Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 1/7 CYStech Electronics Corp. PNP Epitaxial Planar High Current (High Performance) Transistor BTP955L3 Features • 4 Amps continuous current, up to 10 Amps peak current • Very low saturation voltage • Excellent gain characteristics specified up to 3 Amps • Ptot=3Watts • Extremely low equivalent on resistance, RCE(SAT)=90mΩ at 3A • Pb-free lead plating and halogen-free package Symbol Outline BTP955L3 SOT-223 C E B：Base C：Collector E：Emitter C B Ordering Information Device BTP955L3-X-T3-G Package SOT-223 (Pb-free lead plating and halogen-free package) Shipping 2500 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name BTP955L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 2/7 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Collector Current Base Current Power Dissipation @TA=25°C ESD susceptibility Operating and Storage Temperature Range Symbol VCBO VCEO VEBO IC ICP IB Pd Tj ; Tstg Limits -180 -140 -6 -4 -10 -1 3 (Note 1) 4000 (Note 2) -55 ~ +150 Unit V V V A A A W V °C Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol RθJC RθJA Value 12.5 41 (Note 1) Unit °C/W °C/W Note: 1.The power which can be dissipated assuming the device is mounted in a typical manner on a P.C.B. with copper equal to 4 square inch minimum. 2.Human body model, 1.5kΩ in series with 100pF Characteristics (Ta=25°C, unless otherwise specified) Symbol BVCBO BVCER *BVCEO BVEBO ICBO ICER IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VCE(sat)4 *VBE(sat) *VBE(on) hFE1 hFE2 *hFE3 *hFE4 fT Cob ton toff Min. -180 -180 -140 -6 100 100 75 - Typ. -210 -210 -170 -8 -40 -70 -110 -270 -930 -830 200 200 140 10 110 40 68 1030 Max. -50 -50 -10 -60 -120 -150 -370 -1110 -950 300 - Unit V V V V nA nA nA mV mV mV mV mV mV MHz pF ns ns Test Conditions IC=-100μA IC=-1μA, RBE≤1kΩ IC=-10mA IE=-100μA VCB=-150V VCE=-150V, RBE≤1kΩ VEB=-6V IC=-100mA, IB=-5mA IC=-500mA, IB=-50mA IC=-1A, IB=-100mA IC=-3A, IB=-300mA IC=-3A, IB=-300mA VCE=-5V, IC=-3A VCE=-5V, IC=-10mA VCE=-5V, IC=-1A VCE=-5V, IC=-3A VCE=-5V, IC=-10A VCE=-10V, IC=-100mA, f=50MHz VCB=-20V, f=1MHz IC=-1A, IB1=-100mA, IB2=100mA, VCC=-50V *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% BTP955L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 3/7 Recommended soldering footprint BTP955L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 4/7 Typical Characteristics Current Gain vs Collector Current Saturation Voltage vs Collector Current 10000 Saturation Voltage---(mV) Current Gain---HFE 1000 100 VCE=5V VCE=1V 10 VCE(SAT) 1000 IC=50IB IC=20IB 100 IC=10IB 10 1 10 100 1000 10000 1 10 Collector Current---IC(mA) 10000 On Vottage vs Collector Current 10000 VBE(SAT) @ IC=10IB On Voltage---(mV) Saturation Voltage---(mV) 1000 Collector Current---IC(mA) Saturation Voltage vs Collector Current 10000 100 1000 100 VBE(ON)@VCE=5V 1000 100 1 10 100 1000 10000 Collector Current---IC(mA) 1 10 100 1000 10000 Collector Current---IC(mA) Power Derating Curve Power Dissipation---PD(W) 3.5 3 2.5 2 1.5 1 0.5 0 0 50 100 150 200 Ambient Temperature---TA(℃) BTP955L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 5/7 Reel Dimension Carrier Tape Dimension BTP955L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTP955L3 CYStek Product Specification Spec. No. : C607L3 Issued Date : 2005.02.04 Revised Date : 2013.10.31 Page No. : 7/7 CYStech Electronics Corp. SOT-223 Dimension A Marking: Device Code B 955 C 1 2 3 Year Code: 5→2005, 6→2006, 7→2007,…,etc D E F H G Month Code: 1→Jan,2→ Feb,3→Mar, …, 9→Sep, A→Oct, B→ Nov, C→ Dec Style: Pin 1.Base 2.Collector 3.Emitter a1 I a2 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 *: Typical Inches Min. Max. 0.1142 0.1220 0.2638 0.2874 0.1299 0.1457 0.0236 0.0315 *0.0906 0.2480 0.2638 DIM A B C D E F Millimeters Min. Max. 2.90 3.10 6.70 7.30 3.30 3.70 0.60 0.80 *2.30 6.30 6.70 DIM G H I a1 a2 Inches Min. Max. 0.0551 0.0709 0.0098 0.0138 0.0008 0.0039 *13o 0o 10 o Millimeters Min. Max. 1.40 1.80 0.25 0.35 0.02 0.10 *13o 0o 10 o Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTP955L3 CYStek Product Specification