Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 1/7 CYStech Electronics Corp. 1A Snubber Damping Rectifier QJL3, QJCTL3 Features • High current capability • Smoothly soft reverse recovery time (trr) • Low profile surface mounted package in order to minimize board space • Pb-free lead plating and halogen-free package Pinning Pin 1 2 3 Outline Description QJL3 QJCTL3 A A1 K K1, K2 NC A2 SOT-223 3 2 1 (1) QJL3 Marking: (2) QJCTL3 Type QJL3 QJCTL3 Marking Code QJ QJCT Diode configuration and symbol QJL3, QJCTL3 CYStek Product Specification Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 2/7 CYStech Electronics Corp. Ordering Information Device QJL3-0-T3-G QJCTL3-0-T3-G Package Shipping SOT-223 (Pb-free lead plating and halogen-free package) 2500 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Repetitive peak reverse voltage RMS voltage Continuous reverse voltage Forward rectified current Repetitive Peak Forward Current Forward surge current Power Dissipation Conditions Single phase half wave, 60Hz @TJ=25°C Single phase half wave, 60Hz @TJ=25°C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Symbol VRRM VRMS VR Value 600 420 600 Units V V V IF(AV) 1 A IFRM 1.57 A IFSM 10 A 0.8 1.2 3 3 -55~+150 -55~+150 PD (Note 1) (Note 2) Maximum reverse recovery time Storage temperature range Operating junction temperature range IF=0.5A, IR=1.0A, RR=0.25A trr Tstg Tj W μs °C °C Thermal Data Parameter Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-case, max Symbol (Note 1 ) Rth,j-a (Note 2 ) Rth,j-c Value 156 104 42 35 Unit °C/W Note: *1 When mounted on FR-4 PCB with area measuring 10×10×1 mm *2 When mounted on ceramic with area measuring 40×40×1 mm QJL3, QJCTL3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 3/7 Characteristics (TA=25°C, unless otherwise noted) Characteristic Symbol VR IR=100μA VF 1 VF 2 IR IR CJ Forward Voltage Reverse Leakage Current Junction Capacitance Condition IF=100mA IF=500mA VR=540V VR=540V, TA=125°C VR=1V, f=1MHz Min. Typ Max. Unit 600 - - V - 6 0.95 1.2 100 10 - V nA μA pF Typical Characteristics Power Derating Curves Forward Current vs Forward Voltage 1000 Power Dissipation---PD(W) 3 Instantaneous Forward Current---IF (mA) 3.5 See Note on page 2 2.5 2 1.5 1 0.5 0 125℃ 100 25°C 10 75°C Pulse width=300μs, 1% Duty cycle 1 0 50 100 150 200 0 Ambient Temperature ---Ta(℃ ) 0.4 0.6 0.8 1 1.2 1.4 Forward Voltage---VF(V) 1.6 1.8 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 10 Junction Capacitance---C J(pF) 1000 Reverse Leakage Current---I R (nA) 0.2 Tj=125℃ 100 Tj=75℃ 10 Tj=25℃ Tj=25℃, f=1.0MHz 1 1 0 100 200 300 400 500 Reverse Voltage---VR (V) QJL3, QJCTL3 600 700 0.1 1 10 100 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 4/7 Recommended soldering footprint QJL3, QJCTL3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 5/7 Reel Dimension Carrier Tape Dimension QJL3, QJCTL3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. QJL3, QJCTL3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211L3 Issued Date : 2013.07.19 Revised Date : 2014.12.19 Page No. : 7/7 SOT-223 Dimension A Marking: Device Code B Year code: 0→2010, 1→2011, 2→2012, …etc. C 1 2 3 □□□□ □□ month code: 1~9, A,B,C D E F H G Device Code : QJ for QJL3 QJCT for QJCTL3 a1 I a2 Style: QJM3 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 : Pin 1. Anode 2. Cathode 3. Not Connected QJCTM3: Pin 1. Anode 2. Cathode 3. Anode *: Typical Inches Min. Max. 0.1142 0.1220 0.2638 0.2874 0.1299 0.1457 0.0236 0.0315 *0.0906 0.2480 0.2638 DIM A B C D E F Millimeters Min. Max. 2.90 3.10 6.70 7.30 3.30 3.70 0.60 0.80 *2.30 6.30 6.70 DIM G H I a1 a2 Inches Min. Max. 0.0551 0.0709 0.0098 0.0138 0.0008 0.0039 *13o 0o 10 o Millimeters Min. Max. 1.40 1.80 0.25 0.35 0.02 0.10 o *13 0o 10 o Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. QJL3, QJCTL3 CYStek Product Specification