SK340SC

CYStech Electronics Corp.
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2015.05.19
Page No. : 1/ 6
3.0Amp. Surface Mount Schottky Barrier Diodes
SK320SC-SK3150SC Series
Features
 For surface mounted applications.
 For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
 Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
 Low leakage current
 High surge capability
 High temperature soldering: 250C/10 seconds at terminals
 Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
 Case: Molded plastic, SMC/JEDEC DO-214AB.
 Terminals: Solder plated, solderable per MIL-STD-750 method 2026
 Polarity: Indicated by cathode band.
 Mounting Position : Any.
 Weight: 0.195 gram, 0.00585 ounce
Ordering Information
Device
SK320SC- 0-T6-G
SK340SC- 0-T6-G
SK360SC- 0 -T6-G
SK3100SC-0-T6-G
SK3150SC-0-T6-G
Package
Shipping
SMC
(Pb-free lead plating and halogen-free
package)
3000 pcs / Tape & Reel
Marking
SK32
SK34
SK36
S310
S315
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T6 : 3000 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK320SC-SK3150SC
CYStek Product Specification
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2015.05.19
Page No. : 2/ 6
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified. )
Parameter
Symbol
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, IF=3A
Average forward rectified current
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
Maximum DC reverse current
VR=VRRM,TA=25℃
VR=VRRM,TA=125℃
Maximum thermal resistance, Junction to ambient
Maximum thermal resistance, Junction to lead
Diode junction capacitance @ f=1MHz and applied
4VDC reverse voltage
Storage temperature
Operating temperature
VRRM
VRMS
VR
VF
Type
Units
SK320 SK340 SK360 SK3100 SK3150
20
40
60
100
150
V
14
28
42
70
105
V
20
40
60
100
150
V
0.50
0.50
0.7
0.85
0.9
V
IO
3
A
IFSM
80
A
IR
0.5
50
55
17 (Note)
Rth,JA
Rth,JL
CJ
Tstg
TJ
250(typ)
-55 ~ +125
-55 ~ +150
-55 ~ +150
mA
mA
℃/W
pF
℃
℃
Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area.
Recommended soldering footprint
SK320SC-SK3150SC
CYStek Product Specification
Peak F or w ar d Su rg e C ur r en t- - - I F SM( A )
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
Average Forward Current---Io(A)
3.5
3
SK360-3150
2.5
2
1.5
SK320-340
1
0.5
Maxim um Non-Repetitive Forward Surge Cur
90
80
Tj=25℃, 8. 3ms Single Ha lf
Sine Wave
JEDEC me thod
70
60
50
40
30
20
10
0
0
0
50
100
150
1
200
10
100
Number of Cycles at 60Hz
Ambient Temperature---TA(℃)
Forward Current vs Forward Voltage
Junction Capacitance vs Reverse Voltage
700
100
Junction Capacitance---CJ(pF)
SK320-340
Forward Current---IF(A)
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2015.05.19
Page No. : 3/ 6
SK360
10
1
SK3100-3150
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.1
0.01
0.1
0.3
0.5
0.7
0.9
1.1
Forward Voltage---VF(V)
1.3
1.5
600
500
400
300
200
100
0
0.01
0.1
1
10
100
Reverse Voltage---VR(V)
Reverse Leakage Current vs Reverse Voltage
Reverse Leakage Current---IR(m A)
100
10
1
Tj=75℃
0.1
Tj=25℃
0.01
0
20
40
60
80
100
120
140
Percent of Rated Peak Reverse Voltage---(%)
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2015.05.19
Page No. : 4/ 6
Reel Dimension
Carrier Tape Dimension
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2015.05.19
Page No. : 5/ 6
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2015.05.19
Page No. : 6/ 6
DO-214AB/SMC Dimension
DO-214AB/SMC Plastic
Surface Mounted Package
CYStek Package Code : SC
*:Typical
Inches
Min.
Max.
0.110
0.126
0.220
0.245
0.260
0.283
0.078
0.103
DIM
A
B
C
D
Millimeters
Min.
Max.
2.80
3.20
5.59
6.22
6.60
7.20
1.98
2.62
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.002
0.008
0.030
0.060
0.305
0.320
Millimeters
Min.
Max.
0.15
0.31
0.05
0.20
0.76
1.52
7.75
8.13
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
 Lead : Pure tin plated.
 Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK320SC-SK3150SC
CYStek Product Specification