Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 1/7 CYStech Electronics Corp. Low Vcesat PNP Epitaxial Planar Transistor BTB1188M3R BVCEO IC RCESAT(typ) -30V -2A 0.22Ω Features • Low VCE(sat), VCE(sat)=-0.65 V (typical), at IC / IB = -3A / -0.1A • Excellent current gain characteristics • Complementary to BTD1766M3 • Pb-free lead plating and halogen-free package Symbol Outline BTB1188M3R SOT-89 B：Base C：Collector E：Emitter B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Power Dissipation Symbol Limits Unit VCBO VCEO VEBO IC ICP Pd -40 -30 -5 -2 -5 0.5 V V V A A W Pd 2 ESD susceptibility Operating Junction Temperature Range Storage Temperature Range (Note 2) 8000 (Note 3 ) Tj Tstg Note : 1. Single Pulse , Pw=10ms 2. When mounting on a 40 ×40 ×0.7 mm ceramic board. 3. Human body model, 1.5kΩ in series with 100pF BTA1797M3 (Note 1) -55~+150 -55~+150 W V °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 2/7 Thermal Performance Parameter Thermal Resistance, Junction-to-Ambient (Note) Thermal Resistance, Junction-to-Case Symbol RθJA RθJC Limit 62.5 18 Unit °C/W °C/W Note : When mounting on a 40 ×40 ×0.7 mm ceramic board; 250°C/W when mounted on minimum copper pad. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. -40 -30 -5 180 - Typ. 100 50 Max. -1 -1 -1 560 - Unit V V V μA μA V MHz pF Test Conditions IC=-50μA, IE=0 IC=-1mA, IB=0 IE=-50μA, IC=0 VCB=-20V, IE=0 VEB=-4V, IC=0 IC=-3A, IB=-0.1A VCE=-3V, IC=-0.5A VCE=-5V, IC=-0.1A, f=100MHz VCB=-10V, f =1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% Classification Of hFE Rank R S Range 180~390 270~560 Ordering Information Device BTB1188M3R-R-T2-G BTB1188M3R-S-T2-G HFE rank R S Package Shipping SOT-89 1000 pcs / Tape (Pb-free lead plating and halogen-free package) & Reel Recommended soldering footprint BTA1797M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 3/7 Typical Characteristics Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 1.6 0.4 Collector Current---IC(A) Collector Current---IC(A) 1.4 1mA 0.35 0.3 0.25 0.2 500uA 400uA 300uA 0.15 0.1 200uA IB=100uA 0.05 5mA 1.2 1 0.8 2.5mA 2mA 1.5mA 0.6 0.4 1mA 0.2 0 IB=500uA 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 0 6 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 4 5 50mA 20mA Collector Current---IC(A) Collector Current---IC(A) 4.5 3 10mA 2 6 8mA 6mA 4mA 1 IB=2mA 4 3.5 3 20mA 2.5 15mA 2 10mA 1.5 IB=5mA 1 0.5 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) Current Gain vs Collector Current 6 Saturation Voltage vs Collector Current 1000 10000 Saturation Voltage---(mV) Current Gain---HFE VCE=5V VCE=2V 100 VCE=1V 1000 100 VCESAT@IC=40IB 10 VCESAT=20IB VCESAT=10IB 10 1 1 BTB1188M3R 10 100 1000 Collector Current---IC(mA) 10000 1 10 100 1000 Collector Current---IC(mA) 10000 CYStek Product Specification Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 4/7 CYStech Electronics Corp. Typical Characteristics(Cont.) Power Derating Curves Saturation Voltage vs Collector Current 2.5 Power Dissipation---PD(W) Saturation Voltage---(mV) 10000 VBESAT@IC=10IB 1000 2 See note 2 on page 1 1.5 1 0.5 0 100 1 10 100 1000 Collector Current---IC(mA) 10000 0 50 100 150 200 Ambient Temperature---TA(℃) Capacitance vs Reverse-biased Voltage Capacitance---(pF) 1000 Cib 100 Cob 10 0.1 1 10 Reverse-biased Voltage---VR(V) 100 Recommended Storage Condition: Temperature : 10~ 35 °C Humidity : 30~ 60% RH BTB1188M3R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 5/7 Reel Dimension Carrier Tape Dimension BTB1188M3R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTB1188M3R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C623M3 Issued Date : 2003.05.25 Revised Date : 2013.08.12 Page No. : 7/7 SOT-89 Dimension Marking: A 2 1 3 Wafer code HFE rank Product Code H C month code: 1~9, A,B,C D B E Style: Pin 1. Base 2. Collector 3. Emitter I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G Inches Min. Max. 0.1732 0.1811 0.1551 0.1673 0.0610 REF 0.0906 0.1024 0.0126 0.0205 DIM A B C D E Millimeters Min. Max. 4.40 4.60 3.94 4.25 1.55 REF 2.30 2.60 0.32 0.52 DIM F G H I Inches Min. Max. 0.0591 TYP 0.1181 TYP 0.0551 0.0630 0.0138 0.0173 Millimeters Min. Max. 1.50 TYP 3.00 TYP 1.40 1.60 0.35 0.44 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTB1188M3R CYStek Product Specification