BTA1664M3

CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 1/7
Low Vcesat PNP Epitaxial Planar Transistor
BTA1664M3
Features
• Low VCE(sat), VCE(sat)=-0.24V (typical), at IC / IB =- 500mA /- 20mA
• Pb-free lead plating and halogen-free package
Symbol
Outline
BTA1664M3
SOT-89
B:Base
C:Collector
E:Emitter
B C E
Ordering Information
Device
BTA1664M3-X-T2-G
Package
SOT-89
(Pb-free lead plating and halogen-free package)
Shipping
1000 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T2 :1000 pcs/tape & reel, 7” reel
Product rank, zero for no rank products
Product name
BTA1664M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 2/7
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current(DC)
Peak Collector Current
Peak Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IBM
Power Dissipation
PD
Thermal Resistance, Junction to Ambient
RθJA
Thermal Resistance, Junction to Case
Operating Junction and Storage Temperature Range
RθJC
Tj;Tstg
Limits
-50
-35
-7
-2
-4
-200
0.6
1.5
2.1
208
83.3
59.5
39
-55~+150
Unit
V
V
V
A
A
mA
*1
W
*2
*3
*2
*3
°C/W
°C
Note :1 Single pulse, Pw=10ms
2 When mounted on 25mm×25mm×1.6 mm FR-4 PCB with high coverage of single sided 1 oz copper, in still air condition
3 When mounted on 50mm×50mm×1.6 mm FR-4 PCB with high coverage of single sided 1 oz copper, in still air condition
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VCE(sat)
*VBE(on)
*hFE 1
*hFE 2
fT
Cob
Min.
-50
-35
-7
-0.5
120
40
-
Typ.
-0.24
120
19
Max.
-100
-100
-0.4
-0.5
-0.8
390
-
Unit
V
V
V
nA
nA
V
V
V
MHz
pF
Test Conditions
IC=-50μA, IE=0
IC=-1mA, IB=0
IE=-50μA, IC=0
VCB=-50V, IE=0
VEB=-7V, IC=0
IC=-500mA, IB=-20mA
IC=-800mA, IB=-80mA
VCE=-1V, IC=-10mA
VCE=-1V, IC=-100mA
VCE=-1V, IC=-800mA
VCE=-5V, IC=-10mA, f=100MHz
VCB=-10V, f=1MHz
*Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%
Classification of hFE 1
Rank
Range
BTA1664M3
Q
120~270
R
180~390
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 3/7
Recommended soldering footprint
BTA1664M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 4/7
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
1000
VCE(SAT)
VCE=3V
Saturation Voltage---(mV)
Current Gain---HFE
HFE
100
VCE=1V
100
IC=25IB
IC=10IB
10
10
1
10
100
1
1000
100
1000
Collector Current---IC(mA)
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
On Voltage vs Collector Current
10000
1000
On Voltage---(mV)
Saturation Voltage---(mV)
10
1000
[email protected]=10IB
[email protected]=1V
100
100
1
10
100
1000
Collector Current---IC(mA)
1
10
100
1000
Collector Current---IC(mA)
Power Derating Curves
Power Dissipation---PD(W)
2.5
2
See n ote 3 on page 1
See note 2 on page 1
1.5
1
0.5
0
0
50
100
150
200
Ambient Temperature---TA(℃)
BTA1664M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 5/7
Reel Dimension
Carrier Tape Dimension
BTA1664M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 6/7
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTA1664M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C315M3
Issued Date : 2005.01.25
Revised Date : 2014.02.14
Page No. : 7/7
SOT-89 Dimension
Marking:
A
2
1
3
Year code :
6→2006,
7→2007,…
HFE rank
Product
Code
H
C
month code: 1~9,
A,B,C
D
B
Style: Pin 1. Base 2. Collector 3. Emitter
E
I
F
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
G
Inches
Min.
Max.
0.1732 0.1811
0.1551 0.1673
0.0610 REF
0.0906 0.1024
0.0126 0.0205
DIM
A
B
C
D
E
Millimeters
Min.
Max.
4.40
4.60
3.94
4.25
1.55 REF
2.30
2.60
0.32
0.52
DIM
F
G
H
I
Inches
Min.
Max.
0.0591 TYP
0.1181 TYP
0.0551 0.0630
0.0138 0.0173
Millimeters
Min.
Max.
1.50 TYP
3.00 TYP
1.40
1.60
0.35
0.44
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA1664M3
CYStek Product Specification