CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 1/5 1.0Amp. Surface Mount Schottky Barrier Diodes SK12SB thru SK1BSB Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications. • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0. • Low leakage current. • High surge capability. • High temperature soldering: 250°C/10 seconds at terminals. • Exceeds environmental standards of MIL-S-19500/228. Mechanical Data • Case: Molded plastic, JEDEC DO-214AA/SMB. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026. • Polarity: Indicated by cathode band. • Mounting position: Any. • Weight: 0.093 gram. Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward Voltage @ IF=1A (Note 1) Maximum average forward rectified current @ TL=100°C Peak forward surge current @ 8.3ms, single half sine-wave superimposed on rated load (JEDEC method) Maximum DC reverse current at Rated DC blocking TJ=25°C voltage TJ=100°C Typical thermal resistance, junction to ambient Typical diode junction capacitance @ f=1MHz and applied 4V reverse voltage Storage temperature Operating temperature SK12SB thru SK1BSB Symbol VRRM VRMS VR VF SK12 20 14 20 SK13 SK14 30 40 21 28 30 40 Type SK15 SK16 SK18 50 60 80 35 42 56 50 60 80 0.5 0.7 SK1B 100 70 100 0.85 Units V V V V IO 1 A IFSM 30 A IR 0.5 10 mA Rth, JA 40 °C/W CJ 120 pF Tstg TJ -55 ~ +150 -55 ~ +125 °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 2/5 Characteristic Curves SK12-SK14 SK16 SK18-SK1B SK12SB thru SK1BSB CYStek Product Specification CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 3/5 Recommended Footprint DIM A B C Inches Typ 0.142 0.059 0.118 Millimeters Typ 3.60 1.50 3.00 Ordering Information Device SK12SB SK13SB SK14SB SK15SB SK16SB SK18SB SK1BSB SK12SB thru SK1BSB Package SMB SMB SMB SMB SMB SMB SMB Shipping 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel Marking SK12 SK13 SK14 SK15 SK16 SK18 SK1B CYStek Product Specification CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 4/5 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. SK12SB thru SK1BSB CYStek Product Specification Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 5/5 CYStech Electronics Corp. SMB/DO-214AA Dimension Marking Code : SK12SB SK13SB SK12 SK13 SK14SB SK15SB SK14 SK15 SK16SB SK16 SK1BSB SK1B SK18SB SK18 SMB/DO-214AA Plastic Surface Mounted Package CYStek Package Code : SB *:Typical Inches Min. Max. 0.075 0.083 0.130 0.155 0.160 0.185 0.083 0.096 DIM A B C D Millimeters Min. Max. 1.91 2.11 3.30 3.94 4.06 4.70 2.13 2.44 DIM E F G H Inches Min. Max. 0.006 0.012 0.002 0.008 0.030 0.060 0.200 0.220 Millimeters Min. Max. 0.152 0.305 0.051 0.203 0.76 1.52 5.08 5.59 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SK12SB thru SK1BSB CYStek Product Specification