CYStech Electronics Corp. Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 1/1 Super Fast Surface Mount Rectifiers Reverse Voltage 50V to 1000V Forward Current 2.0A ES2A thru ES2J Features Outline • For surface mounted application • Low profile package • Built-in stain relief, ideal for automatic placement • Easy pick and place • Super fast recovery time for high efficiency • Glass passivated junction chip • High temperature soldering: 250°C/10 seconds at terminals • Plastic material used carries UL flammability classification 94V-0 DO-214AA (SMB) Mechanical Data • Case: SMB/DO-214AA molded plastic • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band • Weight: 0.093 gram approx. Ordering Information Device ES2X - 0-T6-G Package SMB (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T6 : 3000 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name ES2A thru ES2J CYStek Product Specification Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 2/2 CYStech Electronics Corp. Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. capacitive load, derate current by 20%. ) Parameter Symbol ES2A 50 35 50 Single phase, half wave, 60Hz, resistive or inductive load. ES2B 100 70 100 ES2C 150 105 150 Maximum repetitive peak reverse voltage VRRM Maximum RMS voltage VRMS Maximum DC blocking voltage VR Maximum instantaneous VF 0.95 forward voltage, IF=2A Maximum average forward rectified IF(AV) current, see Fig. 1 Peak forward surge current @8.3ms single half sine wave superimposed on rated load IFSM (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃ IR VR=VRRM,TA=100℃ Maximum reverse recovery time (Note 1) trr RθJA Typical thermal resistance RθJC TA=25°C Power dissipation PD TC=25°C Storage temperature range TSTG Operating junction temperature range TJ Note: 1.Reverse recovery test conditions : IF=0.5A, IR=1A, IRR=0.25A 2.P.C.B. mounted on 0.4”×0.4”(10mm×10mm) copper pad area. ES2A thru ES2J Type ES2D ES2F 200 300 140 210 200 300 ES2G 400 280 400 1.3 ES2H 500 350 500 1.7 ES2J 600 420 600 For Units V V V V 2 A 50 A 10 500 μA 35 75 (Note 2) 18 1.7 (Note 2) 7 -55 ~ +150 -55 ~ +150 ns °C/W W ℃ ℃ CYStek Product Specification CYStech Electronics Corp. Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 3/3 Typical Characteristics ES2A thru ES2J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 4/4 Reel Dimension Carrier Tape Dimension ES2A thru ES2J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 5/5 Recommended Footprint DIM A B C ES2A thru ES2J Inches Typ 0.142 0.059 0.118 Millimeters Typ 3.60 1.50 3.00 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 6/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. ES2A thru ES2J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C184SB Issued Date : 2013.06.04 Revised Date : 2015.05.06 Page No. : 7/7 SMB/DO-214AA Dimension Marking Code : Device ES2A Marking ES2A ES2B ES2B ES2C ES2C ES2D ES2D Device ES2F Marking ES2F ES2G ES2G ES2H ES2H ES2J ES2J SMB/DO-214AA Plastic Surface Mounted Package CYStek Package Code : SB *:Typical Inches Min. Max. 0.075 0.083 0.130 0.155 0.160 0.185 0.083 0.096 DIM A B C D Millimeters Min. Max. 1.91 2.11 3.30 3.94 4.06 4.70 2.13 2.44 DIM E F G H Inches Min. Max. 0.006 0.012 0.002 0.008 0.030 0.060 0.200 0.220 Millimeters Min. Max. 0.152 0.305 0.051 0.203 0.76 1.52 5.08 5.59 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. ES2A thru ES2J CYStek Product Specification