Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 1/13 CYStech Electronics Corp. N- AND P-Channel Enhancement Mode MOSFET MTC3585G6 BVDSS ID RDSON(TYP.) Features N-CH 20V 4.5A(VGS=4.5V) 27mΩ(VGS=4.5V) 37mΩ(VGS=2.5V) 82mΩ(VGS=1.5V) P-CH -20V -3A(VGS=-4.5 V) 78mΩ(VGS=-4.5V) 115mΩ(VGS=-2.5V) 280mΩ(VGS=-1.5V) • Simple drive requirement • Low gate charge • Low on-resistance • Fast switching speed • Pb-free lead plating and halogen-free package Equivalent Circuit Outline MTC3585G6 TSOP-6 D1 G：Gate S1 D2 S：Source D：Drain G1 S2 G2 Ordering Information Device MTC3585G6-0-T1-G Package TSOP-6 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel,7” reel Product rank, zero for no rank products Product name MTC3585G6 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 2/13 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Drain-Source Breakdown Voltage Gate-Source Voltage Continuous Drain Current @TA=25 °C (Note 1) Continuous Drain Current @TA=70 °C (Note 1) Pulsed Drain Current (Note 2) Total Power Dissipation (Note 1) Linear Derating Factor Operating Junction and Storage Temperature BVDSS VGS ID ID IDM Pd Tj, Tstg Limits N-channel P-channel 20 -20 ±12 ±12 4.5 -3 3.6 -2.4 20 -20 1.14 0.01 -55~+150 Unit V V A A A W W / °C °C Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec 2.Pulse width limited by maximum junction temperature N-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS IDSS *RDS(ON) Min. Typ. Max. Unit 20 0.5 - 0.02 0.7 27 37 82 7 1.2 ±100 1 10 40 50 105 - V V/°C V nA 423 50 48 6 8 11 10 6 0.8 2.5 - 0.77 16 8 1.2 - *GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Source-Drain Diode *VSD *trr *Qrr - Test Conditions S VGS=0, ID=250μA Reference to 25°C, ID=1mA VDS=VGS, ID=250μA VGS=±12V, VDS=0 VDS=20V, VGS=0 VDS=16V, VGS=0, Tj=70°C ID=3.5A, VGS=4.5V ID=1.2A, VGS=2.5V ID=0.5A, VGS=1.5V VDS=5V, ID=3A pF VDS=20V, VGS=0, f=1MHz ns VDS=15V, ID=1A, VGS=5V, RG=3.3Ω, RD=15Ω nC VDS=16V, ID=3A, VGS=4.5V V ns nC VGS=0V, IS=1.2A μA mΩ IS=3A, VGS=0V, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTC3585G6 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 3/13 P-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS Min. Typ. Max. Unit -20 - -0.01 -0.8 78 115 280 5 -1.2 ±100 -1 -25 105 150 350 - V V/°C V nA 429 45 41 6 17 16 5 6 0.8 2.4 - -0.82 20 15 -1.2 - IDSS *RDS(ON) *GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Source-Drain Diode *VSD *trr *Qrr - Test Conditions S VGS=0, ID=-250μA Reference to 25°C, ID=-1mA VDS=VGS, ID=-250μA VGS=±12V, VDS=0 VDS=-20V, VGS=0 VDS=-16V, VGS=0, Tj=70°C ID=-2.5A, VGS=-4.5V ID=-2A, VGS=-2.5V ID=-0.5A, VGS=-1.5V VDS=-5V, ID=-2A pF VDS=-20V, VGS=0, f=1MHz ns VDS=-10V, ID=-1A, VGS=-10V, RG=3.3Ω, RD=10Ω nC VDS=-16V, ID=-2A, VGS=-4.5V V ns nC VGS=0V, IS=-1.2A μA mΩ IS=-2A, VGS=0V, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol RθJC RθJA Value 80 110 (Note ) Note :.