CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2011.02.22 Page No. : 1/6 General Purpose NPN Epitaxial Planar Transistors (dual transistors) HBN2412S6R Features • Two BTC2412 chips in a SOT-363R package. • Mounting possible with SOT-323 automatic mounting machines. • Transistor elements are independent, eliminating interference. • Mounting cost and area can be cut in half. • Low Cob. Typ. Cob=2.0pF. • Complementary to HBP1037S6R. • Pb-free package. Equivalent Circuit Outline HBN2412S6R Tr1 SOT-363R Tr2 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC Pd Tj Tstg Limits 60 50 6 200 200(total) (Note) 150 -55~+150 Unit V V V mA mW °C °C Note : 150mW per element must not be exceeded. HBN2412S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2011.02.22 Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO VCE(sat) VBE(sat) hFE hFE fT Cob Min. 60 50 6 200 25 300 - Typ. - Max. 100 100 0.3 1 560 4 Unit V V V nA nA V V MHz pF Test Conditions IC=100μA IC=1mA IE=50μA VCB=60V VEB=5V IC=100mA, IB=10mA IC=100mA, IB=10mA VCE=6V, IC=1mA VCE=6V, IC=150mA VCE=20V, IC=10mA, f=100MHz VCB=5V, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device HBN2412S6R HBN2412S6R Package SOT-363 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel MA CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2011.02.22 Page No. : 3/6 Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 VCE(SAT)@IC=10IB Saturation Voltage---(mV) Current Gain---HFE HFE@VCE=1V 100 100 10 10 0.1 1 10 100 1000 0.1 Collector Current ---IC(mA) Saturation Voltage vs Collector Current 1000 Cutoff Frequency vs Collector Current 10000 1000 Cutoff Frequency---FT(MHZ) Saturation Voltage---(mV) 1 10 100 Collector Current---IC(mA) VBE(SAT)@IC=10IB 1000 FT@VCE=12V 100 10 100 0.1 1 10 100 Collector Current ---IC(mA) 1000 0.1 1 10 100 Collector Current --- IC(mA) Power Derating Curves Power Dissipation---PD(mW) 250 200 150 Dual 100 Single 50 0 0 HBN2412S6R 50 100 150 Ambient Temperature ---Ta(℃ ) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2011.02.22 Page No. : 4/6 Reel Dimension Carrier Tape Dimension HBN2412S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2011.02.22 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature HBN2412S6R Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2011.02.22 Page No. : 6/6 SOT-363 Dimension Marking: Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan 2→Feb, …, 9→ Sep, A→Oct, B →Nov, C→Dec MA Device Code 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Millimeters Min. Max. 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.080 0.150 2.000 2.200 1.150 1.350 DIM A A1 A2 b c D E Inches Min. Max. 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.003 0.006 0.079 0.087 0.045 0.053 DIM E1 e e1 L L1 θ Millimeters Min. Max. 2.150 2.450 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Inches Min. Max. 0.085 0.096 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBN2412S6R CYStek Product Specification