CYStech Electronics Corp. Spec. No. : C302Y2 Issued Date : 2010.08.12 Revised Date : Page No. : 1/6 Small Signal Schottky diode RB521G-30Y2 Description Planar silicon Schottky barrier diode encapsulated in a SOD-723 plastic SMD package. Features •Extremely small surface mounting type.(SOD-723) •Low VF. •High reliability •Pb-free lead plating and halogen-free package Applications Low current rectification and high speed switching Symbol Outline SOD-723 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg..................................................................................................... -40~+125°C Junction Temperature Tj .............................................................................................................. +125°C • Maximum Voltages and Currents (Ta=25°C) DC Reverse Voltage VR ...................................................................................................................... 40 V Mean Rectifying Current IO ......................................................................................................... 100 mA Peak Forward Surge Current IFSM………………………………….. ……………………………………………1 A RB521G-30Y2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302Y2 Issued Date : 2010.08.12 Revised Date : Page No. : 2/6 Characteristics (Ta=25°C) Characteristic Symbol Reverse Breakdown Voltage VR Forward Voltage VF Reverse Leakage Current IR Condition Min. Max. Unit IR=500μA 40 - V IF=10mA - 340 IF=100mA - 480 VR=10V - 10 μA VR=20V - 15 μA mV Ordering Information Device RB521G-30Y2 RB521G-30Y2 Package SOD-723 (Pb-free lead plating and halogen-free package) Shipping Marking 8000 pcs / Tape & Reel F CYStek Product Specification Spec. No. : C302Y2 Issued Date : 2010.08.12 Revised Date : Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Forward Current vs Forward Voltage Forward Current Derating Curve 1000 M ounting on glass epoxy PCBs 100 125℃ 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 20 75℃ 10 25℃ 1 0.1 - 25℃ 0.01 0 0.001 0 25 50 75 100 125 150 0 0.1 0.3 0.4 0.5 0.6 Forward Voltage---VF(V) Ambient Temperature---TA(℃) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 10 1 Capacitance between terminals---C T(pF) 10 Reverse Leakage Current---I R(mA) 0.2 T a= 125℃ 0.1 T a= 75℃ 0.01 T a= 25℃ 0.001 f=1MHz Ta=25℃ 1 0.0001 0 10 20 Reverse Voltage---VR(V) RB521G-30Y2 30 0 2 4 6 8 10 12 14 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302Y2 Issued Date : 2010.08.12 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension RB521G-30Y2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302Y2 Issued Date : 2010.08.12 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. RB521G-30Y2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302Y2 Issued Date : 2010.08.12 Revised Date : Page No. : 6/6 SOD-723 Dimension Marking Code : 1 1 2 F 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-723 Plastic Package CYStek Package Code : Y2 *: Typical Millimeters Min. Max. 0.525 0.650 0.515 0.580 0.250 0.350 0.080 0.150 0.550 0.650 DIM A A1 b c D Inches Min. Max. 0.021 0.026 0.020 0.023 0.010 0.014 0.003 0.006 0.022 0.026 DIM Min. E E1 E2 L θ Millimeters Min. Max. 0.900 1.100 1.300 1.500 0.200 REF 0.010 0.070 7° REF Inches Min. Max. 0.035 0.043 0.051 0.059 0.008 REF 0.001 0.003 7° REF Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB521G-30Y2 CYStek Product Specification