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec; 180°C/W when mounted on minimum copper pad MTC3585G6 Unit °C/W °C/W CYStek Product Specification Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 4/13 CYStech Electronics Corp. N-channel Typical Characteristics Brekdown Voltage vs Ambient Temperature Typical Output Characteristics 1.4 20 BVDSS, Normalized Drain-Source Breakdown Voltage 4.5V, 3.5V, 3V, 2.5V ID, Drain Current(A) 16 VGS=2V 12 8 VGS=1.5V 4 1.2 1 0.8 ID=250μA, VGS=0V 0.6 0.4 0 0 1 2 3 4 -75 5 -50 -25 VDS , Drain-Source Voltage(V) Static Drain-Source On-State resistance vs Drain Current 50 75 100 125 150 175 1.2 VGS=1.5V VSD, Source-Drain Voltage(V) R DS(on), Static Drain-Source On-State Resistance(mΩ) 25 Reverse Drain Current vs Source-Drain Voltage 1000 VGS=2.5V 100 VGS=2.5V VGS=4.5V 0.01 0.1 1 10 ID, Drain Current(A) VGS=0V 1 Tj=25°C 0.8 0.6 0.4 0 100 1 2 3 4 IDR , Reverse Drain Current(A) 5 Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage 200 R DS(on), Normalized Static DrainSource On-State Resistance 1.8 180 ID=3.5A 160 140 120 100 80 60 40 20 VGS=4.5V, ID=3.5A 1.6 1.4 1.2 1 0.8 RDS(ON) @Tj=25°C :27mΩ 0.6 0.4 0 0 MTC3585G6 Tj=150°C 0.2 10 R DS(on), Static Drain-Source OnState Resistance(mΩ) 0 Tj, Junction Temperature(°C) 1 2 3 4 VGS, Gate-Source Voltage(V) 5 -60 -20 20 60 100 140 Tj, Junction Temperature(°C) 180 CYStek Product Specification Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 5/13 CYStech Electronics Corp. N-channel Typical Characteristics(Cont.) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage VGS(th), NormalizedThreshold Voltage Capacitance---(pF) 1000 Ciss 100 C oss Crss 1.6 ID=250μA 1.4 1.2 1 0.8 0.6 0.4 10 0.1 1 10 VDS, Drain-Source Voltage(V) -60 -40 -20 100 60 80 100 120 140 160 Gate Charge Characteristics 50 10 VGS, Gate-Source Voltage(V) TJ(MAX) =150°C TA=25°C θJA=110°C/W 40 Power (W) 20 40 Tj, Junction Temperature(°C) Single Pulse Power Rating, Junction to Ambient 30 20 10 0 0.001 8 VDS=16V 6 VDS=10V 4 2 ID=3A 0 0.01 0.1 1 Pulse Width(s) 10 0 100 ID, Maximum Drain Current(A) 100μs RDS(ON) Limited 1 10ms 100ms 0.01 0.01 TA=25°C, Tj=150°C, VGS=10V, RθJA=110°C/W Single Pulse DC 8 10 12 4.5 4 3.5 3 2.5 2 1.5 1 TA=25°C, VGS=10V, RθJA=110°C/W 0.5 0 0.1 1 10 VDS, Drain-Source Voltage(V) MTC3585G6 6 5 1ms 0.1 4 Maximum Drain Current vs JunctionTemperature 100 10 2 Qg, Total Gate Charge(nC) Maximum Safe Operating Area ID, Drain Current(A) 0 100 25 50 75 100 125 150 Tj, Junction Temperature(°C) 175 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 6/13 N-channel Typical Characteristics(Cont.) Transient Thermal Response Curves 1 Normalized Transient Thermal Resistance D=0.5 0.2 0.1 0.1 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t 1/t2 3.TJM-TA=PDM*ZθJA(t) 4.RθJA=11 0°C/W 0.05 0.02 0.01 0.01 Single Pulse 0.001 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 t1, Square Wave Pulse Duration(s) MTC3585G6 CYStek Product Specification Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 7/13 CYStech Electronics Corp. P-channel Typical Characteristics Brekdown Voltage vs Ambient Temperature Typical Output Characteristics 1.6 20 -VGS=4V 16 -ID, Drain Current (A) -BVDSS, Normalized Drain-Source Breakdown Voltage -VGS=5V 12 -VGS=3V 8 -VGS=2V 4 1.4 1.2 1 0.8 ID=-250μA, VGS=0V 0.6 -VGS=1V 0.4 0 0 1 2 3 4 -VDS, Drain-Source Voltage(V) -75 -50 -25 5 Static Drain-Source On-State resistance vs Drain Current Reverse Drain Current vs Source-Drain Voltage 1.2 VGS=-1.5V -VSD, Source-Drain Voltage(V) R DS(on) , Static Drain-Source On-State Resistance(mΩ) 1000 100 VGS=-2V VGS=-2.5V VGS=-4.5V Tj=25°C VGS=0V 1 0.8 Tj=150°C 0.6 0.4 0.2 10 0.01 0.1 1 -ID, Drain Current(A) 0 10 300 4 6 8 -IDR, Reverse