MB8S

Spec. No. : C769H4
Issued Date : 2009.07.20
Revised Date : 2014.01.27
Page No. : 1/ 3
CYStech Electronics Corp.
Miniature Glass Passivated Single Phase Surface Mount Bridge Rectifiers
Reverse Voltage 200 to 1200 Volts
Forward Current 0.5 Ampere
TO-269AA(MBS)
MB2S thru MB12S
Features
• Plastic package has Underwriters Laboratory Flammability Classification 94V-0
• Save space on printed circuit boards
• Glass passivated chip junction
• High surge overload rating: 35A peak
Equivalent Circuit
Mechanical Data
• Case: Molded plastic body over passivated junctions
• Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
• High temperature soldering guaranteed : 260°C/10 seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg) tension
• Mounting position: Any.
• Weight: 0.22gram, 0.078 oz.
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified.)
Parameter
Symbol
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
voltage drop per leg at 0.4A
Maximum average forward output rectified current
(see Fig 1)
on glass epoxy PCB
on Aluminum substrate
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
Rating for fusing (t<8.3ms)
Maximum DC reverse current
at rated DC blocking voltage per
leg
TA=25°C
VRRM
VRMS
VDC
MB2S
200
140
200
MB4S
400
280
400
Type
MB6S MB8S MB10S MB12S
600
800
1000
1200
420
560
700
840
600
800
1000
1200
VF
1
IF(AV)
0.5
0.8
IFSM
35
Typical diode junction capacitance @f=1MHz and
applied 4V reverse voltage
Operating junction and storage temperature range
V
V
V
V
A
(Note 1)
(Note 2)
A
5
5
100
IR
TA=125°C
Typical thermal resistance per leg
Units
RθJA
RθJA
RθJL
85
70
20
μA
(Note 1)
(Note 2)
(Note 1)
°C /W
CJ
13
pF
TJ ;Tstg
-55 ~ +150
°C
Notes : 1.On glass-epoxy PCB mounted on 0.05”×0.05”(1.3mm×1.3mm) pads.
2.On aluminum substrate PCB with an area of 0.8”×0.8”(20mm×20mm) mounted on 0.05”×0.05”(1.3mm×1.3mm) solder pad.
MB2S thru MB12S
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C769H4
Issued Date : 2009.07.20
Revised Date : 2014.01.27
Page No. : 2/ 3
Ordering Information
Device
Package
TO-269AA
(Pb-free lead plating and halogen-free package)
MBXXS-0-T8-X
Shipping
750 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T8 : 750 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
Characteristic Curves
MB2S thru MB12S
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C769H4
Issued Date : 2009.07.20
Revised Date : 2014.01.27
Page No. : 3/ 3
TO-269AA Dimension
Marking :
XX
□□□□□
Date Code
Device Name
TO-269AA Plastic Surface
Mounted Package
CYStek Package Code: H4
DIM
A
B
C
D
E
F
G
H
J
Inches
Min.
Max.
0.1440 0.1610
0.0170 0.0290
0.1790 0.1950
0.0900 0.1060
0.0950 0.1050
0.0059 0.0098
0.2520 0.2720
0.0190 0.0380
0.0059 0.0161
Millimeters
Min.
Max.
3.65
4.10
0.43
0.74
4.55
4.95
2.30
2.70
2.41
2.67
0.15
0.25
6.40
6.90
0.48
0.96
0.15
0.41
DIM
K
L
M
N
P
Q
R
S
Inches
Min.
Max.
0.0063 0.0075
0.0945 0.1142
0.0539 0.0579
0.1102 0.1142
0.1949 0.2051
0.0390 0.0488
0.0579 0.0618
0.0142 0.0181
Millimeters
Min.
Max.
0.16
0.19
2.40
2.90
1.37
1.47
2.80
2.90
4.95
5.21
0.99
1.24
1.47
1.57
0.36
0.46
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MB2S thru MB12S
CYStek Product Specification