Spec. No. : C776SA Issued Date : 2011.04.19 Revised Date : Page No. : 1/3 CYStech Electronics Corp. Surface Mount Glass Passivated Rectifiers Reverse Voltage 50V to 1000V Forward Current 1.0A GN1A thru GN1M Features Outline • For surface mounted applications • Glass passivated junction chip • Low profile package • Built-in stain relief, ideal for automatic placement • High temperature soldering: 250°C/10 seconds at terminals • Plastic material used carries UL flammability classification 94V-0 DO-214AC (SMA) Mechanical Data • Case: JEDEC DO-214AC(SMA) molded plastic over glass passivated chip • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026 • Polarity: Color band denotes cathode end • Weight: 0.064 gram, 0.002 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. inductive load. Single phase, half wave, 60Hz, resistive or For capacitive load, derate current by 20%. ) Parameter Symbol Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=1A Maximum average forward rectified current, see Fig. 1 Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) TL=110°C Maximum DC reverse current at TA=25°C Rated DC blocking voltage TA=125°C Typical reverse recovery time (Note 1) Typical junction capacitance @ f=1MHz and applied 4V reverse voltage Typical thermal resistance (Note 2) Operating junction and Storage temperature range VRRM VRMS VR VF Type Units GN1A GN1B GN1D GN1G GN1J GN1K GN1M 50 100 200 400 600 800 1000 V 35 70 140 280 420 700 V 560 50 100 200 400 600 800 1000 V 1.1 V IF(AV) IFSM IR 1 40 30 1 5 trr 50 1 CJ 12 RθJA RθJL TJ;TSTG A 75 27 A μA μs pF 85 30 -55 ~ +150 °C/W ℃ Note: 1.Reverse recovery test conditions : IF=0.5A, IR=1A, IRR=0.25A 2.Thermal resistance from junction to ambient and from junction to lead mounted on PCB with 0.2”×0.2”(5mm×5mm) copper pad areas. GN1A thru GN1M CYStek Product Specification CYStech Electronics Corp. Spec. No. : C776SA Issued Date : 2011.04.19 Revised Date : Page No. : 2/3 Ratings and Characteristic Curves GN1A thru GN1M CYStek Product Specification CYStech Electronics Corp. Spec. No. : C776SA Issued Date : 2011.04.19 Revised Date : Page No. : 3/3 DO-214AC/SMA Dimension DO-214AC/SMA Plastic Surface Mounted Package CYStek Package Code : SA Inches Min. Max. 0.050 0.064 0.095 0.104 0.157 0.181 0.075 0.089 DIM A B C D Millimeters Min. Max. 1.27 1.63 2.40 2.65 4.00 4.60 1.90 2.25 DIM E F G H Inches Min. Max. 0.006 0.012 0.004 0.008 0.031 0.059 0.189 0.205 Millimeters Min. Max. 0.15 0.31 0.10 0.20 0.80 1.50 4.80 5.20 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. GN1A thru GN1M CYStek Product Specification