Total travel
(mm)
Slide
Rating(max.)(
/ min.)
(Resistive load)
Packing Specifications
Unit:mm
Number of packages(pcs.)
1 reel
1 case /Japan
1 case /export packing
Tape width
(mm)
1,200
2,400
4,800
24
Export package
measurements
(mm)
428×413×172
Reel size
Unit:mm
Style
PC board mounting hole dimensions
In case of using
ground terminal
$
③
Frame for mounting
Vertical
Type
①
Horizontal
Type
Dimensions
Dual-in-line
Package Type
Taping
$
②
④
Total Travel Position
High of product
In case of not using
ground terminal
Circuit Diagram
Note
①
③
②
④
Above dimensions indicate“with ground terminal”version.
Refer to P.138 for soldering conditions.
125
Push Switches
List of Varieties
Vertical
Detector
Series
SPEH
SPEG
SPEJ
SPPH2
SPPH4
SPPH1
W
6
7.19
7
6
6.5
10
D
6
8.39
7
6.5
8.5
10
H
5
3.5
5.95
6.5
Travel(mm)
—
—
1.7
1
2.2
1.5
Total travel(mm)
1.6
1.1
1.7
1.5
3
2.5
Number of poles
1
1
2
2
Operating
temperature range
−40℃ to +90℃
−10℃ to +60℃
−40℃ to +85℃
−10℃ to +60℃
Automotive use
●
—
●
—
Rating(max.)
(Resistive load)
50mA
16V DC
1mA
5V DC
0.2A
14V DC
0.1A
12V DC
Rating(min.)
(Resistive load)
10μA
1V DC
50μA
3V DC
—
Operating life
without load
100,000 cycles
400mΩ max.
30,000 cycles
500mΩ max.
10,000 cycles
150mΩ max.
10,000 cycles
50mΩ max.
10,000 cycles
100mΩ max.
10,000 cycles
40mΩ max.
Operating life with load
(at max. rated load)
100,000 cycles
400mΩ max.
30,000 cycles
500mΩ max.
10,000 cycles
150mΩ max.
10,000 cycles
50mΩ max.
10,000 cycles
100mΩ max.
10,000 cycles
40mΩ max.
Initial contact
resistance
200mΩ max.
200mΩ max.
150mΩ max.
30mΩ max.
100mΩ max.
20mΩ max.
Insulation
resistance
100MΩ min.
100V DC
3MΩ min.
100V DC
100MΩ min.
500V DC
100MΩ min. 500V DC
Voltage proof
250V AC
for 1minute
100V AC for
1minute
500V AC for
1minute
500V AC for 1minute
Terminal
strength
—
0.5N for 1minute
—
5N for 1minute
Photo
Slide
Dimensions
(mm)
Push
8.5
Rotary
Power
—
●
Dual-in-line
Package Type
Life cycle
Durability
Horizontal
Type
Vertical
Type
Electrical
performance
Mechanical
Operating
performance Actuator direction
strength Pulling
direction
Environmental
performance
50N
0.1A 30V DC
50μA 3V DC
49N
30N
—
—
—
Cold
−40℃ 1,000h
−20℃ 96h
−40℃ 500h
−20℃ 96h
Dry heat
90℃ 1,000h
85℃ 96h
85℃ 500h
85℃ 96h
Damp heat
60℃, 90 to 95% RH
1,000h
Page
124
—
50N
40℃, 90 to 95% RH 60℃, 90 to 95% RH 96h
500h
125
126
10N
—
40℃, 90 to 95%RH 96h
127
129
130
Push Switches Soldering Conditions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 138
Push Switches Cautions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 139
Note
● Indicates applicability to all products in the series.
114
Push Switches Soldering Conditions
Detector
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
Push
Temperature (˚C )
Slide
300
A max.
B
200
D
E
100
Rotary
Room
temperature
Time (s)
Pre-heating
F max.
C
Power
Dual-in-line
Package Type
Series(Reflow type)
A(℃)
3s max.
B(℃)
C(s)
D(℃)
E(℃)
F(s)
260
230
40
180
150
120
SPEG
SPEJ
SPEF
SPEH
Horizontal
Type
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Vertical
Type
Reference for Hand Soldering
Series
Soldering temperature
Soldering time
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1
350±10℃
3+1/0s
SPED2, SPED4
350±10℃
3±0.5s
SPEJ
350±10℃
4s max.
SPEG, SPEF
350±5℃
3s max.
SPEH, SPPH2
350℃ max.
3s max.
SPUJ
300±10℃
3+1/0s
Reference for Dip Soldering
(For PC board terminal types)
Series
138
For PC board 端子タイプに適用
Items
Dip soldering
Preheating temperature
Preheating time
Soldering temperature
Duration of immersion
SPPJ3
100℃ max.
60s max.
260±5℃
5±1s
SPUN
100℃ max.
60s max.
260±5℃
10±1s
SPUJ, SPPH2, SPPH4
—
260±5℃
5±1s
SPPJ2, SPPH1, SPED2, SPED4, SPEF
—
260±5℃
10±1s