CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 1/6 1A General Purpose Rectifier DI4005SH Features • High current capability • Low power loss, high efficiency • Ultra high-speed switching • Low profile surface mounted package in order to minimize board space • Pb-free package Mechanical data •Case : Molded plastic, JEDEC SOD-123. •Epoxy : UL94-V0 rated flame retardant •Terminals : Plated terminals, solderable per MIL-STD-202 method 208 •Polarity : Indicated by cathode band •Mounting position : Any •Weight : approx. 0.04 gram Symbol Outline DI4005SH 2 (Anode) SOD-123 DI4005SH CYStek Product Specification Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Repetitive peak reverse voltage RMS voltage Continuous reverse voltage Conditions Symbol Min Single phase half wave, 60Hz @TJ=25°C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Forward rectified current Forward surge current Thermal resistance Junction to Ambient Storage temperature range Operating junction temperature range Typ Max Units VRRM 500 V VRMS 350 V VR 500 V IF(AV) 1 A IFSM 10 A RθJA °C/W 250 Tstg -55 150 °C Tj -55 150 °C Characteristics (TA=25°C, unless otherwise noted) Characteristic Symbol VR VF 1 VF 2 IR IR CJ Forward Voltage Reverse Leakage Current Junction Capacitance Condition IR=100μA Min. Typ Max. Unit 500 - - V - 5 0.9 1.25 100 10 - IF=100mA IF=1A VR=500V VR=500V, TA=125°C VR=1V, f=1MHz V nA μA pF Ordering Information Device DI4005SH-0-T1-G DI4005SH Package SOD-123 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel CYStek Product Specification CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 3/6 Typical Characteristics Power Derating Curve Forward Current vs Forward Voltage 0.6 Instantaneous Forward Current---IF (mA) 10000 Power Dissipation(W) 0.5 0.4 0.3 0.2 0.1 Pulse width=300μs, 1% Duty cycle 1000 125℃ 100 25°C 75°C 10 0℃ -40°C 1 0 0 25 50 75 100 125 150 175 0 200 Ambient Temperature---TA(℃) 0.2 0.4 0.6 0.8 1 1.2 1.4 Forward Voltage---VF(V) 1.6 1.8 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 10 1000 Junction Capacitance---C J(pF) Reverse Leakage Current---I R (nA) Tj=125℃ 100 Tj=75℃ 10 Tj=25℃ 1 Tj=0°C 0.1 Tj=25℃, f=1.0MHz Tj=-40°C 1 0.01 0 100 200 300 400 500 Reverse Voltage---VR (V) 0.1 1 10 100 Reverse Voltage---VR (V) Recommended Soldering Footprint DI4005SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension DI4005SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. DI4005SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 6/6 SOD-123 Dimension Marking: A5 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 DIM A B C Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 Style: Pin 1.Cathode 2.Anode DIM D E Inches Min. Max. 0.018 0.026 0.140 0.152 Millimeters Min. Max. 0.450 0.650 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DI4005SH CYStek Product Specification