CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 1/7 Low Vcesat PNP Epitaxial Planar Transistor BTA1664M3 Features • Low VCE(sat), VCE(sat)=-0.24V (typical), at IC / IB =- 500mA /- 20mA • Pb-free lead plating and halogen-free package Symbol Outline BTA1664M3 SOT-89 B：Base C：Collector E：Emitter B C E Ordering Information Device BTA1664M3-X-T2-G Package SOT-89 (Pb-free lead plating and halogen-free package) Shipping 1000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T2 :1000 pcs/tape & reel, 7” reel Product rank, zero for no rank products Product name BTA1664M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 2/7 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current(DC) Peak Collector Current Peak Base Current Symbol VCBO VCEO VEBO IC ICM IBM Power Dissipation PD Thermal Resistance, Junction to Ambient RθJA Thermal Resistance, Junction to Case Operating Junction and Storage Temperature Range RθJC Tj;Tstg Limits -50 -35 -7 -2 -4 -200 0.6 1.5 2.1 208 83.3 59.5 39 -55~+150 Unit V V V A A mA *1 W *2 *3 *2 *3 °C/W °C Note :1 Single pulse, Pw=10ms 2 When mounted on 25mm×25mm×1.6 mm FR-4 PCB with high coverage of single sided 1 oz copper, in still air condition 3 When mounted on 50mm×50mm×1.6 mm FR-4 PCB with high coverage of single sided 1 oz copper, in still air condition Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(on) *hFE 1 *hFE 2 fT Cob Min. -50 -35 -7 -0.5 120 40 - Typ. -0.24 120 19 Max. -100 -100 -0.4 -0.5 -0.8 390 - Unit V V V nA nA V V V MHz pF Test Conditions IC=-50μA, IE=0 IC=-1mA, IB=0 IE=-50μA, IC=0 VCB=-50V, IE=0 VEB=-7V, IC=0 IC=-500mA, IB=-20mA IC=-800mA, IB=-80mA VCE=-1V, IC=-10mA VCE=-1V, IC=-100mA VCE=-1V, IC=-800mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% Classification of hFE 1 Rank Range BTA1664M3 Q 120~270 R 180~390 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 3/7 Recommended soldering footprint BTA1664M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 4/7 Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 VCE(SAT) VCE=3V Saturation Voltage---(mV) Current Gain---HFE HFE 100 VCE=1V 100 IC=25IB IC=10IB 10 10 1 10 100 1 1000 100 1000 Collector Current---IC(mA) Collector Current---IC(mA) Saturation Voltage vs Collector Current On Voltage vs Collector Current 10000 1000 On Voltage---(mV) Saturation Voltage---(mV) 10 1000 VBESAT@IC=10IB VBEON@VCE=1V 100 100 1 10 100 1000 Collector Current---IC(mA) 1 10 100 1000 Collector Current---IC(mA) Power Derating Curves Power Dissipation---PD(W) 2.5 2 See n ote 3 on page 1 See note 2 on page 1 1.5 1 0.5 0 0 50 100 150 200 Ambient Temperature---TA(℃) BTA1664M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 5/7 Reel Dimension Carrier Tape Dimension BTA1664M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTA1664M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315M3 Issued Date : 2005.01.25 Revised Date : 2014.02.14 Page No. : 7/7 SOT-89 Dimension Marking: A 2 1 3 Year code : 6→2006, 7→2007,… HFE rank Product Code H C month code: 1~9, A,B,C D B Style: Pin 1. Base 2. Collector 3. Emitter E I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G Inches Min. Max. 0.1732 0.1811 0.1551 0.1673 0.0610 REF 0.0906 0.1024 0.0126 0.0205 DIM A B C D E Millimeters Min. Max. 4.40 4.60 3.94 4.25 1.55 REF 2.30 2.60 0.32 0.52 DIM F G H I Inches Min. Max. 0.0591 TYP 0.1181 TYP 0.0551 0.0630 0.0138 0.0173 Millimeters Min. Max. 1.50 TYP 3.00 TYP 1.40 1.60 0.35 0.44 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA1664M3 CYStek Product Specification