ROHM BD6886GUL

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
1ch Motor Driver
TYPE
BD6886GUL
FEATURES
・Built in 1 Constant-Voltage Driver
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Limit
Unit
Power supply voltage
VCC
-0.5 to +6.5
V
Motor power supply voltage
VM
-0.5 to +6.5
V
Control input voltage
VIN
-0.5 to VCC+0.5
V
Input voltage for
VLIM
-0.5 to VM+0.5
V
Constant-Voltage setting
1
Power dissipation
Pd
730※
mW
Operating temperature range
Topr
-25 to +85
°C
Junction temperature
Tjmax
150
°C
Storage temperature range
Tstg
-55 to +150
°C
※2
H-bridge output current
Iout
-200 to +200
mA/ch
※1
Reduced by 5.84mW/°C over 25°C, when mounted on a glass epoxy board (50mm  58mm  1.75mm; 8 layers)
※2
Must not exceed Pd, ASO, or Tjmax of 150°C.
Operating Conditions (Ta= -25°C to +85°C)
Parameter
Symbol
Power supply voltage
VCC
Motor power supply voltage
VM
Control input voltage
VIN
Input voltage for
VLIM
Constant-Voltage setting
H-bridge output current
Iout
※3
Must not exceed Pd or ASO.
Min.
2.5
2.5
0
Typ.
3.0
5.0
-
Max.
5.5
5.5
VCC
Unit
V
V
V
0
-
VM
V
-
-
150※
3
mA/ch
The product described in this specification is a strategic product (and/or service) subject to COCOM regulations.
It should not be exported without authorization from the appropriate government authorities.
This product isn’t designed for protection against radioactive rays.
REV. A
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Package Outline
Pin Arrangement (Top View)
1PIN MARK
2.1 ± 0.1
6886
Lot No.
1
2
3
4
A
N.C.
OUTA
PS
N.C.
B
VM
INB
INA
C
PGND
VLIM
SEL
VCC
D
N.C.
OUTB
GND
N.C.
Top View
0.1 ± 0.05
0.55 MAX
2.1 ± 0.1
S
0.5
15-φ0.25 ± 0.05
φ0.05 A B
Side View
S
0.3 ± 0.1
0.08
A
B
C
B
P=0.5×3
D
(φ0.15)INDEX POST
Bottom View
A
1
0.3 ± 0.1
2
3
4
P=0.5×3
Fig.2 BD6886GUL Pin Arrangement (Top View)
Fig.1 VCSP50L2 Package (Unit: mm)
Block Diagram
Pin No. and Pin Name
PS
VCC
No.
1A
2A
3A
4A
1B
2B
3B
4B
1C
2C
3C
4C
1D
2D
3D
4D
Thermal Shutdown
VM
&
UVLO
Level Shift
INA
INB
SEL
VLIM
Logic
OUTA
&
H Bridge
OUTB
Pre Driver
×2
PGND
GND
Fig.3 BD6886GUL Block Diagram
REV. A
Pin name
N.C.
OUTA
PS
N.C.
VM
INB
INA
PGND
VLIM
SEL
VCC
N.C.
OUTB
GND
N.C.
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BD6886GUL Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=3.0V, VM=5.0V)
Parameter
Symbol
Limit
Min.
Typ.
Max.
-
0
10
Unit
Conditions
Overall
Circuit current
during standby operation
ICCST
μA
PS=L
Circuit current 1
ICC
-
0.9
1.4
mA
PS=H with no signal
Circuit current 2
IM
-
0.4
0.65
mA
PS=H, and VLIM=5V with no signal
High-level input voltage
VINH
2.0
-
-
V
INA, INB, SEL, PS
Low-level input voltage
VINL
-
-
0.7
V
INA, INB, SEL, PS
High-level input current
IINH
15
30
60
μA
INA, INB, SEL, PS; VIN=3V
Low-level input current
IINL
-1
0
-
μA
INA, INB, SEL, PS; VIN=0V
Pull-down resistor
RIN
50
100
200
kΩ
INA, INB, SEL, PS
IVLIM
-1.5
-0.5
-
μA
VLIM=0V
VUVLO
1.6
-
2.4
V
Control input
Input for Constant-Voltage setting
Input current
UVLO
UVLO voltage
Constant-Voltage Drive block (ch1)
Output ON-Resistance
RON
-
0.8
1.2
Ω
Io=150mA on high and low sides in total
Output high-level voltage
VOH
1.9VLIM
2.0VLIM
2.1VLIM
V
VLIM=1V with 10Ω load
ton
-
1.5
5.0
μs
Io=150mA with 10Ω load※
Turn-on time
Turn-off time
Rise time
Fall time
toff
-
0.1
2.0
μs
Io=150mA with 10Ω load
tr
-
2.0
8.0
μs
Io=150mA with 10Ω load※
tf
-
0.05
※4
1.0
μs
Io=150mA with 10Ω load
4
※4
4
※4
Design target value (No total shipment inspection is made.)
I/O Truth Table
BD6886GUL I/O Truth Table
INPUT
OUTPUT
Input mode
PS SEL
INA
INB
OUTxA
OUTxB
L
X
Z
Z
EN/IN
L
H
L
H
L
H
H
L
H
H
H
Z
Z
H
H
L
H
L
IN/IN
H
L
H
L
H
L
L
L
L
L
X
X
X
Z
Z
L: Low, H: High, X: Don’t care, Z: High Impedance
The OUTPUTs are provided with feed back resistor. This is so that GND voltage will be output,
when the OUTPUT is “Z”.
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Operation Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range
(Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or
open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse
should be considered when use of the IC in a special mode where the absolute maximum ratings may be
exceeded is anticipated.
(2) Power supply lines
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the
power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full
consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose
some capacitance at low temperatures. If the connected power supply does not have sufficient current
absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined
with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply
and GND pins.
(3) Ground potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(5) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(6) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or
ASO.
(7) Thermal shutdown circuit
This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the
following temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or
guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of this circuit is assumed.
TSD ON temperature [°C]
Hysteresis temperature [°C]
(Typ.)
(Typ.)
175
25
(8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance
and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be
careful not to change the GND wiring pattern of any external components, either.
REV. A
Notice
Notes
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
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The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
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R1120A