BTB1188M3R

Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 1/7
CYStech Electronics Corp.
Low Vcesat PNP Epitaxial Planar Transistor
BTB1188M3R
BVCEO
IC
RCESAT(typ)
-30V
-2A
0.22Ω
Features
• Low VCE(sat), VCE(sat)=-0.65 V (typical), at IC / IB = -3A / -0.1A
• Excellent current gain characteristics
• Complementary to BTD1766M3
• Pb-free lead plating and halogen-free package
Symbol
Outline
BTB1188M3R
SOT-89
B:Base
C:Collector
E:Emitter
B C E
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Power Dissipation
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
ICP
Pd
-40
-30
-5
-2
-5
0.5
V
V
V
A
A
W
Pd
2
ESD susceptibility
Operating Junction Temperature Range
Storage Temperature Range
(Note 2)
8000 (Note 3 )
Tj
Tstg
Note : 1. Single Pulse , Pw=10ms
2. When mounting on a 40 ×40 ×0.7 mm ceramic board.
3. Human body model, 1.5kΩ in series with 100pF
BTA1797M3
(Note 1)
-55~+150
-55~+150
W
V
°C
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 2/7
Thermal Performance
Parameter
Thermal Resistance, Junction-to-Ambient (Note)
Thermal Resistance, Junction-to-Case
Symbol
RθJA
RθJC
Limit
62.5
18
Unit
°C/W
°C/W
Note : When mounting on a 40 ×40 ×0.7 mm ceramic board; 250°C/W when mounted on minimum copper pad.
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
fT
Cob
Min.
-40
-30
-5
180
-
Typ.
100
50
Max.
-1
-1
-1
560
-
Unit
V
V
V
μA
μA
V
MHz
pF
Test Conditions
IC=-50μA, IE=0
IC=-1mA, IB=0
IE=-50μA, IC=0
VCB=-20V, IE=0
VEB=-4V, IC=0
IC=-3A, IB=-0.1A
VCE=-3V, IC=-0.5A
VCE=-5V, IC=-0.1A, f=100MHz
VCB=-10V, f =1MHz
*Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%
Classification Of hFE
Rank
R
S
Range
180~390
270~560
Ordering Information
Device
BTB1188M3R-R-T2-G
BTB1188M3R-S-T2-G
HFE rank
R
S
Package
Shipping
SOT-89
1000 pcs / Tape
(Pb-free lead plating and halogen-free package)
& Reel
Recommended soldering footprint
BTA1797M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 3/7
Typical Characteristics
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
1.6
0.4
Collector Current---IC(A)
Collector Current---IC(A)
1.4
1mA
0.35
0.3
0.25
0.2
500uA
400uA
300uA
0.15
0.1
200uA
IB=100uA
0.05
5mA
1.2
1
0.8
2.5mA
2mA
1.5mA
0.6
0.4
1mA
0.2
0
IB=500uA
0
0
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
0
6
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
4
5
50mA
20mA
Collector Current---IC(A)
Collector Current---IC(A)
4.5
3
10mA
2
6
8mA
6mA
4mA
1
IB=2mA
4
3.5
3
20mA
2.5
15mA
2
10mA
1.5
IB=5mA
1
0.5
0
0
0
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
6
0
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
Current Gain vs Collector Current
6
Saturation Voltage vs Collector Current
1000
10000
Saturation Voltage---(mV)
Current Gain---HFE
VCE=5V
VCE=2V
100
VCE=1V
1000
100
[email protected]=40IB
10
VCESAT=20IB
VCESAT=10IB
10
1
1
BTB1188M3R
10
100
1000
Collector Current---IC(mA)
10000
1
10
100
1000
Collector Current---IC(mA)
10000
CYStek Product Specification
Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 4/7
CYStech Electronics Corp.
Typical Characteristics(Cont.)
Power Derating Curves
Saturation Voltage vs Collector Current
2.5
Power Dissipation---PD(W)
Saturation Voltage---(mV)
10000
[email protected]=10IB
1000
2
See note 2 on page 1
1.5
1
0.5
0
100
1
10
100
1000
Collector Current---IC(mA)
10000
0
50
100
150
200
Ambient Temperature---TA(℃)
Capacitance vs Reverse-biased Voltage
Capacitance---(pF)
1000
Cib
100
Cob
10
0.1
1
10
Reverse-biased Voltage---VR(V)
100
Recommended Storage Condition:
Temperature : 10~ 35 °C
Humidity : 30~ 60% RH
BTB1188M3R
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 5/7
Reel Dimension
Carrier Tape Dimension
BTB1188M3R
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 6/7
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTB1188M3R
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C623M3
Issued Date : 2003.05.25
Revised Date : 2013.08.12
Page No. : 7/7
SOT-89 Dimension
Marking:
A
2
1
3
Wafer code
HFE rank
Product
Code
H
C
month code: 1~9,
A,B,C
D
B
E
Style: Pin 1. Base 2. Collector 3. Emitter
I
F
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
G
Inches
Min.
Max.
0.1732 0.1811
0.1551 0.1673
0.0610 REF
0.0906 0.1024
0.0126 0.0205
DIM
A
B
C
D
E
Millimeters
Min.
Max.
4.40
4.60
3.94
4.25
1.55 REF
2.30
2.60
0.32
0.52
DIM
F
G
H
I
Inches
Min.
Max.
0.0591 TYP
0.1181 TYP
0.0551 0.0630
0.0138 0.0173
Millimeters
Min.
Max.
1.50 TYP
3.00 TYP
1.40
1.60
0.35
0.44
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1188M3R
CYStek Product Specification