CYStech Electronics Corp. Spec. No. : C768LG Issued Date : 2009.07.20 Revised Date : Page No. : 1/3 Schottky Barrier Rectifiers Reverse Voltage 20V to 60V Forward Current 2.0 Amperes SB220 thru SB260 Features • Metal semiconductor junction with guard ring • Epitaxial construction • Low forward voltage drop • High current capability • The plastic material carries UL recognition 94V-0 • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Mechanical Characteristics: •Case: JEDEC DO-204AC(DO-15) molded plastic •Terminals: Tin plated axial leads, solderable per MIL-STD-750, method 2026 •Polarity: Color band denotes cathode •Mounting position: Any •Weight : 0.014oz., 0.39grams Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%) Parameter Symbol Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum forward voltage at 2A Maximum forward voltage at 1.5A Maximum average forward rectified current @ TA=75°C Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) TJ=25°C Maximum DC reverse current at rated DC blocking voltage TJ=100°C VRRM VRMS VDC Typical thermal resistance (Note 1) Typical junction capacitance (Note 2) Operating junction temperature range Storage temperature range RθJA CJ TJ TSTG VF Type Units SB220 SB230 SB240 SB250 SB260 20 30 40 50 60 V 14 21 28 35 42 V 20 30 40 50 60 V 0.55 0.70 V 0.65 IF(AV) 2 A IFSM 60 A IR 0.5 15 20 150 -55 ~ +125 -55 ~ +150 mA °C/W pF °C °C Note: 1.Thermal resistance, junction to ambient. 2.Measured at1.0MHz and applied reverse voltage of 4.0VDC SB220 thru SB260 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C768LG Issued Date : 2009.07.20 Revised Date : Page No. : 2/3 Characteristic Curves SB220 thru SB260 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C768LG Issued Date : 2009.07.20 Revised Date : Page No. : 3/3 DO-204AC(DO-15) Dimension E A B C D *:Typical DIM A B C Inches Min. Max. φ0.028 φ0.034 1.000 0.2300 0.3000 Millimeters Min. Max. φ0.70 φ0.90 25.40 5.80 7.60 DIM D E Inches Min. Max. 1.000 φ0.104 φ0.140 Millimeters Min. Max. 25.40 φ2.60 φ3.60 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SB220 thru SB260 CYStek Product Specification