MPSA94

CYStech Electronics Corp.
Spec. No. : C309A3
Issued Date : 2003.06.30
Revised Date : 2011.12.13
Page No. : 1/6
High Voltage PNP Epitaxial Planar Transistor
MPSA94
Description
• High breakdown voltage. (BVCEO=-400V)
• Low saturation voltage, typically VCE(sat) = -0.08V at Ic/IB =-10mA/-1mA.
• Wide SOA (safe operation area).
• Complementary to MPSA44.
• Pb-free lead plating and halogen-free package.
Symbol
Outline
MPSA94
TO-92
B:Base
C:Collector
E:Emitter
EBC
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
MPSA94
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
PD
RθJA
Tj
Tstg
-400
-400
-6
-300
625
200
150
-55~+150
V
V
V
mA
mW
°C/W
°C
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C309A3
Issued Date : 2003.06.30
Revised Date : 2011.12.13
Page No. : 2/6
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
ICES
VCE(sat) 1
*VCE(sat) 2
*VCE(sat) 3
*VBE(sat)
hFE 1
*hFE 2
*hFE 3
*hFE 4
Cob
Min.
-400
-400
-6
70
82
50
40
-
Typ.
-0.08
-0.12
-
Max.
-10
-10
-10
-0.2
-0.3
-0.6
-0.9
270
8
Unit
V
V
V
μA
μA
μA
V
V
V
V
pF
Test Conditions
IC=-50μA
IC=-1mA
IE=-50μA
VCB=-400V
VEB=-6V
VCE=-400V, VBE=0V
IC=-1mA, IB=-0.1mA
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-20mA, IB=-2mA
VCE=-10V, IC=-1mA
VCE=-10V, IC=-10mA
VCE=-10V, IC=-50mA
VCE=-10V, IC=-100mA
VCB=-10V, IE=0A,f=1MHz
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Classification Of hFE 2
Rank
P
Q
Range
82~180
120~270
Ordering Information
Device
MPSA94, T/B
MPSA94, bulk
MPSA94
Package
Shipping
TO-92
2000 pcs / Tape & Box
(Pb-free lead plating and halogen-free)
TO-92
1000 pcs/ bag, 10 bags/box, 10boxes/carton
(Pb-free lead plating and halogen-free)
CYStek Product Specification
Spec. No. : C309A3
Issued Date : 2003.06.30
Revised Date : 2011.12.13
Page No. : 3/6
CYStech Electronics Corp.
Typical Characteristics
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
10000
Saturation Voltage-(mV)
Current Gain--- HFE
1000
VCE=10V
100
VCESAT
1000
IC=30IB
100
VCE=5V
IC=10IB
10
IC=20IB
10
1
10
100
1000
1
10
Collector Current ---IC(mA)
Collector Current ---IC(mA)
100
Capacitance Characteristics
Saturation Voltage vs Collector Current
1000
10000
[email protected]=10IB
Capacitance-(pF)
Saturation Voltage-(mV)
f=1MHz
1000
Cib
100
10
Cob
1
100
1
10
100
0.1
1000
1
10
100
Reverse-bised Voltage---(V)
Collector Current--- IC(mA)
Transition Frequency vs Collector Current
Power Derating Curve
100
Power Dissipation---PD(mW)
Transiition Frequency---fT(MHz)
700
VCE=10V
600
500
400
300
200
100
0
10
1
MPSA94
10
Collector Current--- IC(mA)
100
0
50
100
150
200
Ambient Temperature---TA(℃)
CYStek Product Specification
Spec. No. : C309A3
Issued Date : 2003.06.30
Revised Date : 2011.12.13
Page No. : 4/6
CYStech Electronics Corp.
TO-92 Taping Outline
H2
H2A H2A
H2
D2
A
L
H3
H4 H
L1
H1
D1
F1F2
T2
T
T1
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
P1
P
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
W1
W
D
P2
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
Note : All temperatures refer to topside of the package, measured on the package body surface.
MPSA94
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C309A3
Issued Date : 2003.06.30
Revised Date : 2011.12.13
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
MPSA94
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C309A3
Issued Date : 2003.06.30
Revised Date : 2011.12.13
Page No. : 6/6
TO-92 Dimension
Marking:
α2
A
Product Name
A94
B
□□
1
2
3
Date Code: Year+Month
Year: 0→2010, 1→2011
α3
Month: 1→1, 2→2, ‧‧‧,
C
D
9→9, A→10, B→11, C→12
H
I
G
α1
Style: Pin 1.Emitter 2.Base 3.Collector
E
F
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MPSA94
CYStek Product Specification