Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 1/7 CYStech Electronics Corp. P-Channel Enhancement Mode Power MOSFET MTP452L3 BVDSS RDSON(MAX) ID -30V 55mΩ -6A Features • Simple Drive Requirement • Low On-resistance • Fast switching Characteristic • Pb-free lead plating package Symbol Outline SOT-223 MTP452L3 D S G：Gate D：Drain S：Source D G Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TA=25°C Continuous Drain Current @ TA=70°C Pulsed Drain Current Total Power Dissipation (TA=25℃) Linear Derating Factor Operating Junction and Storage Temperature Thermal Resistance, Junction-to-ambient, max Note : *1. Pulse width limited by maximum junction temperature Symbol VDS VGS ID ID IDM Pd Tj, Tstg Rth,j-a Limits -30 ±20 -6.0 *1 -4.8 *1 -20 *1 2.7 0.02 -55~+150 45 *2 Unit V V A A A W W/°C °C °C/W *2. Surface mounted on 1 in² copper pad of FR-4 board; 120°C/W when mounted on minimum copper pad MTP452L3 CYStek Product Specification Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 2/7 CYStech Electronics Corp. Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Static BVDSS -30 ΔBVDSS/ΔTj VGS(th) -1.0 GFS IGSS IDSS IDSS *RDS(ON) *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *VSD *trr *Qrr - Typ. Max. Unit Test Conditions -0.02 10 45 75 -3.0 ±100 -1 -25 55 100 V V/°C V S nA μA μA mΩ mΩ VGS=0, ID=-250μA Reference to 25°C, ID=-1mA VDS = VGS, ID=-250μA VDS =-10V, ID=-5.3A VGS=±20 VDS =-30V, VGS =0 VDS =-24V, VGS =0, Tj=70°C VGS =-10V, ID=-5.3A VGS =-4.5V, ID=-4.2A 9.2 2.8 5.2 11 8 25 17 507 222 158 16 912 - 29 20 -1.2 - nC ID=-5.3A, VDS=-24V, VGS=-4.5V ns VDS=-15V, ID=-1A,VGS=-10V, RG=6Ω, RD=15Ω pF VGS=0V, VDS=-15V, f=1MHz V ns nC IS=-2.3A, VGS=0V IS=-5.3A, VGS=0, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device MTP452L3 MTP452L3 Package SOT-223 (Pb-free lead plating package) Shipping Marking 2500 pcs / Tape & Reel 452 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 3/7 Typical Characteristics MTP452L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 4/7 Typical Characteristics(Cont.) MTP452L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 5/7 Reel Dimension Carrier Tape Dimension MTP452L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTP452L3 CYStek Product Specification Spec. No. : C400L3 Issued Date : 2009.06.22 Revised Date : Page No. : 7/7 CYStech Electronics Corp. SOT-223 Dimension A Marking: Device Name B C 1 2 Date Code 452 □□□□ 3 D E Style: Pin 1.Gate 2.Drain 3.Source F H G a1 I a2 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 *: Typical Inches Min. Max. 0.1142 0.1220 0.2638 0.2874 0.1299 0.1457 0.0236 0.0315 *0.0906 0.2480 0.2638 DIM A B C D E F Millimeters Min. Max. 2.90 3.10 6.70 7.30 3.30 3.70 0.60 0.80 *2.30 6.30 6.70 DIM G H I a1 a2 Inches Min. Max. 0.0551 0.0709 0.0098 0.0138 0.0008 0.0039 *13o 0o 10 o Millimeters Min. Max. 1.40 1.80 0.25 0.35 0.02 0.10 *13o 0o 10 o Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTP452L3 CYStek Product Specification