CYStech Electronics Corp. Spec. No. : C309A3 Issued Date : 2003.06.30 Revised Date : 2011.12.13 Page No. : 1/6 High Voltage PNP Epitaxial Planar Transistor MPSA94 Description • High breakdown voltage. (BVCEO=-400V) • Low saturation voltage, typically VCE(sat) = -0.08V at Ic/IB =-10mA/-1mA. • Wide SOA (safe operation area). • Complementary to MPSA44. • Pb-free lead plating and halogen-free package. Symbol Outline MPSA94 TO-92 B：Base C：Collector E：Emitter EBC Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature MPSA94 Symbol Limits Unit VCBO VCEO VEBO IC PD RθJA Tj Tstg -400 -400 -6 -300 625 200 150 -55~+150 V V V mA mW °C/W °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C309A3 Issued Date : 2003.06.30 Revised Date : 2011.12.13 Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES VCE(sat) 1 *VCE(sat) 2 *VCE(sat) 3 *VBE(sat) hFE 1 *hFE 2 *hFE 3 *hFE 4 Cob Min. -400 -400 -6 70 82 50 40 - Typ. -0.08 -0.12 - Max. -10 -10 -10 -0.2 -0.3 -0.6 -0.9 270 8 Unit V V V μA μA μA V V V V pF Test Conditions IC=-50μA IC=-1mA IE=-50μA VCB=-400V VEB=-6V VCE=-400V, VBE=0V IC=-1mA, IB=-0.1mA IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-20mA, IB=-2mA VCE=-10V, IC=-1mA VCE=-10V, IC=-10mA VCE=-10V, IC=-50mA VCE=-10V, IC=-100mA VCB=-10V, IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Classification Of hFE 2 Rank P Q Range 82~180 120~270 Ordering Information Device MPSA94, T/B MPSA94, bulk MPSA94 Package Shipping TO-92 2000 pcs / Tape & Box (Pb-free lead plating and halogen-free) TO-92 1000 pcs/ bag, 10 bags/box, 10boxes/carton (Pb-free lead plating and halogen-free) CYStek Product Specification Spec. No. : C309A3 Issued Date : 2003.06.30 Revised Date : 2011.12.13 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Current Gain vs Collector Current Saturation Voltage vs Collector Current 10000 Saturation Voltage-(mV) Current Gain--- HFE 1000 VCE=10V 100 VCESAT 1000 IC=30IB 100 VCE=5V IC=10IB 10 IC=20IB 10 1 10 100 1000 1 10 Collector Current ---IC(mA) Collector Current ---IC(mA) 100 Capacitance Characteristics Saturation Voltage vs Collector Current 1000 10000 VBESAT@IC=10IB Capacitance-(pF) Saturation Voltage-(mV) f=1MHz 1000 Cib 100 10 Cob 1 100 1 10 100 0.1 1000 1 10 100 Reverse-bised Voltage---(V) Collector Current--- IC(mA) Transition Frequency vs Collector Current Power Derating Curve 100 Power Dissipation---PD(mW) Transiition Frequency---fT(MHz) 700 VCE=10V 600 500 400 300 200 100 0 10 1 MPSA94 10 Collector Current--- IC(mA) 100 0 50 100 150 200 Ambient Temperature---TA(℃) CYStek Product Specification Spec. No. : C309A3 Issued Date : 2003.06.30 Revised Date : 2011.12.13 Page No. : 4/6 CYStech Electronics Corp. TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 Note : All temperatures refer to topside of the package, measured on the package body surface. MPSA94 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C309A3 Issued Date : 2003.06.30 Revised Date : 2011.12.13 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature MPSA94 Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. CYStek Product Specification CYStech Electronics Corp. Spec. No. : C309A3 Issued Date : 2003.06.30 Revised Date : 2011.12.13 Page No. : 6/6 TO-92 Dimension Marking: α2 A Product Name A94 B □□ 1 2 3 Date Code: Year+Month Year: 0→2010, 1→2011 α3 Month: 1→1, 2→2, ‧‧‧, C D 9→9, A→10, B→11, C→12 H I G α1 Style: Pin 1.Emitter 2.Base 3.Collector E F 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MPSA94 CYStek Product Specification