Drain Current (A) 10 R DS(ON) , Normalized Static DrainSource On-State Resistance 1.6 ID=-2.5A 250 200 150 100 50 VGS=-4.5V, ID=-2.5A 1.4 1.2 1 0.8 0.6 RDS(ON) @Tj=25°C : 79mΩ 0.4 0 0 MTC3585G6 2 Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage R DS(ON) , Static Drain-Source OnState Resistance(mΩ) 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) 1 2 3 4 -VGS, Gate-Source Voltage(V) 5 -60 -20 20 60 100 140 Tj, Junction Temperature(°C) 180 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 8/13 P-channel Typical Characteristics(Cont.) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage -VGS(th) ,Normalized Threshold Voltage 1000 Capacitance---(pF) Ciss 100 C oss Crss 1.4 ID=-250μA 1.2 1 0.8 0.6 0.4 10 0.1 1 10 -VDS, Drain-Source Voltage(V) -60 -40 -20 100 0 20 40 60 80 100 120 140 160 Tj, Junction Temperature(°C) Single Pulse Power Rating, Junction to Ambient Gate Charge Characteristics 50 10 Power (W) -VGS, Gate-Source Voltage(V) ID=-2A 40 TJ(MAX) =150°C TA=25°C θJA=110°C/W 30 20 10 0 0.001 8 6 VDS=-10V 4 VDS=-16V 2 0 0.01 0.1 1 Pulse Width(s) 10 0 100 Maximum Safe Operating Area 4 6 8 Qg, Total Gate Charge(nC) 10 12 Maximum Drain Current vs JunctionTemperature 100 3.5 RDS(ON) Limited 10 -ID, Maximum Drain Current(A) -ID, Drain Current (A) 2 100μs 1ms 1 10ms 100ms 0.1 TA=25°C, Tj=150°C, VGS=-10V, RθJA=110°C/W Single Pulse DC 3 2.5 2 1.5 1 TA=25°C, VGS=-10V, RθJA=110°C/W 0.5 0 0.01 0.01 MTC3585G6 0.1 1 10 -VDS, Drain-Source Voltage(V) 100 25 50 75 100 125 Tj, Junction Temperature(°C) 150 175 CYStek Product Specification Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 9/13 CYStech Electronics Corp. P-channel Typical Characteristics(Cont.) Transient Thermal Response Curves 1 Normalized Transient Thermal Resistance D=0.5 0.2 0.1 0.1 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TA=PDM*ZθJA(t) 4.RθJA=110 °C/W 0.05 0.02 0.01 0.01 Single Pulse 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, Square Wave Pulse Duration(s) Recommended Soldering Footprint MTC3585G6 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 10/13 Reel Dimension MTC3585G6 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 11/13 Carrier Tape Dimension MTC3585G6 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 12/13 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTC3585G6 CYStek Product Specification Spec. No. : C416G6 Issued Date : 2007.07.13 Revised Date :2013.11.13 Page No. : 13/13 CYStech Electronics Corp. TSOP-6 Dimension Marking: Style: Pin 1. Gate1 (G1) Pin 2. Source2 (S2) Pin 3. Gate2 (G2) Pin 4. Drain2 (D2) Pin 5. Source1 (S1) Pin 6. Drain1 (D1) ● 3585 □□□□ Device Name Date Code 6-Lead TSOP-6 Plastic Surface Mounted Package CYStek Package Code: G6 Inches Min. Max. 0.1063 0.1220 0.1024 0.1181 0.0551 0.0709 0.0748 REF 0.0374 REF 0.0374 REF 0.0118 0.0197 0.0276 0.0394 DIM A B C D d1 d2 E F Millimeters Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.90 REF 0.95 REF 0.95 REF 0.30 0.50 0.70 1.00 DIM G H I J K L M Inches Min. Max. 0 0.0039 0.0098 0.0047 REF 0.0177 REF 0.0236 REF 0° 10° 0.0433 Millimeters Min. Max. 0 0.10 0.25 0.12 REF 0.45 REF 0.60 REF 0° 10° 1.10 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead :Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTC3585G6 CYStek Product Specification